Kuroda; Shigeyuki

Patent Applications and Registrations

Patent applications and USPTO patent grants for Kuroda; Shigeyuki.The latest application filed is for "electronic component and mounting structure".

Company Profile

0.14.15

Kuroda; Shigeyuki - Nagaokakyo-shi JP
Kuroda; Shigeyuki - Sabae JP
KURODA; Shigeyuki - Sabae-shi JP
Kuroda, Shigeyuki - Hirakata-shi JP

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Electronic Component And Mounting Structure App 20220044873 - Kuroda; Shigeyuki ; et al.	2022-02-10
Method for manufacturing multilayer electronic component Grant 9,536,643 - Motoki , et al. January 3, 2	2017-01-03
Multilayer electronic component and method for manufacturing the same Grant 9,070,498 - Motoki , et al. June 30, 2	2015-06-30
Multilayer Electronic Component And Method For Manufacturing The Same App 20140312744 - MOTOKI; Akihiro ; et al.	2014-10-23
Multilayer electronic component and method for manufacturing the same Grant 8,804,303 - Motoki , et al. August 12, 2	2014-08-12
Multilayer Electronic Component And Method For Manufacturing The Same App 20140158293 - MOTOKI; Akihiro ; et al.	2014-06-12
Method for manufacturing multilayer electronic component Grant 8,631,549 - Motoki , et al. January 21, 2	2014-01-21
Multilayer Electronic Component And Method For Manufacturing The Same App 20130095233 - MOTOKI; Akihiro ; et al.	2013-04-18
Method for manufacturing laminated electronic component Grant 8,341,815 - Kunishi , et al. January 1, 2	2013-01-01
Multilayer electronic component including a counter diffusion layer Grant 8,184,424 - Motoki , et al. May 22, 2	2012-05-22
Laminated electronic component Grant 8,154,849 - Kunishi , et al. April 10, 2	2012-04-10
Multilayer Electronic Component And Method For Manufacturing Multilayer Electronic Component App 20110162180 - MOTOKI; Akihiro ; et al.	2011-07-07
Multilayer electronic component and method for manufacturing multilayer electronic component Grant 7,933,113 - Motoki , et al. April 26, 2	2011-04-26
Laminated Electronic Component And Method For Manufacturing The Same App 20100243133 - KUNISHI; Tatsuo ; et al.	2010-09-30
Laminated electronic component and method for manufacturing the same Grant 7,719,819 - Motoki , et al. May 18, 2	2010-05-18
Multilayer electronic device and method for manufacturing the same Grant 7,589,952 - Motoki , et al. September 15, 2	2009-09-15
Multilayer Electronic Component And Method For Manufacturing Multilayer Electronic Component App 20080239617 - MOTOKI; Akihiro ; et al.	2008-10-02
Multilayer Electronic Device And Method For Manufacturing The Same App 20080225462 - MOTOKI; Akihiro ; et al.	2008-09-18
Multilayer Electronic Component And Method For Manufacturing The Same App 20080210564 - MOTOKI; Akihiro ; et al.	2008-09-04
Laminated Electronic Component And Method For Manufacturing The Same App 20080151470 - MOTOKI; Akihiro ; et al.	2008-06-26
Laminated Electronic Component And Method For Manufacturing The Same App 20080123248 - Kunishi; Tatsuo ; et al.	2008-05-29
Composite laminate and method for manufacturing the same App 20060046040 - Kameda; Hirokazu ; et al.	2006-03-02
Composite laminate and method for manufacturing the same Grant 6,984,441 - Kameda , et al. January 10, 2	2006-01-10
Composite laminate and method for manufacturing the same App 20030159770 - Kameda, Hirokazu ; et al.	2003-08-28
Composite laminate and method for manufacturing the same Grant 6,579,392 - Kameda , et al. June 17, 2	2003-06-17
Method and apparatus for calculating an environmental indicator and recording medium with calculation program recorded thereon App 20020052810 - Kuroda, Shigeyuki	2002-05-02

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