Kurokawa; Tetsuya

Patent Applications and Registrations

Patent applications and USPTO patent grants for Kurokawa; Tetsuya.The latest application filed is for "semiconductor device and method of manufacturing the same".

Company Profile

0.6.8

Kurokawa; Tetsuya - Kanagawa JP
KUROKAWA; Tetsuya - Kawasaki JP
Kurokawa; Tetsuya - Fukuoka JP
Kurokawa; Tetsuya - Hyogo JP

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Semiconductor device and method for manufacturing same Grant 7,800,229 - Furuya , et al. September 21, 2	2010-09-21
Semiconductor Device And Method Of Manufacturing The Same App 20100078820 - KUROKAWA; TETSUYA ; et al.	2010-04-01
Semiconductor Device And Method Of Fabricating The Same App 20080203572 - KUROKAWA; Tetsuya ; et al.	2008-08-28
Semiconductor device and method of fabricating the same Grant 7,388,291 - Kurokawa , et al. June 17, 2	2008-06-17
Electrochemical processing apparatus and method of processing a semiconductor device App 20080029402 - Kurokawa; Tetsuya ; et al.	2008-02-07
Semiconductor device and method for manufacturing same App 20070190341 - Furuya; Akira ; et al.	2007-08-16
Semiconductor device including ladder-shaped siloxane hydride and method for manufacturing same Grant 7,230,337 - Usami , et al. June 12, 2	2007-06-12
Semiconductor device and method for manufacturing same App 20060276029 - Usami; Tatsuya ; et al.	2006-12-07
Semiconductor device with guard ring for preventing water from entering circuit region from outside Grant 7,138,700 - Tomita , et al. November 21, 2	2006-11-21
Semiconductor device and method of fabricating the same App 20050189654 - Kurokawa, Tetsuya ; et al.	2005-09-01
Semiconductor device with guard ring for preventing water from entering circuit region from outside App 20040195582 - Tomita, Ryuji ; et al.	2004-10-07
Semiconductor device and method for manufacturing same App 20040173910 - Usami, Tatsuya ; et al.	2004-09-09
Room temperature deodorizing method based on a polymerization reaction, an oxidation reaction and adsorption Grant 6,207,106 - Kurokawa , et al. March 27, 2	2001-03-27
Die pad structure for solder bonding Grant 5,844,306 - Fujita , et al. December 1, 1	1998-12-01

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