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KUTSUNA; Ryosuke Patent Filings

KUTSUNA; Ryosuke

Patent Applications and Registrations

Patent applications and USPTO patent grants for KUTSUNA; Ryosuke.The latest application filed is for "grommet for attaching cover and cover".

Company Profile
0.1.2
  • KUTSUNA; Ryosuke - Aichi JP
  • Kutsuna; Ryosuke - Nishio JP
  • KUTSUNA; Ryosuke - Nishio-shi JP
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Grommet For Attaching Cover And Cover
App 20210190114 - TOMIYAMA; Koji ;   et al.
2021-06-24
Sound absorbing cover, sound absorbing assembly, and magnetic induction foam molding device
Grant 9,551,144 - Tomiyama , et al. January 24, 2
2017-01-24
Sound Absorbing Cover, Sound Absorbing Assembly, And Magnetic Induction Foam Molding Device
App 20150197933 - TOMIYAMA; Koji ;   et al.
2015-07-16

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