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Patent applications and USPTO patent grants for Kuwahara; Heikichi.The latest application filed is for "cooling apparatus for electronic elements".
Patent | Date |
---|---|
Cooling apparatus for electronic elements Grant 5,925,929 - Kuwahara , et al. July 20, 1 | 1999-07-20 |
Semiconductor device Grant 5,793,106 - Yasukawa , et al. August 11, 1 | 1998-08-11 |
Cooling device with thermally separated electronic parts on a monolithic substrate Grant 5,793,611 - Nakazato , et al. August 11, 1 | 1998-08-11 |
Cooling system of electronic computer using flexible members in contact with semiconductor devices on boards Grant 5,504,924 - Ohashi , et al. April 2, 1 | 1996-04-02 |
Cooling apparatus of electronic device Grant 5,365,402 - Hatada , et al. November 15, 1 | 1994-11-15 |
Liquid impingement cooling module for semiconductor devices Grant 5,270,572 - Nakajima , et al. December 14, 1 | 1993-12-14 |
Semiconductor cooling device Grant 5,021,924 - Kieda , et al. June 4, 1 | 1991-06-04 |
Semiconductor cooling apparatus Grant 4,977,444 - Nakajima , et al. December 11, 1 | 1990-12-11 |
Construction of a heat transfer wall of a heat transfer pipe Grant 4,715,436 - Takahashi , et al. December 29, 1 | 1987-12-29 |
Heat transfer tube for single phase flow Grant 4,690,211 - Kuwahara , et al. September 1, 1 | 1987-09-01 |
Method for producing a heat transfer wall for vaporizing liquids Grant 4,653,163 - Kuwahara , et al. March 31, 1 | 1987-03-31 |
Heat transfer surface with multiple layers Grant 4,602,681 - Daikoku , et al. July 29, 1 | 1986-07-29 |
Liquid film evaporation type heat exchanger Grant 4,585,055 - Nakayama , et al. April 29, 1 | 1986-04-29 |
Heat-transfer wall for condensation and method of manufacturing the same Grant 4,195,688 - Fujie , et al. April 1, 1 | 1980-04-01 |
Heat transfer wall for boiling liquids Grant 4,060,125 - Fujie , et al. November 29, 1 | 1977-11-29 |
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