Kusaba; Tatsumi

Patent Applications and Registrations

Patent applications and USPTO patent grants for Kusaba; Tatsumi.The latest application filed is for "method for producing a bonded wafer".

Company Profile

0.16.18

Kusaba; Tatsumi - Minato-ku JP
Kusaba; Tatsumi - Takeo JP
Kusaba; Tatsumi - Tokyo JP
Kusaba; Tatsumi - Yamagata JP
Kusaba; Tatsumi - Takeo-shi JP

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Method for producing a bonded wafer Grant 8,003,494 - Nishihata , et al. August 23, 2	2011-08-23
P-type silicon wafer and method for heat-treating the same Grant 7,939,441 - Kusaba , et al. May 10, 2	2011-05-10
Method for producing bonded silicon wafer Grant 7,927,957 - Kusaba , et al. April 19, 2	2011-04-19
Method for producing bonded wafer Grant 7,927,972 - Endo , et al. April 19, 2	2011-04-19
Method For Producing A Bonded Wafer App 20100248447 - Nishihata; Hideki ; et al.	2010-09-30
Method of manufacturing bonded wafer Grant 7,767,549 - Okuda , et al. August 3, 2	2010-08-03
Process for regenerating layer transferred wafer Grant 7,763,541 - Okuda , et al. July 27, 2	2010-07-27
Method for Producing Bonded Wafer App 20100184270 - Endo; Akihiko ; et al.	2010-07-22
Method for producing bonded wafer Grant 7,745,306 - Okuda , et al. June 29, 2	2010-06-29
Method Of Producing Bonded Wafer App 20100144119 - Kusaba; Tatsumi ; et al.	2010-06-10
Method for producing bonded wafer Grant 7,718,509 - Endo , et al. May 18, 2	2010-05-18
Method For Producing Bonded Silicon Wafer App 20100068867 - Kusaba; Tatsumi ; et al.	2010-03-18
Method For Producing Bonded Wafer App 20090298261 - Endo; Akihiko ; et al.	2009-12-03
Method for producing bonded wafer App 20090258475 - Endo; Akihiko ; et al.	2009-10-15
High purification method of jig for semiconductor heat treatment Grant 7,601,227 - Kusaba October 13, 2	2009-10-13
P-type Silicon Wafer And Method For Heat-treating The Same App 20090233420 - Kusaba; Tatsumi ; et al.	2009-09-17
P-type silicon wafer and method for heat-treating the same Grant 7,541,663 - Kusaba , et al. June 2, 2	2009-06-02
Process for cleaning silicon substrate Grant 7,534,728 - Nishihata , et al. May 19, 2	2009-05-19
Method for manufacturing bonded substrate and bonded substrate manufactured by the method Grant 7,442,623 - Endo , et al. October 28, 2	2008-10-28
Method of manufacturing bonded wafer App 20080213974 - OKUDA; Hidehiko ; et al.	2008-09-04
Method for manufacturing SOI substrate Grant 7,416,960 - Endo , et al. August 26, 2	2008-08-26
Process for Regenerating Layer Transferred Wafer and Layer Transferred Wafer Regenerated by the Process App 20080124929 - Okuda; Hidehiko ; et al.	2008-05-29
Method for manufacturing SOI substrate Grant 7,364,984 - Endo , et al. April 29, 2	2008-04-29
Method for manufacturing SOI substrate Grant 7,354,844 - Endo , et al. April 8, 2	2008-04-08
Method for producing bonded wafer App 20080020514 - Okuda; Hidehiko ; et al.	2008-01-24
Method for Manufacturing SOI Substrate App 20080014716 - Endo; Akihiko ; et al.	2008-01-17
Method for Manufacturing SOI Substrate App 20080014717 - Endo; Akihiko ; et al.	2008-01-17
Method for heat-treating silicon wafer and silicon wafer Grant 7,311,775 - Kusaba , et al. December 25, 2	2007-12-25
Method for Manufacturing Bonded Substrate and Bonded Substrate Manufactured by the Method App 20070117281 - Endo; Akihiko ; et al.	2007-05-24
High purification method of jig for semiconductor heat treatment App 20070028945 - Kusaba; Tatsumi	2007-02-08
Process for cleaning silicon substrate App 20060234461 - Nishihata; Hideki ; et al.	2006-10-19
Method for manufacturing SOI substrate App 20060177993 - Endo; Akihiko ; et al.	2006-08-10
Method for heat-treating silicon wafer and silicon wafer App 20060027161 - Kusaba; Tatsumi ; et al.	2006-02-09
P-type silicon wafer and method for heat-treating the same App 20060027897 - Kusaba; Tatsumi ; et al.	2006-02-09

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