Kwang; Chua Swee

Patent Applications and Registrations

Patent applications and USPTO patent grants for Kwang; Chua Swee.The latest application filed is for "method for packaging circuits".

Company Profile

2.26.33

Kwang; Chua Swee - Singapore SG

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Method for packaging circuits Grant 10,811,278 - Poo , et al. October 20, 2	2020-10-20
Method For Packaging Circuits App 20190362988 - Poo; Chia Y. ; et al.	2019-11-28
Method for packaging circuits Grant 10,453,704 - Poo , et al. Oc	2019-10-22
Semiconductor dies with recesses, associated leadframes, and associated systems and methods Grant 10,431,531 - Kwang , et al. O	2019-10-01
Semiconductor Dies With Recesses, Associated Leadframes, And Associated Systems And Methods App 20180350730 - Kwang; Chua Swee ; et al.	2018-12-06
Semiconductor dies with recesses, associated leadframes, and associated systems and methods Grant 10,074,599 - Kwang , et al. September 11, 2	2018-09-11
Semiconductor Dies With Recesses, Associated Leadframes, And Associated Systems And Methods App 20170278775 - Kwang; Chua Swee ; et al.	2017-09-28
Semiconductor dies with recesses, associated leadframes, and associated systems and methods Grant 9,679,834 - Kwang , et al. June 13, 2	2017-06-13
Semiconductor Dies With Recesses, Associated Leadframes, And Associated Systems And Methods App 20160247749 - Kwang; Chua Swee ; et al.	2016-08-25
Stacked semiconductor package having discrete components Grant 8,174,105 - Kwang , et al. May 8, 2	2012-05-08
Apparatus and method for packaging circuits Grant 8,138,617 - Poo , et al. March 20, 2	2012-03-20
Stacked Semiconductor Package Having Discrete Components App 20110215438 - Kwang; Chua Swee ; et al.	2011-09-08
Castellation wafer level packaging of integrated circuit chips Grant 8,008,126 - Jeung , et al. August 30, 2	2011-08-30
Semiconductor Assemblies And Methods Of Manufacturing Such Assemblies App 20110175206 - Kwang; Chua Swee ; et al.	2011-07-21
Semiconductor package having discrete components and system containing the package Grant 7,964,946 - Kwang , et al. June 21, 2	2011-06-21
Semiconductor Package Having Discrete Components And System Containing The Package App 20110012253 - Kwang; Chua Swee ; et al.	2011-01-20
Method for fabricating semiconductor packages with discrete components Grant 7,807,502 - Kwang , et al. October 5, 2	2010-10-05
Method For Fabricating Semiconductor Packages With Discrete Components App 20100203677 - Kwang; Chua Swee ; et al.	2010-08-12
Semiconductor Assemblies And Methods Of Manufacturing Such Assemblies App 20100133662 - Kwang; Chua Swee ; et al.	2010-06-03
Semiconductor package having die with recess and discrete component embedded within the recess Grant 7,723,831 - Kwang , et al. May 25, 2	2010-05-25
Castellation Wafer Level Packaging Of Integrated Circuit Chips App 20100068851 - Jeung; Boon Suan ; et al.	2010-03-18
Castellation wafer level packaging of integrated circuit chips Grant 7,679,179 - Jeung , et al. March 16, 2	2010-03-16
Apparatus and method for packaging circuits Grant 7,675,169 - Poo , et al. March 9, 2	2010-03-09
Castellation wafer level packaging of integrated circuit chips Grant 7,528,477 - Jeung , et al. May 5, 2	2009-05-05
Semiconductor Assemblies And Methods Of Manufacturing Such Assemblies App 20090057843 - Kwang; Chua Swee ; et al.	2009-03-05
Thin Semiconductor Die Packages And Associated Systems And Methods App 20090026593 - Kwang; Chua Swee	2009-01-29
Semiconductor Dies With Recesses, Associated Leadframes, And Associated Systems And Methods App 20090026592 - Kwang; Chua Swee ; et al.	2009-01-29
Semiconductor Packages And Method For Fabricating Semiconductor Packages With Discrete Components App 20080284003 - Kwang; Chua Swee ; et al.	2008-11-20
Method for fabricating packaged die Grant 7,358,154 - Poo , et al. April 15, 2	2008-04-15
Castellation Wafer Level Packaging Of Integrated Circuit Chips App 20080067675 - Jeung; Boon Suan ; et al.	2008-03-20
Apparatus And Method For Packaging Circuits App 20080054423 - Poo; Chia Y. ; et al.	2008-03-06
Support elements for semiconductor devices with peripherally located bond pads Grant 7,285,850 - Poo , et al. October 23, 2	2007-10-23
