| Patent | Date |
|---|
Stacked semiconductor packages
Grant 10,593,652 - Kwon , et al. | 2020-03-17 |
Stacked Semiconductor Packages, Methods Of Fabricating The Same, And/or Systems Employing The Same
App 20190319012 - KWON; Heung-Kyu ; et al. | 2019-10-17 |
Method of fabricating a semiconductor package
Grant 10,403,606 - Kwon , et al. Sep | 2019-09-03 |
Stacked Semiconductor Packages, Methods Of Fabricating The Same, And/or Systems Employing The Same
App 20180331071 - KWON; Heung-Kyu ; et al. | 2018-11-15 |
Semiconductor package and method for routing the package
Grant 10,056,321 - Kwon , et al. August 21, 2 | 2018-08-21 |
System module and mobile computing device including the same
Grant 10,025,354 - Kwon July 17, 2 | 2018-07-17 |
System on package (SoP) having through silicon via (TSV) interposer with memory controller connected to multiple printed circuit boards (PCB)
Grant 9,984,032 - Kwon May 29, 2 | 2018-05-29 |
Apparatus for stacked semiconductor packages and methods of fabricating the same
Grant 9,978,721 - Kwon , et al. May 22, 2 | 2018-05-22 |
System of package (SoP) module and mobile computing device having the SoP
Grant 9,839,127 - Kwon , et al. December 5, 2 | 2017-12-05 |
Package on packages and mobile computing devices having the same
Grant 9,811,122 - Kwon November 7, 2 | 2017-11-07 |
System Module And Mobile Computing Device Including The Same
App 20170185107 - KWON; HEUNG KYU | 2017-06-29 |
Semiconductor device having markings and package on package including the same
Grant 9,665,122 - Kwon , et al. May 30, 2 | 2017-05-30 |
Semiconductor chip, flip chip package and wafer level package including the same
Grant 9,640,499 - Kwon May 2, 2 | 2017-05-02 |
Stacked semiconductor package including connections electrically connecting first and second semiconductor packages
Grant 9,601,458 - Kwon , et al. March 21, 2 | 2017-03-21 |
System On Package
App 20170068633 - KWON; HEUNG KYU | 2017-03-09 |
Semiconductor Packages And Methods Of Manufacturing Semiconductor Packages
App 20170012025 - KWON; Heung-Kyu ; et al. | 2017-01-12 |
Stacked Semiconductor Packages, Methods For Fabricating The Same, And/or Systems Employing The Same
App 20160358893 - KWON; Heung-Kyu ; et al. | 2016-12-08 |
Semiconductor Chip, Flip Chip Package And Wafer Level Package Including The Same
App 20160284655 - KWON; Heung Kyu | 2016-09-29 |
Package On Packages And Mobile Computing Devices Having The Same
App 20160161992 - KWON; Heung Kyu | 2016-06-09 |
SYSTEM OF PACKAGE (SoP) MODULE AND MOBILE COMPUTING DEVICE HAVING THE SoP
App 20160113115 - KWON; HEUNG KYU ; et al. | 2016-04-21 |
Package On Package And Computing Device Including The Same
App 20160099205 - KWON; HEUNG KYU ; et al. | 2016-04-07 |
Stacked Semiconductor Packages, Methods For Fabricating The Same, And /or Systems Employing The Same
App 20150228627 - KWON; Heung-Kyu ; et al. | 2015-08-13 |
Semiconductor packages having warpage compensation
Grant 9,048,168 - Kwon , et al. June 2, 2 | 2015-06-02 |
Stacked semiconductor packages
Grant 9,042,115 - Kwon , et al. May 26, 2 | 2015-05-26 |
Stack packages having fastening element and halogen-free inter-package connector
Grant 9,040,351 - Kwon , et al. May 26, 2 | 2015-05-26 |
Semiconductor devices, package substrates, semiconductor packages, package stack structures, and electronic systems having functionally asymmetric conductive elements
Grant 8,981,581 - Kwon , et al. March 17, 2 | 2015-03-17 |
Semiconductor packages including a plurality of upper semiconductor devices on a lower semiconductor device
Grant 8,963,308 - Kwon , et al. February 24, 2 | 2015-02-24 |
Stack Packages Having Fastening Element And Halogen-free Inter-package Connector
App 20140335657 - KWON; HEUNG-KYU ; et al. | 2014-11-13 |
Application Processor And Dynamic Thermal Management Method Thereof
