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Patent applications and USPTO patent grants for KWAK; DONGOK.The latest application filed is for "method of fabricating semiconductor package and semiconductor package".
Patent | Date |
---|---|
Method Of Fabricating Semiconductor Package And Semiconductor Package App 20220157795 - LEE; TAE-YOUNG ;   et al. | 2022-05-19 |
Semiconductor package having stiffener Grant 11,315,849 - Lee , et al. April 26, 2 | 2022-04-26 |
Method of fabricating semiconductor package and semiconductor package Grant 11,251,169 - Lee , et al. February 15, 2 | 2022-02-15 |
Semiconductor Package Having Stiffener App 20210305117 - LEE; Suchang ;   et al. | 2021-09-30 |
Method Of Fabricating Semiconductor Package And Semiconductor Package App 20200203325 - LEE; TAE-YOUNG ;   et al. | 2020-06-25 |
Semiconductor module Grant 9,437,518 - Byun , et al. September 6, 2 | 2016-09-06 |
Semiconductor Module App 20140117528 - BYUN; Jaebum ;   et al. | 2014-05-01 |
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