Kwan; Ka Shing Kenny
Patent Applications and Registrations
Patent applications and USPTO patent grants for Kwan; Ka Shing Kenny.The latest application filed is for "apparatus for increasing coverage of shielding gas during wire bonding".
Company Profile
0.26.26
- Kwan; Ka Shing Kenny - Singapore N/A SG
Patent Activity
| Patent | Date |
|---|---|
| Bonding machine incorporating dual-track transfer mechanism Grant 8,707,550 - Song , et al. April 29, 2 | 2014-04-29 |
| Wire bonding apparatus comprising rotary positioning stage Grant 8,256,658 - Ou , et al. September 4, 2 | 2012-09-04 |
| Apparatus For Increasing Coverage Of Shielding Gas During Wire Bonding App 20120145770 - SONG; Keng Yew James ; et al. | 2012-06-14 |
| Apparatus for increasing coverage of shielding gas during wire bonding Grant 8,186,562 - Song , et al. May 29, 2 | 2012-05-29 |
| Flanged transducer having improved rigidity Grant 7,997,470 - Li , et al. August 16, 2 | 2011-08-16 |
| Vacuum wire tensioner for wire bonder Grant 7,954,689 - Kwan , et al. June 7, 2 | 2011-06-07 |
| Bonding Machine Incorporating Dual-track Transfer Mechanism App 20110016707 - SONG; Keng Yew James ; et al. | 2011-01-27 |
| Temperature control of a bonding stage Grant 7,766,211 - Kwan , et al. August 3, 2 | 2010-08-03 |
| Multi-layer thermal insulation for a bonding system Grant 7,681,775 - Kwan , et al. March 23, 2 | 2010-03-23 |
| Electronic device handler for a bonding apparatus Grant 7,677,431 - Wong , et al. March 16, 2 | 2010-03-16 |
| Apparatus for delivering shielding gas during wire bonding Grant 7,628,307 - Wong , et al. December 8, 2 | 2009-12-08 |
| Thermal insulation for a bonding tool Grant 7,614,540 - Kwan , et al. November 10, 2 | 2009-11-10 |
| Electronic device handler for a bonding apparatus Grant 7,568,606 - Wong , et al. August 4, 2 | 2009-08-04 |
| Wire clamp gap control mechanism and method Grant 7,549,569 - Kwan , et al. June 23, 2 | 2009-06-23 |
| Soft touch clamp actuation mechanism Grant 7,532,428 - Kwan , et al. May 12, 2 | 2009-05-12 |
| Temperature Control Of A Bonding Stage App 20080271851 - KWAN; Ka Shing Kenny ; et al. | 2008-11-06 |
| Multi-layer Thermal Insulation For A Bonding System App 20080274325 - KWAN; Ka Shing Kenny ; et al. | 2008-11-06 |
| Vacuum Wire Tensioner For Wire Bonder App 20080272178 - KWAN; Ka Shing Kenny ; et al. | 2008-11-06 |
| Thermal Insulation For A Bonding Tool App 20080272179 - Kwan; Ka Shing Kenny ; et al. | 2008-11-06 |
| Soft Touch Clamp Actuation Mechanism App 20080174132 - KWAN; Ka Shing Kenny ; et al. | 2008-07-24 |
| Flanged Transducer Having Improved Rigidity App 20080121679 - LI; Hing Leung Marchy ; et al. | 2008-05-29 |
| Apparatus For Delivering Shielding Gas During Wire Bonding App 20080099531 - WONG; Yam Mo ; et al. | 2008-05-01 |
| Electronic Device Handler For A Bonding Apparatus App 20080092370 - WONG; Yam Mo ; et al. | 2008-04-24 |
| Electronic Device Handler For A Bonding Apparatus App 20080093004 - WONG; Yam Mo ; et al. | 2008-04-24 |
| Movable Electronic Flame-off Device For A Bonding Apparatus App 20080073408 - KWAN; Ka Shing Kenny ; et al. | 2008-03-27 |
| Wire clamp gap control mechanism and method App 20080000946 - Kwan; Ka Shing Kenny ; et al. | 2008-01-03 |
| Passive damping of vibrations in a support structure Grant 7,306,082 - Kwan , et al. December 11, 2 | 2007-12-11 |
| Flange-mounted transducer Grant 7,303,110 - Zhai , et al. December 4, 2 | 2007-12-04 |
| System for reducing oxidation of electronic devices Grant 7,182,793 - Duan , et al. February 27, 2 | 2007-02-27 |
| Conduit for preventing oxidation of a electronic device Grant 7,103,959 - Yeap , et al. September 12, 2 | 2006-09-12 |
| Capillary holder Grant 7,100,812 - Zhai , et al. September 5, 2 | 2006-09-05 |
| Capillary Holder App 20060175377 - Zhai; Bao Nian ; et al. | 2006-08-10 |
| Bondhead for wire bonding apparatus Grant 7,025,243 - Wong , et al. April 11, 2 | 2006-04-11 |
| Clamping device for processing electronic devices App 20060011701 - Duan; Rong ; et al. | 2006-01-19 |
| Flange-mounted transducer App 20050284912 - Zhai, Bao Nian ; et al. | 2005-12-29 |
| Bondhead for wire bonding apparatus App 20050279805 - Wong, Yam Mo ; et al. | 2005-12-22 |
| Clamp calibration apparatus and method Grant 6,948,387 - Chen , et al. September 27, 2 | 2005-09-27 |
| System for reducing oxidation of electronic devices App 20050161488 - Duan, Rong ; et al. | 2005-07-28 |
| Transducer tool holder Grant 6,918,528 - Narasimalu , et al. July 19, 2 | 2005-07-19 |
| Apparatus and method to prevent oxidation of electronic devices Grant 6,866,182 - Wong , et al. March 15, 2 | 2005-03-15 |
| Active vibration attenuation Grant 6,861,771 - Zhai , et al. March 1, 2 | 2005-03-01 |
| Stud bumping apparatus App 20050001018 - Kwan, Ka Shing Kenny ; et al. | 2005-01-06 |
| Transducer tool holder App 20040217147 - Narasimalu, Srikanth ; et al. | 2004-11-04 |
| Passive damping of vibrations in a support structure App 20040201148 - Kwan, Ka Shing Kenny ; et al. | 2004-10-14 |
| Active vibration attenuation App 20040189101 - Zhai, Bao Nian ; et al. | 2004-09-30 |
| Clamp calibration apparatus and method App 20040139782 - Chen, Chong Hao ; et al. | 2004-07-22 |
| Conduit for preventing oxidation of a electronic device App 20040115959 - Yeap, Boon June ; et al. | 2004-06-17 |
| Apparatus and method to prevent oxidation of electronic devices App 20040065720 - Wong, Yam Mo ; et al. | 2004-04-08 |
| Force sensing apparatus Grant 6,644,533 - Ou , et al. November 11, 2 | 2003-11-11 |
| Force sensing apparatus App 20020109001 - Ou, Gang ; et al. | 2002-08-15 |
| Force sensing apparatus Grant 6,425,514 - Ou , et al. July 30, 2 | 2002-07-30 |
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