Kwan; Kin Pui

Patent Applications and Registrations

Patent applications and USPTO patent grants for Kwan; Kin Pui.The latest application filed is for "integrated circuit package and process for fabricating the same".

Company Profile

0.20.6

Kwan; Kin Pui - Hong Kong N/A CN
Kwan; Kin Pui - Lai King N/A HK
Kwan; Kin Pui - Kowloon HK
Kwan; Kin Pui - Tsz Ching Estate Kowloon HK
Kwan; Kin Pui - N.T. HK

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Etch isolation LPCC/QFN strip Grant 9,806,006 - Li , et al. October 31, 2	2017-10-31
Method of fabricating an integrated circuit (IC) package having a plurality of spaced apart pad portion Grant 9,520,306 - Lin , et al. December 13, 2	2016-12-13
Integrated Circuit Package And Process For Fabricating The Same App 20160013075 - LIN; Geraldine Tsui Yee ; et al.	2016-01-14
Integrated circuit package having a plurality of spaced apart pad portions Grant 8,330,270 - Lin , et al. December 11, 2	2012-12-11
Etch Isolation Lpcc/qfn Strip App 20110284495 - Li; Tung Lok ; et al.	2011-11-24
Multiple leadframe laminated IC package Grant 7,449,771 - Fan , et al. November 11, 2	2008-11-11
Thin array plastic package without die attach pad and process for fabricating the same Grant 7,358,119 - McLellan , et al. April 15, 2	2008-04-15
Leadless plastic chip carrier with etch back pad singulation Grant 7,271,032 - McLellan , et al. September 18, 2	2007-09-18
Leadless plastic chip carrier Grant 7,270,867 - Kwan , et al. September 18, 2	2007-09-18
Process for fabricating pad frame and integrated circuit package Grant 7,232,755 - McLellan , et al. June 19, 2	2007-06-19
Process for fabricating a leadless plastic chip carrier Grant 7,226,811 - McLellan , et al. June 5, 2	2007-06-05
Thin leadless plastic chip carrier Grant 7,081,403 - Kirloskar , et al. July 25, 2	2006-07-25
Thin array plastic package without die attach pad and process for fabricating the same App 20060154403 - McLellan; Neil ; et al.	2006-07-13
Thin leadless plastic chip carrier Grant 7,009,286 - Kirloskar , et al. March 7, 2	2006-03-07
Leadless plastic chip carrier with etch back pad singulation Grant 6,995,460 - McLellan , et al. February 7, 2	2006-02-07
Leadless plastic chip carrier with etch back pad singulation Grant 6,989,294 - McLellan , et al. January 24, 2	2006-01-24
Process for fabricating a leadless plastic chip carrier Grant 6,946,324 - McLellan , et al. September 20, 2	2005-09-20
Leadless plastic chip carrier with etch back pad singulation Grant 6,933,594 - McLellan , et al. August 23, 2	2005-08-23
Leadless plastic chip carrier with etch back pad singulation and die attach pad array Grant 6,872,661 - Kwan , et al. March 29, 2	2005-03-29
Multiple leadframe laminated IC package Grant 6,734,044 - Fan , et al. May 11, 2	2004-05-11
Leadless plastic chip carrier with etch back pad singulation and die attach pad array Grant 6,635,957 - Kwan , et al. October 21, 2	2003-10-21
Leadless plastic chip carrier with etch back pad singulation and die attach pad array App 20010014538 - Kwan, Kin Pui ; et al.	2001-08-16
Leadless plastic chip carrier with etch back pad singulation App 20010008305 - McLellan, Neil ; et al.	2001-07-19

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