KWOK; Chi Hang
Patent Applications and Registrations
Patent applications and USPTO patent grants for KWOK; Chi Hang.The latest application filed is for "radiative wafer cutting using selective focusing depths".
- KWOK; Chi Hang - Hong Kong HK
- KWOK; Chi Hang - New Territories HK
- Kwok; Chi Hang - Tsing Yi.N.T. HK
| Patent | Date |
|---|---|
| Radiative Wafer Cutting Using Selective Focusing Depths App 20190067049 - CHENG; Chi Wah ; et al. | 2019-02-28 |
| Laser apparatus for singulation, and a method of singulation Grant 8,742,288 - Kwok , et al. June 3, 2 | 2014-06-03 |
| Laser processing method and apparatus Grant 8,709,916 - Kwok , et al. April 29, 2 | 2014-04-29 |
| Laser Processing Method And Apparatus App 20140011336 - KWOK; Chi Hang ; et al. | 2014-01-09 |
| Laser Apparatus For Singulation, And A Method Of Singulation App 20120318777 - KWOK; Chi Hang ; et al. | 2012-12-20 |
| Method And Apparatus For Providing A Line Of Spots Launch Of Light Into An End Of A Multimode Optical Fiber App 20120251105 - Kwok; Chi Hang ; et al. | 2012-10-04 |
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