KWANG; LIM YUAN
Patent Applications and Registrations
Patent applications and USPTO patent grants for KWANG; LIM YUAN.The latest application filed is for "die-casting system with enhanced adherence shot sleeve pour liner".
- KWANG; LIM YUAN - Singapore SG
| Patent | Date |
|---|---|
| Die-casting System With Enhanced Adherence Shot Sleeve Pour Liner App 20160311015 - KWANG; LIM YUAN ; et al. | 2016-10-27 |
| Die-casting System With A Refractory Metal Alloy Surface App 20160296997 - KWANG; LIM YUAN ; et al. | 2016-10-13 |
| Die-casting System With Bonded Ceramic Shot Tip App 20160297000 - KWANG; LIM YUAN ; et al. | 2016-10-13 |
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