Kwak; Young-Hoon
Patent Applications and Registrations
Patent applications and USPTO patent grants for Kwak; Young-Hoon.The latest application filed is for "electronic device and method of registering fingerprint in electronic device".
Company Profile
4.25.54
- Kwak; Young-Hoon - Suwon-si KR
- Kwak; Young-Hoon - Gyeonggi-do KR
- Kwak; Young Hoon - Suwon KR
- Kwak; Young Hoon - Gyunggi-do N/A KR
Patent Activity
| Patent | Date |
|---|---|
| Electronic device and method of registering fingerprint in electronic device Grant 11,151,350 - Lee , et al. October 19, 2 | 2021-10-19 |
| Electronic Device And Method Of Registering Fingerprint In Electronic Device App 20200242326 - LEE; Seung-Yun ; et al. | 2020-07-30 |
| Electronic device and method of registering fingerprint in electronic device Grant 10,621,407 - Lee , et al. | 2020-04-14 |
| Electronic Device And Method Of Registering Fingerprint In Electronic Device App 20190244003 - LEE; Seung-Yun ; et al. | 2019-08-08 |
| Electronic device and method of registering fingerprint in electronic device Grant 10,262,181 - Lee , et al. | 2019-04-16 |
| Electronic Device And Method Of Registering Fingerprint In Electronic Device App 20180144177 - Lee; Seung-Yun ; et al. | 2018-05-24 |
| Electronic device and method of registering fingerprint in electronic device Grant 9,881,198 - Lee , et al. January 30, 2 | 2018-01-30 |
| All-in-one power semiconductor module Grant 9,455,207 - Kim , et al. September 27, 2 | 2016-09-27 |
| Power semiconductor module Grant 9,443,818 - Kim , et al. September 13, 2 | 2016-09-13 |
| Electronic Device And Method Of Registering Fingerprint In Electronic Device App 20160239701 - Lee; Seung-Yun ; et al. | 2016-08-18 |
| Heat Radiation Sheet For Board, Manufacturing Method Thereof, And Heat Radiation Board App 20150349230 - KIM; Kwang Soo ; et al. | 2015-12-03 |
| Power module package and method of manufacturing the same Grant 9,153,564 - Kim , et al. October 6, 2 | 2015-10-06 |
| Power module package Grant 9,153,514 - Sohn , et al. October 6, 2 | 2015-10-06 |
| Semiconductor Module Package And Method Of Manufacturing The Same App 20150270201 - Kim; Kwang Soo ; et al. | 2015-09-24 |
| Power Module Package App 20150270217 - KIM; Kwang Soo ; et al. | 2015-09-24 |
| Power Module Package And Method Of Manufacturing The Same App 20150214199 - KIM; Kwang Soo ; et al. | 2015-07-30 |
| Power Semiconductor Module App 20150214126 - KIM; Kwang Soo ; et al. | 2015-07-30 |
| Heat Radiation System For Power Semiconductor Module App 20150156914 - KWAK; Young Hoon ; et al. | 2015-06-04 |
| Power Semiconductor Module App 20150156909 - Kwak; Young Hoon ; et al. | 2015-06-04 |
| Power Semiconductor Package App 20150091146 - Oh; Kyu Hwan ; et al. | 2015-04-02 |
| Semiconductor device Grant D719,926 - Sohn , et al. December 23, 2 | 2014-12-23 |
| Semiconductor device Grant D719,113 - Sohn , et al. December 9, 2 | 2014-12-09 |
| Heat dissipation system for power module Grant 8,897,011 - Kwak , et al. November 25, 2 | 2014-11-25 |
| Semiconductor device Grant D717,253 - Jo , et al. November 11, 2 | 2014-11-11 |
| Semiconductor package Grant 8,866,288 - Kim , et al. October 21, 2 | 2014-10-21 |
| Housing And Power Module Having The Same App 20140285973 - HONG; Chang Seob ; et al. | 2014-09-25 |
| Housing And Power Module Having The Same App 20140285972 - Hong; Chang Seob ; et al. | 2014-09-25 |