App 20140324245 - KWON; HEUNG-KYU ; et al. | 2014-10-30 |
Semiconductor package having multi pitch ball land
Grant 8,817,486 - Kim , et al. August 26, 2 | 2014-08-26 |
Stacked Semiconductor Package Including Connections Electrically Connecting First And Second Semiconductor Packages
App 20140193951 - Kwon; Heung-kyu ; et al. | 2014-07-10 |
Semiconductor Devices, Package Substrates, Semiconductor Packages, Package Stack Structures, And Electronic Systems Having Functionally Asymmetric Conductive Elements
App 20140175679 - KWON; HEUNG-KYU ; et al. | 2014-06-26 |
Semiconductor Packages Including A Plurality Of Upper Semiconductor Devices On A Lower Semiconductor Device
App 20140167260 - Kwon; Heung-Kyu ; et al. | 2014-06-19 |
Semiconductor Package And Method For Routing The Package
App 20140159237 - KWON; Heung-Kyu ; et al. | 2014-06-12 |
Stacked semiconductor package including connections electrically connecting first and second semiconductor packages
Grant 8,716,872 - Kwon , et al. May 6, 2 | 2014-05-06 |
Semiconductor packages including a plurality of upper semiconductor devices on a lower semiconductor device
Grant 8,698,301 - Kwon , et al. April 15, 2 | 2014-04-15 |
Semiconductor devices, package substrates, semiconductor packages, package stack structures, and electronic systems having functionally asymmetric conductive elements
Grant 8,680,667 - Kwon , et al. March 25, 2 | 2014-03-25 |
Semiconductor Packages Having Warpage Compensation
App 20140077382 - Kwon; Heung-kyu ; et al. | 2014-03-20 |
Semiconductor packages having passive elements mounted thereonto
Grant 08618671 - | 2013-12-31 |
Semiconductor packages having passive elements mounted thereonto
Grant 8,618,671 - Kwon , et al. December 31, 2 | 2013-12-31 |
Stacked Semiconductor Package Having Electrical Connections Of Varying Heights Between Substrates, And Semiconductor Device Including The Stacked Semiconductor Package
App 20130334708 - Kwon; Heung-kyu ; et al. | 2013-12-19 |
Semiconductor packages having warpage compensation
Grant 8,604,614 - Kwon , et al. December 10, 2 | 2013-12-10 |
Stacked Semiconductor Packages
App 20130292828 - KWON; Heung-Kyu ; et al. | 2013-11-07 |
Semiconductor Packages And Methods Of Manufacturing Semiconductor Packages
App 20130256916 - KWON; Heung-Kyu ; et al. | 2013-10-03 |
Stacked semiconductor package having electrical connections or varying heights between substrates, and semiconductor device including the stacked semiconductor package
Grant 8,546,954 - Kwon , et al. October 1, 2 | 2013-10-01 |
Semiconductor Package Having Heat Spreader And Method Of Forming The Same
App 20130208426 - Kim; Jae-Choon ; et al. | 2013-08-15 |
Systems employing a stacked semiconductor package
Grant 8,508,954 - Kwon , et al. August 13, 2 | 2013-08-13 |
Semiconductor Package Having Multi Pitch Ball Land
App 20130154103 - KIM; Tong-Suk ; et al. | 2013-06-20 |
Semiconductor Packages Including A Plurality Of Upper Semiconductor Devices On A Lower Semiconductor Device
App 20130099373 - KWON; Heung-Kyu ; et al. | 2013-04-25 |
Semiconductor package having multi pitch ball land
Grant 8,400,779 - Kim , et al. March 19, 2 | 2013-03-19 |
Semiconductor Devices, Package Substrates, Semiconductor Packages, Package Stack Structures, And Electronic Systems Having Functionally Asymmetric Conductive Elements
App 20130043584 - KWON; HEUNG-KYU ; et al. | 2013-02-21 |
Semiconductor Stack Package Apparatus
App 20130009308 - KWON; Heung-Kyu | 2013-01-10 |
Stack Packages Having Fastening Element And Halogen-free Inter-package Connector
App 20120280404 - Kwon; Heung-Kyu ; et al. | 2012-11-08 |
Stacked Semiconductor Package, Semiconductor Device Including The Stacked Semiconductor Package And Method Of Manufacturing The Stacked Semiconductor Package
App 20120091597 - Kwon; Heung-kyu ; et al. | 2012-04-19 |
