KWAN; Ka Shing

Patent Applications and Registrations

Patent applications and USPTO patent grants for KWAN; Ka Shing.The latest application filed is for "volumetric measurement and regulation device incorporated in a time-pressure dispenser".

Company Profile

4.11.13

KWAN; Ka Shing - Hong Kong HK
Kwan; Ka Shing - Singapore SG
- Singapore SG

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Volumetric Measurement And Regulation Device Incorporated In A Time-pressure Dispenser App 20220088633 - MAK; Kuok Hang ; et al.	2022-03-24
Driving system having reduced vibration transmission Grant 11,205,937 - Song , et al. December 21, 2	2021-12-21
Air Jet Substrate Cleaning Apparatus App 20200316656 - KWAN; Ka Shing ; et al.	2020-10-08
Driving System Having Reduced Vibration Transmission App 20200028407 - SONG; Keng Yew ; et al.	2020-01-23
Wire bonding apparatus comprising an oscillator mechanism Grant 9,640,512 - Song , et al. May 2, 2	2017-05-02
Screen printer, and method of cleaning a stencil of a screen printer Grant 9,254,641 - Ong , et al. February 9, 2	2016-02-09
Wire Bonding Apparatus Comprising An Oscillator Mechanism App 20160023298 - SONG; Keng Yew ; et al.	2016-01-28
Lead frame support plate and window clamp for wire bonding machines Grant 9,070,762 - Chuang , et al. June 30, 2	2015-06-30
Screen Printer, And Method Of Cleaning A Stencil Of A Screen Printer App 20150033966 - ONG; See Yap ; et al.	2015-02-05
Wire bonder including a transducer, a bond head, and a mounting apparatus Grant 8,919,631 - Wong , et al. December 30, 2	2014-12-30
Wire bonder including a transducer, a bond head, and a mounting apparatus Grant 08919631 -	2014-12-30
Lead Frame Support Plate And Window Clamp For Wire Bonding Machines App 20140217152 - CHUANG; Phui Phoong ; et al.	2014-08-07
Lead frame support plate and window clamp for wire bonding machines Grant 8,752,751 - Chuang , et al. June 17, 2	2014-06-17
Lead Frame Support Plate And Window Clamp For Wire Bonding Machines App 20140014708 - CHUANG; Phui Phoong ; et al.	2014-01-16
Wire Bonder Including A Transducer, A Bond Head, And A Mounting Apparatus App 20130240605 - WONG; Yam Mo ; et al.	2013-09-19
Wire Bonding Apparatus Comprising Rotary Positioning Stage App 20090045244 - OU; Gang ; et al.	2009-02-19
Stud bumping apparatus Grant 7,303,109 - Kwan , et al. December 4, 2	2007-12-04
Clamping device for processing electronic devices Grant 7,240,820 - Duan , et al. July 10, 2	2007-07-10
Multiple-head wire-bonding system Grant 6,749,100 - Wong , et al. June 15, 2	2004-06-15
Multiple-head wire-bonding system App 20030098340 - Wong, Yam Mo ; et al.	2003-05-29

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