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Patent applications and USPTO patent grants for Kwak; Jun-Keun.The latest application filed is for "methods of forming electrical interconnects using thin electrically insulating liners in contact holes".
Patent | Date |
---|---|
Methods of Forming Electrical Interconnects Using Thin Electrically Insulating Liners in Contact Holes App 20100029072 - Park; Jae-Eon ;   et al. | 2010-02-04 |
Method for improved formation of nickel silicide contacts in semiconductor devices Grant 7,622,386 - Madan , et al. November 24, 2 | 2009-11-24 |
Gapfill for metal contacts App 20080311711 - Hampp; Roland ;   et al. | 2008-12-18 |
Method For Improved Formation Of Nickel Silicide Contacts In Semiconductor Devices App 20080138985 - Madan; Anita ;   et al. | 2008-06-12 |
Method of manufacturing semiconductor device Grant 7,235,485 - Kwak , et al. June 26, 2 | 2007-06-26 |
Method Of Manufacturing Semiconductor Device App 20070087560 - Kwak; Jun-keun ;   et al. | 2007-04-19 |
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