loadpatents
name:-0.054066896438599
name:-0.02593994140625
name:-0.0015480518341064
KUROSAWA; Takahiko Patent Filings

KUROSAWA; Takahiko

Patent Applications and Registrations

Patent applications and USPTO patent grants for KUROSAWA; Takahiko.The latest application filed is for "sealer for sealing covered-wire".

Company Profile
0.13.25
  • KUROSAWA; Takahiko - Minato-ku JP
  • Kurosawa; Takahiko - Tokyo JP
  • Kurosawa; Takahiko - Tsukuba N/A JP
  • Kurosawa; Takahiko - Tsukuba-shi JP
  • Kurosawa; Takahiko - Ibaraki-ken JP
  • Kurosawa; Takahiko - Ibaraki JP
  • Kurosawa; Takahiko - Tsukiba-shi JP
  • Kurosawa, Takahiko - Goleta CA
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Sealer For Sealing Covered-wire
App 20160326410 - YAMAGUCHI; Hiroshi ;   et al.
2016-11-10
Stereolithography resin compositions and three-dimensional objects made therefrom
Grant 8,980,971 - Ueda , et al. March 17, 2
2015-03-17
D1499 Radiation Curable Resin Composition
App 20140241687 - IMAI; Hirokazu ;   et al.
2014-08-28
Stereolithography Resin Compositions And Three-dimensional Objects Made Therefrom
App 20130316154 - UEDA; Masahiro ;   et al.
2013-11-28
Radiation Curable Resin Composition For Electrical Wire
App 20130199818 - Uchida; Hirofumi ;   et al.
2013-08-08
Polymer and process for producing the same, composition for forming insulating film, and insulating film and method of forming the same
Grant 8,404,786 - Akiyama , et al. March 26, 2
2013-03-26
D1499 Radiation Curable Resin Composition
App 20120321270 - Imai; Hirokazu ;   et al.
2012-12-20
Method for forming organic silica film, organic silica film, wiring structure, semiconductor device, and composition for film formation
Grant 8,268,403 - Akiyama , et al. September 18, 2
2012-09-18
Radiation Curable Resin Composition For Wire Coating
App 20120205135 - Yamaguchi; Hiroshi ;   et al.
2012-08-16
Radiation Curable Resin Composition For Wire Coating
App 20120145432 - Yamaguchi; Hiroshi ;   et al.
2012-06-14
Kit For Preparing Water-sealing Material For Electrical Wire, Water-sealing Material For Electrical Wire, Water-sealing Member, Water-sealed Electrical Wire, And Water-sealing Method
App 20120055693 - Yamaguchi; Hiroshi ;   et al.
2012-03-08
Composition for forming insulating film, method for producing same, silica-based insulating film, and method for forming same
Grant 7,875,317 - Nakagawa , et al. January 25, 2
2011-01-25
Stereolithography Resin Compositions And Three-dimensional Objects Made Therefrom
App 20100227941 - Ueda; Masahiro ;   et al.
2010-09-09
Polymer And Process For Producing The Same, Composition For Forming Insulating Film, And Insulating Film And Method Of Forming The Same
App 20100168327 - AKIYAMA; Masahiro ;   et al.
2010-07-01
Insulating-film-forming composition, method of producing the same, silica-based insulating film, and method of forming the same
Grant 7,736,748 - Akiyama , et al. June 15, 2
2010-06-15
Radiation Curable Resin Compositions For Electric Wire Coatings
App 20100071928 - Yamaguchi; Hiroshi ;   et al.
2010-03-25
Laminate and method of forming the same, insulating film, and semiconductor device
Grant 7,556,860 - Akiyama , et al. July 7, 2
2009-07-07
Method for producing polymer, polymer, composition for forming insulating film, method for producing insulating film, and insulating film
Grant 7,528,207 - Nakagawa , et al. May 5, 2
2009-05-05
Method for Forming Organic Silica Film, Organic Silica Film, Wiring Structure, Semiconductor Device, and Composition for Film Formation
App 20080268264 - Akiyama; Masahiro ;   et al.
2008-10-30
Polycarbosilane and method of producing the same
Grant 7,358,317 - Nakagawa , et al. April 15, 2
2008-04-15
Method for Forming Organic Silica Film, Organic Silica Film, Wiring Structure, Semiconductor Device, and Composition for Film Formation
App 20080038527 - Akiyama; Masahiro ;   et al.
2008-02-14
Insulating-film-forming composition, method of producing the same, silica-based insulating film, and method of forming the same
App 20070031687 - Akiyama; Masahiro ;   et al.
2007-02-08
Polymer and process for producing the same, composition for forming insulating film, and insulating film and method of forming the same
App 20070027287 - Akiyama; Masahiro ;   et al.
2007-02-01
Method for producing polymer, polymer, composition for forming insulating film, method for producing insulating film, and insulating film
App 20070021580 - Nakagawa; Hisashi ;   et al.
2007-01-25
Composition for forming insulating film, method for producing same, silica-based insulating film, and method for forming same
App 20070020467 - Nakagawa; Hisashi ;   et al.
2007-01-25
Method for producing polymer, polymer, composition for forming insulating film, method for producing insulating film, and insulating film
App 20070015892 - Nakagawa; Hisashi ;   et al.
2007-01-18
Laminate and method of forming the same, insulating film, and semiconductor device
App 20060216531 - Akiyama; Masahiro ;   et al.
2006-09-28
Novel polycarbosilane and method of producing the same, film-forming composition, and film and method of forming the same
App 20060134336 - Nakagawa; Hisashi ;   et al.
2006-06-22
Method of forming cavity between multilayered wirings
Grant 7,049,220 - Kurosawa , et al. May 23, 2
2006-05-23
Polycarbosilane and method of producing the same
App 20060063905 - Nakagawa; Hisashi ;   et al.
2006-03-23
Method of forming cavity between multilayered wirings
Grant 7,005,248 - Kurosawa , et al. February 28, 2
2006-02-28
Method of forming cavity between multilayered wirings
App 20040132243 - Kurosawa, Takahiko ;   et al.
2004-07-08
Method of forming cavity between multilayered wirings
App 20040092127 - Kurosawa, Takahiko ;   et al.
2004-05-13
Method of forming insulating film and process for producing semiconductor device
App 20020086169 - Nakata, Rempei ;   et al.
2002-07-04
Composition for film formation, method of film formation, and insulating film
Grant 6,410,150 - Kurosawa , et al. June 25, 2
2002-06-25
Curable resin composition cured products
Grant 6,313,233 - Kurosawa , et al. November 6, 2
2001-11-06

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