Kwak; Min Keun

Patent Applications and Registrations

Patent applications and USPTO patent grants for Kwak; Min Keun.The latest application filed is for "semiconductor package and method for fabricating the same".

Company Profile

4.9.14

Kwak; Min Keun - Asan-si KR
Kwak; Min-keun - Suwon-si KR
Kwak; Min-Keun - Cheonan-si KR
Kwak; Min-Keun - Chungcheongnam-do KR

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Semiconductor package Grant 11,450,614 - Kim , et al. September 20, 2	2022-09-20
Semiconductor Package And Method For Fabricating The Same App 20220165651 - KWAK; Min Keun	2022-05-26
Semiconductor Package App 20210320067 - KIM; Jung Joo ; et al.	2021-10-14
Bonding Apparatus And Semiconductor Package Fabrication Equipment Including The Same App 20200388522 - AHN; Seok Geun ; et al.	2020-12-10
Semiconductor device having overlay pattern Grant 10,747,123 - Kim , et al. A	2020-08-18
Semiconductor device including overlay patterns Grant 10,573,633 - Kim , et al. Feb	2020-02-25
Semiconductor Device Having Overlay Pattern App 20190155174 - KIM; Tae-sun ; et al.	2019-05-23
Semiconductor Device Including Overlay Patterns App 20180175016 - Kim; Tae Sun ; et al.	2018-06-21
Method for fabricating semiconductor device Grant 9,105,694 - Lee , et al. August 11, 2	2015-08-11
Method For Fabricating Semiconductor Device App 20150004783 - LEE; Jong-Ho ; et al.	2015-01-01
Semiconductor Package Having A Multi-channel And A Related Electronic System App 20140252640 - Kwak; Min-Keun	2014-09-11
Semiconductor package, printed circuit board, and electronic device Grant 7,812,265 - Shin , et al. October 12, 2	2010-10-12
Bonding pad structure and semiconductor device including the bonding pad structure App 20090176124 - Hong; Jong-Won ; et al.	2009-07-09
Package with barrier wall and method for manufacturing the same Grant 7,498,193 - Kwak , et al. March 3, 2	2009-03-03
Semiconductor wafers and methods of fabricating semiconductor devices App 20090050885 - Cho; Yun-rae ; et al.	2009-02-26
Semiconductor Package And Method Of Forming The Same, Printed Circuit Board, And Electronic Device App 20080291652 - Shin; Mu-Seob ; et al.	2008-11-27
Lead on chip semiconductor package Grant 7,414,303 - Lee , et al. August 19, 2	2008-08-19
Package with barrier wall and method for manufacturing the same App 20070069355 - Kwak; Min-Keun ; et al.	2007-03-29
Package with barrier wall and method for manufacturing the same Grant 7,166,906 - Kwak , et al. January 23, 2	2007-01-23
Semiconductor package with improved ball land structure Grant 7,064,435 - Chung , et al. June 20, 2	2006-06-20
Package with barrier wall and method for manufacturing the same App 20050260844 - Kwak, Min-Keun ; et al.	2005-11-24
Lead on chip semiconductor package App 20050212099 - Lee, Sang-Hyeop ; et al.	2005-09-29
Semiconductor package with improved ball land structure App 20050023683 - Chung, Myung-Kee ; et al.	2005-02-03

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