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Patent applications and USPTO patent grants for Kwok; John Chi Hee.The latest application filed is for "polymer blend composition and articles thereof".
Patent | Date |
---|---|
Polymer Blend Composition And Articles Thereof App 20080081137 - Kwok; John Chi Hee ;   et al. | 2008-04-03 |
Styrenic resin composition and articles produced therefrom Grant 7,294,676 - Kwok , et al. November 13, 2 | 2007-11-13 |
Multilayer thermoplastic film structures App 20070218228 - Kwok; John Chi Hee ;   et al. | 2007-09-20 |
Rubber modified styrenic copolymers and their use in disposable card applications Grant 7,223,460 - Kwok , et al. May 29, 2 | 2007-05-29 |
Rubber modified styrenic copolymers and their use in forming oriented articles App 20070043169 - Kwok; John Chi Hee ;   et al. | 2007-02-22 |
Multilayer coextrusions Grant 7,135,234 - Donnelly , et al. November 14, 2 | 2006-11-14 |
Rubber modified styrenic copolymers and their use in disposable card applications App 20060155063 - Kwok; John Chi Hee ;   et al. | 2006-07-13 |
Styrenic resin composition and articles produced therefrom App 20050020756 - Kwok, John Chi Hee ;   et al. | 2005-01-27 |
Multilayer coextrusions App 20040253468 - Donnelly, Karen D. ;   et al. | 2004-12-16 |
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