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name:-0.046562910079956
name:-0.039832830429077
name:-0.0041499137878418
Kuromitsu; Yoshirou Patent Filings

Kuromitsu; Yoshirou

Patent Applications and Registrations

Patent applications and USPTO patent grants for Kuromitsu; Yoshirou.The latest application filed is for "insulated heat transfer substrate, thermoelectric conversion module, and method for manufacturing insulated heat transfer substrate".

Company Profile
3.39.40
  • Kuromitsu; Yoshirou - Saitama JP
  • Kuromitsu; Yoshirou - Saitama-shi JP
  • Kuromitsu; Yoshirou - Naka-shi JP
  • Kuromitsu; Yoshirou - Naka-gun JP
  • Kuromitsu; Yoshirou - Urawa Saitama N/A JP
  • Kuromitsu; Yoshirou - Urawa JP
  • Kuromitsu; Yoshirou - Naka-machi JP
  • Kuromitsu, Yoshirou - Ibaraki-ken JP
  • Kuromitsu, Yoshirou - Saitama-ken JP
  • Kuromitsu, Yoshirou - Omiya-shi JP
  • Kuromitsu; Yoshirou - Omiya JP
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Insulated heat transfer substrate, thermoelectric conversion module, and method for manufacturing insulated heat transfer substrate
Grant 11,404,622 - Arai , et al. August 2, 2
2022-08-02
Thermoelectric conversion module and method for producing thermoelectric conversion module
Grant 11,380,832 - Arai , et al. July 5, 2
2022-07-05
Insulated Heat Transfer Substrate, Thermoelectric Conversion Module, And Method For Manufacturing Insulated Heat Transfer Substrate
App 20210175401 - Arai; Koya ;   et al.
2021-06-10
Thermoelectric Conversion Module And Method For Producing Thermoelectric Conversion Module
App 20210111327 - Arai; Koya ;   et al.
2021-04-15
Thermoelectric Conversion Module And Method For Producing Thermoelectric Conversion Module
App 20200144472 - Arai; Koya ;   et al.
2020-05-07
Ceramic-aluminum conjugate, power module substrate, and power module
Grant 10,607,907 - Kuromitsu , et al.
2020-03-31
Power module substrate, power module substrate with heat sink, power module, method of manufacturing power module substrate, and copper member-bonding paste
Grant 10,375,825 - Terasaki , et al.
2019-08-06
Ceramic-aluminum Conjugate, Power Module Substrate, And Power Module
App 20180323122 - Kuromitsu; Yoshirou ;   et al.
2018-11-08
Heat-sink-attached power module substrate, heat-sink-attached power module, and method for producing heat-sink-attached power module substrate
Grant 9,968,012 - Terasaki , et al. May 8, 2
2018-05-08
Substrate for power modules, substrate with heat sink for power modules, and power module
Grant 9,807,865 - Nagatomo , et al. October 31, 2
2017-10-31
Power module
Grant 9,642,275 - Ohashi , et al. May 2, 2
2017-05-02
Power Module Substrate, Power Module Substrate With Heat Sink, Power Module, Method Of Manufacturing Power Module Substrate, And Copper Member-bonding Paste
App 20170034905 - Terasaki; Nobuyuki ;   et al.
2017-02-02
Power module substrate, power module substrate with heat sink, power module, method of manufacturing power module substrate, and copper member-bonding paste
Grant 9,504,144 - Terasaki , et al. November 22, 2
2016-11-22
Power module substrate, power module substrate with heat sink, and power module
Grant 9,480,144 - Nagatomo , et al. October 25, 2
2016-10-25
Power module
Grant 9,426,915 - Ohashi , et al. August 23, 2
2016-08-23
Substrate for power module, substrate with heat sink for power module, power module, method for producing substrate for power module, and method for producing substrate with heat sink for power module
Grant 9,414,512 - Nagatomo , et al. August 9, 2
2016-08-09
Substrate For Power Modules, Substrate With Heat Sink For Power Modules, And Power Module
App 20160021729 - Nagatomo; Yoshiyuki ;   et al.
2016-01-21
Power module substrate with heat sink, and method for producing power module substrate with heat sink
Grant 9,237,682 - Nagatomo , et al. January 12, 2
2016-01-12
Power Module
App 20150319877 - Ohashi; Touyou ;   et al.
2015-11-05
Power Module
App 20150319876 - Ohashi; Touyou ;   et al.
2015-11-05
Heat-sink-attached Power Module Substrate, Heat-sink-attached Power Module, And Method For Producing Heat-sink-attached Power Module Substrate