| Semiconductor module having sliding case and manufacturing method thereof Grant 8,816,515 - Lee , et al. August 26, 2 | 2014-08-26 |
| Semiconductor package including conductive member disposed between the heat dissipation member and the lead frame Grant 8,810,014 - Lim , et al. August 19, 2 | 2014-08-19 |
| Power semiconductor module Grant 8,796,730 - Lee , et al. August 5, 2 | 2014-08-05 |
| Semiconductor Module Having Sliding Case And Manufacturing Method Thereof App 20140175631 - LEE; Young Ki ; et al. | 2014-06-26 |
| Semiconductor package substrate Grant 8,736,077 - Kim , et al. May 27, 2 | 2014-05-27 |
| Power module package Grant 8,729,692 - Kim , et al. May 20, 2 | 2014-05-20 |
| Cooling System Of Power Semiconductor Device App 20140124182 - KWAK; Young Hoon ; et al. | 2014-05-08 |
| Power Module Package And Method Of Manufacturing The Same App 20140117525 - Lee; Young Ki ; et al. | 2014-05-01 |
| Heat Sink And Cooling System Including The Same App 20140116670 - Kwak; Young Hoon ; et al. | 2014-05-01 |
| Semiconductor Package App 20140117522 - LIM; Jae Hyun ; et al. | 2014-05-01 |
| All-in-one Power Semiconductor Module App 20140118956 - KIM; Kwang Soo ; et al. | 2014-05-01 |
| Power Module Package App 20140118961 - Hong; Chang Seob ; et al. | 2014-05-01 |
| Semiconductor Package App 20140110830 - Kim; Jong Man ; et al. | 2014-04-24 |
| Multi-stage Heat Sink, Cooling System With The Same And Method For Controlling The Same App 20140014313 - Hong; Chang Seob ; et al. | 2014-01-16 |
| Cooling Apparatus App 20140000839 - Oh; Kyu Hwan ; et al. | 2014-01-02 |
| Heat Dissipation System For Power Module App 20130343001 - Kwak; Young Hoon ; et al. | 2013-12-26 |
| Semiconductor package Grant 8,598,702 - Kwak , et al. December 3, 2 | 2013-12-03 |
| Heat Dissipation System For Power Module App 20130314870 - KWAK; Young Hoon ; et al. | 2013-11-28 |
| Semiconductor Package, Semiconductor Module, And Mounting Structure Thereof App 20130270689 - KIM; Kwang Soo ; et al. | 2013-10-17 |
| Semiconductor Package App 20130154083 - Kwak; Young Hoon ; et al. | 2013-06-20 |
| Heat Sink App 20130146259 - Oh; Kyu Hwan ; et al. | 2013-06-13 |
| Power Module Package App 20130134571 - KIM; Kwang Soo ; et al. | 2013-05-30 |
| Heat Sink App 20130112388 - Kwak; Young Hoon ; et al. | 2013-05-09 |
| Power Module Package And Method For Manufacturing The Same App 20130105956 - Jo; Eun Jung ; et al. | 2013-05-02 |
| Power Semiconductor Module App 20130069108 - LEE; Young Ki ; et al. | 2013-03-21 |
| Power Module Package App 20130069213 - SOHN; Young Ho ; et al. | 2013-03-21 |
| Power Module Package And Method For Manufacturing The Same App 20130062743 - Kim; Kwang Soo ; et al. | 2013-03-14 |
| Air blower assembly App 20130047369 - Heo; Young Keun ; et al. | 2013-02-28 |
| Semiconductor Package Substrate App 20130037967 - KIM; Jong Man ; et al. | 2013-02-14 |
| Power Device Package Module And Manufacturing Method Thereof App 20130026616 - LEE; Suk Ho ; et al. | 2013-01-31 |
| Substrate For Power Module Package And Method For Manufacturing The Same App 20130020111 - Oh; Kyu Hwan ; et al. | 2013-01-24 |
| Apparatus and method for cleaning a camera module App 20110247658 - Kwak; Young Hoon ; et al. | 2011-10-13 |
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