loadpatents
name:-0.14949297904968
name:-0.31418013572693
name:-0.0070891380310059
Kuwahara; Heikichi Patent Filings

Kuwahara; Heikichi

Patent Applications and Registrations

Patent applications and USPTO patent grants for Kuwahara; Heikichi.The latest application filed is for "cooling apparatus for electronic elements".

Company Profile
0.15.0
  • Kuwahara; Heikichi - Tsuchiura JP
  • Kuwahara; Heikichi - Ibaraki JP
  • Kuwahara; Heikichi - Kashiwa JP
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Cooling apparatus for electronic elements
Grant 5,925,929 - Kuwahara , et al. July 20, 1
1999-07-20
Semiconductor device
Grant 5,793,106 - Yasukawa , et al. August 11, 1
1998-08-11
Cooling device with thermally separated electronic parts on a monolithic substrate
Grant 5,793,611 - Nakazato , et al. August 11, 1
1998-08-11
Cooling system of electronic computer using flexible members in contact with semiconductor devices on boards
Grant 5,504,924 - Ohashi , et al. April 2, 1
1996-04-02
Cooling apparatus of electronic device
Grant 5,365,402 - Hatada , et al. November 15, 1
1994-11-15
Liquid impingement cooling module for semiconductor devices
Grant 5,270,572 - Nakajima , et al. December 14, 1
1993-12-14
Semiconductor cooling device
Grant 5,021,924 - Kieda , et al. June 4, 1
1991-06-04
Semiconductor cooling apparatus
Grant 4,977,444 - Nakajima , et al. December 11, 1
1990-12-11
Construction of a heat transfer wall of a heat transfer pipe
Grant 4,715,436 - Takahashi , et al. December 29, 1
1987-12-29
Heat transfer tube for single phase flow
Grant 4,690,211 - Kuwahara , et al. September 1, 1
1987-09-01
Method for producing a heat transfer wall for vaporizing liquids
Grant 4,653,163 - Kuwahara , et al. March 31, 1
1987-03-31
Heat transfer surface with multiple layers
Grant 4,602,681 - Daikoku , et al. July 29, 1
1986-07-29
Liquid film evaporation type heat exchanger
Grant 4,585,055 - Nakayama , et al. April 29, 1
1986-04-29
Heat-transfer wall for condensation and method of manufacturing the same
Grant 4,195,688 - Fujie , et al. April 1, 1
1980-04-01
Heat transfer wall for boiling liquids
Grant 4,060,125 - Fujie , et al. November 29, 1
1977-11-29

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