Kusunoki; Junya

Patent Applications and Registrations

Patent applications and USPTO patent grants for Kusunoki; Junya.The latest application filed is for "method of manufacture of light-emitting element and light-emitting element manufactured thereby".

Company Profile

1.7.13

Kusunoki; Junya - Tokyo JP
Kusunoki; Junya - Utsunomiya-shi JP
Kusunoki; Junya - Shinagawa-ku JP
Kusunoki; Junya - Utsunomiya JP
Kusunoki; Junya - Tochigi JP

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Temporary bonding adhesive for a semiconductor wafer and method for manufacturing a semiconductor device using the same Grant 9,399,725 - Takeuchi , et al. July 26, 2	2016-07-26
Method Of Manufacture Of Light-emitting Element And Light-emitting Element Manufactured Thereby App 20130009172 - Kusunoki; Junya ; et al.	2013-01-10
Method of manufacturing light receiving device Grant 8,268,540 - Takahashi , et al. September 18, 2	2012-09-18
Method For Manufacturing Electronic Device, Electronic Device, Method For Manufacturing Electronic Device Package And Electronic Device Package App 20120228782 - Kawata; Masakazu ; et al.	2012-09-13
Temporary Bonding Adhesive For A Semiconductor Wafer And Method For Manufacturing A Semiconductor Device Using The Same App 20110318938 - Takeuchi; Etsu ; et al.	2011-12-29
Temporary Bonding Adhesive For A Semiconductor Wafer And Method For Manufacturing A Semiconductor Device Using The Same App 20110263095 - Takeuchi; Etsu ; et al.	2011-10-27
Photosensitive compositions based on polycyclic polymers for low stress, high temperature films Grant 8,030,425 - Apanius , et al. October 4, 2	2011-10-04
Resin composition, filling material, insulating layer and semiconductor device Grant 7,999,354 - Takahashi , et al. August 16, 2	2011-08-16
Semiconductor wafer and semiconductor device Grant 7,915,467 - Kusunoki , et al. March 29, 2	2011-03-29
Semiconductor device Grant 7,808,083 - Kusunoki , et al. October 5, 2	2010-10-05
Resin Composition, Filling Material, Insulating Layer And Semiconductor Device App 20100181684 - Takahashi; Toyosei ; et al.	2010-07-22
Semiconductor Device App 20100120937 - KUSUNOKI; Junya ; et al.	2010-05-13
Method of manufacturing light receiving device App 20090226848 - Takahashi; Toyosei ; et al.	2009-09-10
Photosensitive Compositions Based On Polycyclic Polymers For Low Stress, High Temperature Films App 20090189277 - Apanius; Christopher ; et al.	2009-07-30
Light-Receiving Device App 20090008682 - Kusunoki; Junya ; et al.	2009-01-08
Semiconductor Device App 20080277805 - Kusunoki; Junya ; et al.	2008-11-13
Semiconductor Wafer And Semiconductor Device App 20080090176 - Kusunoki; Junya ; et al.	2008-04-17
Semiconductor device, resin composition for buffer coating, resin composition for die bonding, and resin composition for encapsulating App 20060228562 - Ukawa; Ken ; et al.	2006-10-12
Photosensitive compositions based on polycyclic polymers for low stress, high temperature films App 20060020068 - Elce; Edmund ; et al.	2006-01-26

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