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Patent applications and USPTO patent grants for Kuwabara; Kiyoshi.The latest application filed is for "integrated circuit package and method of forming the same".
Patent | Date |
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Integrated circuit package and method of forming the same Grant 9,455,241 - Jin , et al. September 27, 2 | 2016-09-27 |
Integrated Circuit Package And Method Of Forming The Same App 20150303168 - JIN; YONGGANG ;   et al. | 2015-10-22 |
Integrated Circuit Package And Method Of Forming The Same App 20100187651 - JIN; Yonggang ;   et al. | 2010-07-29 |
Optical reflective structures and method for making Grant 6,706,546 - Yoshimura , et al. March 16, 2 | 2004-03-16 |
Optical reflective structures and method for making App 20020039464 - Yoshimura, Tetsuzo ;   et al. | 2002-04-04 |
Cable connector, circuit board and system having circuit boards connected together by the cable connector Grant 5,667,401 - Kuwabara , et al. September 16, 1 | 1997-09-16 |
Connector having skirt with holes to receive plug pins and alignment pin Grant 5,437,558 - Sakuraoka , et al. August 1, 1 | 1995-08-01 |
Wiring structure of termination circuit Grant 4,785,141 - Nishihara , et al. November 15, 1 | 1988-11-15 |
Multilayer printed wiring board Grant 4,692,843 - Matsumoto , et al. September 8, 1 | 1987-09-08 |
High density multilayer printed circuit board Grant 4,675,789 - Kuwabara , et al. June 23, 1 | 1987-06-23 |
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