Castellation wafer level packaging of integrated circuit chips Grant 7,276,387 - Jeung , et al. October 2, 2	2007-10-02
Semiconductor devices and semiconductor device components with peripherally located, castellated contacts, assemblies and packages including such semiconductor devices or packages and associated methods Grant 7,226,809 - Poo , et al. June 5, 2	2007-06-05
Semiconductor devices including peripherally located bond pads, intermediates thereof, assemblies, and packages including the semiconductor devices, and support elements for the semiconductor devices Grant 7,115,984 - Poo , et al. October 3, 2	2006-10-03
Support elements for semiconductor devices with peripherally located bond pads App 20060208350 - Poo; Chia Yong ; et al.	2006-09-21
Semiconductor devices including peripherally located bond pads, intermediates thereof, and assemblies and packages including the semiconductor devices App 20060208351 - Poo; Chia Yong ; et al.	2006-09-21
Apparatus and method for packaging circuits App 20060084240 - Poo; Chia Yong ; et al.	2006-04-20
Castellation wafer level packaging of integrated circuit chips App 20060014319 - Jeung; Boon Suan ; et al.	2006-01-19
Castellation wafer level packaging of integrated circuit chips App 20060008946 - Jeung; Boon Suan ; et al.	2006-01-12
Castellation wafer level packaging of integrated circuit chips App 20060006519 - Jeung; Boon Suan ; et al.	2006-01-12
Castellation wafer level packaging of integrated circuit chips App 20060001142 - Jeung; Boon Suan ; et al.	2006-01-05
Castellation wafer level packaging of integrated circuit chips Grant 6,949,407 - Jeung , et al. September 27, 2	2005-09-27
Castellation Wafer Level Packaging Of Integrated Circuit Chips App 20050130345 - Jeung, Boon Suan ; et al.	2005-06-16
Apparatus and method for packaging circuits Grant 6,894,386 - Poo , et al. May 17, 2	2005-05-17
Castellation wafer level packaging of integrated circuit chips Grant 6,855,572 - Jeung , et al. February 15, 2	2005-02-15
Apparatus and method for packaging circuits App 20050029668 - Poo, Chia Yong ; et al.	2005-02-10
Semiconductor devices and semiconductor device components with peripherally located, castellated contacts, assemblies and packages including such semiconductor devices or packages Grant 6,818,977 - Poo , et al. November 16, 2	2004-11-16
Semiconductor devices including peripherally located bond pads, intermediates thereof, assemblies, and packages including the semiconductor devices, and support elements for the semiconductor devices App 20040124523 - Poo, Chia Yong ; et al.	2004-07-01
Semiconductor devices including peripherally located bond pads, assemblies, packages, and methods Grant 6,727,116 - Poo , et al. April 27, 2	2004-04-27
Castellation wafer level packaging of integrated circuit chips App 20040043535 - Jeung, Boon Suan ; et al.	2004-03-04
Semiconductor devices and semiconductor device components with peripherally located, castellated contacts, assemblies and packages including such semiconductor devices or packages and associated methods App 20030230802 - Poo, Chia Yong ; et al.	2003-12-18
Semiconductor devices and semiconductor device components with peripherally located, castellated contacts, assemblies and packages including such semiconductor devices or packages and associated methods App 20030232462 - Poo, Chia Yong ; et al.	2003-12-18
Semiconductor Devices Including Peripherally Located Bond Pads, Assemblies, Packages, And Methods App 20030232460 - Poo, Chia Yong ; et al.	2003-12-18
Wafer level stackable semiconductor package Grant 6,611,052 - Poo , et al. August 26, 2	2003-08-26
Stackable semiconductor package and wafer level fabrication method Grant 6,582,992 - Poo , et al. June 24, 2	2003-06-24
Stackable semiconductor package and wafer level fabrication method App 20030094683 - Poo, Chia Yong ; et al.	2003-05-22
Stackable Semiconductor Package And Wafer Level Fabrication Method App 20030096454 - Poo, Chia Yong ; et al.	2003-05-22
Apparatus and method for packaging circuits App 20030067001 - Poo, Chin Yong ; et al.	2003-04-10

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