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Patent applications and USPTO patent grants for Kustra; Rick.The latest application filed is for "method of using dual frequency rf power in a process chamber".
Patent | Date |
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Deposition of low-stress carbon-containing layers Grant 11,404,263 - Wang , et al. August 2, 2 | 2022-08-02 |
Method Of Using Dual Frequency Rf Power In A Process Chamber App 20220102141 - SINGH; Anup Kumar ;   et al. | 2022-03-31 |
Movable Electrode For Process Chamber App 20220093436 - KUSTRA; Rick | 2022-03-24 |
Showerhead Design To Control Stray Deposition App 20220064797 - DHANAKSHIRUR; Akshay ;   et al. | 2022-03-03 |
Deposition Of Low-stress Boron-containing Layers App 20220044927 - Wang; Huiyuan ;   et al. | 2022-02-10 |
Deposition Of Low-stress Carbon-containing Layers App 20220044926 - Wang; Huiyuan ;   et al. | 2022-02-10 |
Plasma Cleaning Methods For Processing Chambers App 20210384015 - WANG; Huiyuan ;   et al. | 2021-12-09 |
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