App 20150282379 - Terasaki; Nobuyuki ;   et al.
2015-10-01
Power module substrate, power module, and method for manufacturing power module substrate
Grant 9,101,063 - Kuromitsu , et al. August 4, 2
2015-08-04
Power module substrate, power module, and method for manufacturing power module substrate
Grant 9,095,062 - Kuromitsu , et al. July 28, 2
2015-07-28
Power Module Substrate, Power Module Substrate With Heat Sink, Power Module, Method Of Manufacturing Power Module Substrate, And Copper Member-bonding Paste
App 20150208496 - Terasaki; Nobuyuki ;   et al.
2015-07-23
Ceramic substrate, method of manufacturing ceramic substrate, and method of manufacturing power module substrate
Grant 9,079,264 - Tonomura , et al. July 14, 2
2015-07-14
Method for producing substrate for power module with heat sink, substrate for power module with heat sink, and power module
Grant 9,076,755 - Tonomura , et al. July 7, 2
2015-07-07
Power module substrate, power module substrate with heat sink, power module, and method of manufacturing power module substrate
Grant 9,066,433 - Kuromitsu , et al. June 23, 2
2015-06-23
Power Module Substrate With Heat Sink, And Method For Producing Power Module Substrate With Heat Sink
App 20150055303 - Nagatomo; Yoshiyuki ;   et al.
2015-02-26
Power Module Substrate With Heatsink, Power Module Substrate With Cooler And Power Module
App 20150055302 - Nagatomo; Yoshiyuki ;   et al.
2015-02-26
Power Module Substrate, Power Module Substrate With Heatsink, Power Module, And Method For Producing Power Module Substrate
App 20150041188 - Terasaki; Nobuyuki ;   et al.
2015-02-12
Power Module Substrate, Power Module Substrate With Heat Sink, And Power Module
App 20150034367 - Nagatomo; Yoshiyuki ;   et al.
2015-02-05
Power Module Substrate, Power Module, And Method For Manufacturing Power Module Substrate
App 20150022977 - Kuromitsu; Yoshirou ;   et al.
2015-01-22
Power module substrate, power module, and method for manufacturing power module substrate
Grant 8,921,996 - Kuromitsu , et al. December 30, 2
2014-12-30
Power Module Substrate, Power Module Substrate With Heat Sink, Power Module, And Method Of Manufacturing Power Module Substrate
App 20140192486 - Kuromitsu; Yoshirou ;   et al.
2014-07-10
Power Module Substrate, Power Module, And Method For Manufacturing Power Module Substrate
App 20140078684 - Kuromitsu; Yoshirou ;   et al.
2014-03-20
Power Module Substrate, Power Module, And Method For Manufacturing Power Module Substrate
App 20140071633 - Kuromitsu; Yoshirou ;   et al.
2014-03-13
Power module substrate having heatsink, method for manufacturing the same, power module having heatsink, and power module substrate
Grant 8,637,777 - Hayashi , et al. January 28, 2
2014-01-28
Power Module Substrate, Power Module, And Method For Manufacturing Power Module Substrate
App 20140015140 - Kuromitsu; Yoshirou ;   et al.
2014-01-16
Substrate For Power Module, Substrate With Heat Sink For Power Module, Power Module, Method For Producing Substrate For Power Module, And Method For Producing Substrate With Heat Sink For Power Module
App 20130335921 - Nagatomo; Yoshiyuki ;   et al.
2013-12-19
Power module substrate, power module, and method for manufacturing power module substrate
Grant 8,609,993 - Kuromitsu , et al. December 17, 2
2013-12-17
Power module substrate, power module, and method for manufacturing power module substrate
Grant 8,564,118 - Kuromitsu , et al. October 22, 2
2013-10-22
Ceramic Substrate, Method Of Manufacturing Ceramic Substrate, And Method Of Manufacturing Power Module Substrate
App 20130232783 - Tonomura; Hiroshi ;   et al.
2013-09-12
Method For Producing Substrate For Power Module With Heat Sink, Substrate For Power Module With Heat Sink, And Power Module
App 20130010429 - Tonomura; Hiroshi ;   et al.
2013-01-10
Power element mounting substrate, method of manufacturing the same, power element mounting unit, method of manufacturing the same, and power module
Grant 8,198,540 - Kuromitsu , et al. June 12, 2
2012-06-12
Method for manufacturing power module substrate, power module substrate, and power module