Semiconductor Packages Having Warpage Compensation
App 20110233771 - Kwon; Heung-kyu ; et al. | 2011-09-29 |
Stack package, a method of manufacturing the stack package, and a digital device having the stack package
Grant 7,994,643 - Kwon , et al. August 9, 2 | 2011-08-09 |
Stacked Semiconductor Packages, Methods Of Fabricating The Same, And/or Systems Employing The Same
App 20110149493 - Kwon; Heung-Kyu ; et al. | 2011-06-23 |
Semiconductor Package Having Multi Pitch Ball Land
App 20110116247 - KIM; Tong-Suk ; et al. | 2011-05-19 |
Stack semiconductor package including an interposer chip having an imposed diode or capacitor
Grant 7,928,555 - Kim , et al. April 19, 2 | 2011-04-19 |
Semiconductor Packages Having Passive Elements Mounted Thereonto
App 20110084380 - Kwon; Heung-kyu ; et al. | 2011-04-14 |
Vertical stack type multi-chip package having improved grounding performance and lower semiconductor chip reliability
Grant 7,868,443 - Kwon , et al. January 11, 2 | 2011-01-11 |
High-power ball grid array package, heat spreader used in the BGA package and method for manufacturing the same
Grant 7,812,442 - Kwon , et al. October 12, 2 | 2010-10-12 |
Wiring substrate having variously sized ball pads, semiconductor package having the wiring substrate, and stack package using the semiconductor package
Grant 7,795,743 - Kim , et al. September 14, 2 | 2010-09-14 |
Method for fabricating a flip chip system in package
Grant 7,776,650 - Kwon , et al. August 17, 2 | 2010-08-17 |
Vertical Stack Type Multi-chip Package Having Improved Grounding Performance And Lower Semiconductor Chip Reliability
App 20100044852 - KWON; Heung-kyu ; et al. | 2010-02-25 |
Semiconductor package with heat sink, stack package using the same and manufacturing method thereof
App 20090317947 - Kwon; Heung-kyu ; et al. | 2009-12-24 |
Hybrid Electronic Device Including Semiconductor Chip And Fuel Cell, Method Of Fabricating The Same And System Having The Same
App 20090286108 - KIM; Sang-Uk ; et al. | 2009-11-19 |
Vertical stack type multi-chip package having improved grounding performance and lower semiconductor chip reliability
Grant 7,615,415 - Kwon , et al. November 10, 2 | 2009-11-10 |
Bonding configurations for lead-frame-based and substrate-based semiconductor packages
Grant 7,566,954 - Jang , et al. July 28, 2 | 2009-07-28 |
Method For Fabricating A Flip Chip System In Package
App 20090181498 - Kwon; Heung-Kyu ; et al. | 2009-07-16 |
Semiconductor device package
Grant 7,541,680 - Kwon , et al. June 2, 2 | 2009-06-02 |
Method for fabricating a flip chip system in package
Grant 7,517,723 - Kwon , et al. April 14, 2 | 2009-04-14 |
Stack package, a method of manufacturing the stack package, and a digital device having the stack package
App 20080246162 - Kwon; Heung-Kyu ; et al. | 2008-10-09 |
Semiconductor Packages And Method Of Manufacturing The Same
App 20080211078 - KWON; Heung-Kyu ; et al. | 2008-09-04 |
Method Of Manufacturing Multi-stack Package
App 20080138934 - KIM; Se-Nyun ; et al. | 2008-06-12 |
Stacked semiconductor package, method of fabrication, and method of wire-bond monitoring
App 20080067659 - Kim; Tae-hun ; et al. | 2008-03-20 |
Vertical Stack Type Multi-chip Package Having Improved Grounding Performance And Lower Semiconductor Chip Reliability
App 20080029869 - KWON; Heung-kyu ; et al. | 2008-02-07 |
Semiconductor device package
Grant 7,327,038 - Kwon , et al. February 5, 2 | 2008-02-05 |
Multi-chip package including at least one semiconductor device enclosed therein
Grant 7,327,020 - Kwon , et al. February 5, 2 | 2008-02-05 |
High-power Ball Grid Array Package, Heat Spreader Used In The Bga Package And Method For Manufacturing The Same
App 20070258215 - KWON; Heung-Kyu ; et al. | 2007-11-08 |
High-power ball grid array package, heat spreader used in the BGA package and method for manufacturing the same
