KUWAHARA; Jun
Patent Applications and Registrations
Patent applications and USPTO patent grants for KUWAHARA; Jun.The latest application filed is for "electroconductive ink and carbon wiring substrate".
- KUWAHARA; Jun - Tokyo JP
- Kuwahara; Jun - Okayama JP
- KUWAHARA; Jun - Chiba-shi JP
| Patent | Date |
|---|---|
| Electroconductive Ink And Carbon Wiring Substrate App 20220056295 - ARAKI; Teppei ; et al. | 2022-02-24 |
| Impeller of waterwheel Grant D886,740 - Kuwahara , et al. | 2020-06-09 |
| Impeller of waterwheel Grant D884,634 - Kuwahara , et al. | 2020-05-19 |
| Curable Aqueous Resin Emulsion Composition App 20190382580 - KUWAHARA; Jun ; et al. | 2019-12-19 |
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