Grant 8,116,084 - Kitahara , et al. February 14, 2
2012-02-14
Power module substrate, method for manufacturing power module substrate, and power module
Grant 8,044,500 - Kitahara , et al. October 25, 2
2011-10-25
Power Module Substrate, Power Module, And Method For Manufacturing Power Module Substrate
App 20110074010 - Kuromitsu; Yoshirou ;   et al.
2011-03-31
Power Module Substrate, Power Module, And Method For Manufacturing Power Module Substrate
App 20110067906 - Kuromitsu; Yoshirou ;   et al.
2011-03-24
Method For Manufacturing Power Module Substrate, Power Module Substrate, And Power Module
App 20100285331 - Kitahara; Takeshi ;   et al.
2010-11-11
Ceramic Substrate, Method Of Manufacturing Ceramic Substrate, And Method Of Manufacturing Power Module Substrate
App 20100258233 - Tonomura; Hiroshi ;   et al.
2010-10-14
Power Module Substrate, Method For Manufacturing Power Module Substrate, And Power Module
App 20090267215 - Kitahara; Takeshi ;   et al.
2009-10-29
Insulating Circuit Board And Insulating Circuit Board Having Cooling Sink
App 20090229864 - Kuromitsu; Yoshirou ;   et al.
2009-09-17
Power Element Mounting Substrate, Method Of Manufacturing The Same, Power Element Mounting Unit, Method Of Manufacturing The Same, And Power Module
App 20090145642 - Kuromitsu; Yoshirou ;   et al.
2009-06-11
MgO vapor deposition material and method for preparation thereof
Grant 7,138,350 - Sakurai , et al. November 21, 2
2006-11-21
Polycrystalline MgO deposition material having adjusted Si concentration
Grant 6,995,104 - Park , et al. February 7, 2
2006-02-07
Protective film for FPD, vapor deposition material for protective film and its production method, FPD, and manufacturing device for FPD protective film
Grant 6,965,125 - Sakurai , et al. November 15, 2
2005-11-15
Blade with comb teeth coated with a compound layer for forming ribs and its production method
Grant 6,872,115 - Sakurai , et al. March 29, 2
2005-03-29
Mgo vapor deposition material and method for preparation thereof
App 20050045065 - Sakurai, Hideaki ;   et al.
2005-03-03
Protective film for FPD, vapor deposition material for protective film and its production method, FPD, and manufacturing device for FPD protective film
Grant 6,828,588 - Sakurai , et al. December 7, 2
2004-12-07
Protective thin film for FPDs, method for producing said thin film and FPDs using said thin film
App 20040234751 - Sakurai, Hideaki ;   et al.
2004-11-25
Protective thin film for FPDS, method for producing said thin film and FPDS using said thin film
Grant 6,821,616 - Sakurai , et al. November 23, 2
2004-11-23
Polycrystalline MgO deposition material having adjusted Si concentration
App 20040131884 - Park, Eung Chul ;   et al.
2004-07-08
Method of forming ceramic capillary rib, ceramic paste used therefor, and apparatus for forming same
App 20040085266 - Kuromitsu, Yoshirou ;   et al.
2004-05-06
Protective film for FPD, vapor deposition material for protective film and its production method, FPD, and manufacturing device for FPD protective film
App 20040053081 - Sakurai, Hideaki ;   et al.
2004-03-18
Blade for forming ribs and its production method
App 20030056313 - Sakurai, Hideaki ;   et al.
2003-03-27
Method Of Forming Ceramic Capillary Rib, Ceramic Paste Used Therefor, And Apparatus For Forming Same
App 20020180353 - KUROMITSU, YOSHIROU ;   et al.
2002-12-05
Paste for forming ceramic ribs, production method for the same and forming method of ribs used the same
App 20020155937 - Uesugi, Ryuji ;   et al.
2002-10-24
Protective film for FPD, vapor deposited material for protective film and its production method, FPD, and manufacturing device for FPD protective film
App 20020074623 - Sakurai, Hideaki ;   et al.
2002-06-20
Ceramic circuit board with heat sink
Grant 6,033,787 - Nagase , et al. March 7, 2
2000-03-07
Ceramic substrate used for fabricating electric or electronic circuit
Grant 5,213,877 - Yoshida , et al. May 25, 1
1993-05-25
Ceramic substrate used for fabricating electric or electronic circuit
Grant 5,130,498 - Yoshida , et al. July 14, 1
1992-07-14

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