loadpatents
name:-0.008882999420166
name:-0.0032758712768555
name:-0.00043797492980957
Kwok; John Chi Hee Patent Filings

Kwok; John Chi Hee

Patent Applications and Registrations

Patent applications and USPTO patent grants for Kwok; John Chi Hee.The latest application filed is for "polymer blend composition and articles thereof".

Company Profile
0.3.6
  • Kwok; John Chi Hee - Moon Township PA
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Polymer Blend Composition And Articles Thereof
App 20080081137 - Kwok; John Chi Hee ;   et al.
2008-04-03
Styrenic resin composition and articles produced therefrom
Grant 7,294,676 - Kwok , et al. November 13, 2
2007-11-13
Multilayer thermoplastic film structures
App 20070218228 - Kwok; John Chi Hee ;   et al.
2007-09-20
Rubber modified styrenic copolymers and their use in disposable card applications
Grant 7,223,460 - Kwok , et al. May 29, 2
2007-05-29
Rubber modified styrenic copolymers and their use in forming oriented articles
App 20070043169 - Kwok; John Chi Hee ;   et al.
2007-02-22
Multilayer coextrusions
Grant 7,135,234 - Donnelly , et al. November 14, 2
2006-11-14
Rubber modified styrenic copolymers and their use in disposable card applications
App 20060155063 - Kwok; John Chi Hee ;   et al.
2006-07-13
Styrenic resin composition and articles produced therefrom
App 20050020756 - Kwok, John Chi Hee ;   et al.
2005-01-27
Multilayer coextrusions
App 20040253468 - Donnelly, Karen D. ;   et al.
2004-12-16

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