Kuroda; Takeo

Patent Applications and Registrations

Patent applications and USPTO patent grants for Kuroda; Takeo.The latest application filed is for "damping material resin compositions, damping materials, restraining-type damping members, and use thereof".

Company Profile

0.3.5

Kuroda; Takeo - Mishima-gun JP
Kuroda; Takeo - Mukoh JP
Kuroda; Takeo - Kyoto JP
Kuroda; Takeo - Mukoh-shi JP
Kuroda, Takeo - Osaka JP

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Photoreactive composition Grant 7,312,013 - Takahashi , et al. December 25, 2	2007-12-25
Photosensitive amine generator, photocurable composition and photoreactive adhesive composition Grant 7,262,231 - Ishizawa , et al. August 28, 2	2007-08-28
Damping material resin compositions, damping materials, restraining-type damping members, and use thereof App 20070012509 - Shimada; Masaki ; et al.	2007-01-18
Photosensitive amine generator, photocurable composition and photoreactive adhesive composition App 20060035995 - Ishizawa; Hideaki ; et al.	2006-02-16
Photoreactive composition App 20040202956 - Takahashi, Katsunori ; et al.	2004-10-14
Reactive hot-melt adhesive composition App 20030187156 - Kuroda, Takeo ; et al.	2003-10-02
Photosensitive amine generator, photocurable composition and photoreactive adhesive composition App 20030166738 - Ishizawa, Hideaki ; et al.	2003-09-04
Hot melt adhesive of cationic polymerizable compound, photoinitiator and phthalate diester Grant 6,608,148 - Kuroda , et al. August 19, 2	2003-08-19

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