Grant 7,258,808 - Kwon , et al. August 21, 2 | 2007-08-21 |
Method for fabricating a flip chip system in package
App 20070161153 - Kwon; Heung-Kyu ; et al. | 2007-07-12 |
Wiring Substrate Having Variously Sized Ball Pads, Semiconductor Package Having The Wiring Substrate, And Stack Package Using The Semiconductor Package
App 20070152350 - Kim; Tae-Hun ; et al. | 2007-07-05 |
Semiconductor package with heat sink, stack package using the same and manufacturing method thereof
App 20070114677 - Kwon; Heung-Kyu ; et al. | 2007-05-24 |
Semiconductor wafer having electrically connected passive device chips, passive devices and semiconductor package using the same
Grant 7,211,469 - Kwon May 1, 2 | 2007-05-01 |
Semiconductor device package
App 20070045828 - Kwon; Heung-kyu ; et al. | 2007-03-01 |
Semiconductor package
Grant 7,078,800 - Kwon , et al. July 18, 2 | 2006-07-18 |
Semiconductor device package
App 20060138624 - Kwon; Heung-Kyu ; et al. | 2006-06-29 |
Multi-chip package
App 20060102992 - Kwon; Heung-Kyu ; et al. | 2006-05-18 |
Method for manufacturing flip chip package devices with a heat spreader
Grant 7,005,320 - Kwon February 28, 2 | 2006-02-28 |
Bonding configurations for lead-frame-based and substrate-based semiconductor packages and method of fabrication thereof
App 20060017142 - Jang; Kyung Lae ; et al. | 2006-01-26 |
Semiconductor wafer having electrically connected passive device chips, passive devices and semiconductor package using the same
App 20050272226 - Kwon, Heung Kyu | 2005-12-08 |
Semiconductor package having a first conductive bump and a second conductive bump and methods for manufacturing the same
App 20050242426 - Kwon, Heung-Kyu ; et al. | 2005-11-03 |
Method of manufacturing multi-stack package
App 20050233567 - Kim, Se-Nyun ; et al. | 2005-10-20 |
Semiconductor package
Grant 6,952,050 - Kwon , et al. October 4, 2 | 2005-10-04 |
Multi-chip package
App 20050200003 - Yoon, Ki-myung ; et al. | 2005-09-15 |
Semiconductor wafer having electrically connected passive device chips, passive devices and semiconductor package using the same
Grant 6,943,430 - Kwon September 13, 2 | 2005-09-13 |
Multi-chip package, a semiconductor device used therein and manufacturing method thereof
App 20050194673 - Kwon, Heung-Kyu ; et al. | 2005-09-08 |
Chip scale packages manufactured at wafer level
Grant 6,903,451 - Kim , et al. June 7, 2 | 2005-06-07 |
Die bonding apparatus and method for bonding semiconductor chip using the same
App 20050081986 - Kwon, Heung-Kyu ; et al. | 2005-04-21 |
Semiconductor package
App 20050056928 - Kwon, Heung-Kyu ; et al. | 2005-03-17 |
Semiconductor wafer having electrically connected passive device chips, passive devices and semiconductor package using the same
App 20040012081 - Kwon, Heung Kyu | 2004-01-22 |
High-power ball grid array package, heat spreader used in the BGA package and method for manufacturing the same
App 20040012928 - Kwon, Heung-Kyu ; et al. | 2004-01-22 |
Semiconductor chip package having one or more sealing screws
Grant 6,608,380 - Ro , et al. August 19, 2 | 2003-08-19 |
Semiconductor package
App 20030067070 - Kwon, Heung-Kyu ; et al. | 2003-04-10 |
Method for manufacturing flip chip package devices with a heat spreader
App 20030047814 - Kwon, Heung Kyu | 2003-03-13 |
Semiconductor packages
App 20020113306 - Kwon, Heung Kyu ; et al. | 2002-08-22 |
Semiconductor Chip Package And Method Of Fabricating The Same
App 20020056909 - KWON, HEUNG-KYU ; et al. | 2002-05-16 |
Semiconductor chip package and manufacturing method thereof
App 20020041018 - Ro, Young-Hoon ; et al. | 2002-04-11 |
Chip scale packages and methods for manufacturing the chip scale packages at wafer level
Grant 6,187,615 - Kim , et al. February 13, 2 | 2001-02-13 |
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