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name:-0.010523080825806
name:-0.0014820098876953
Kuroda; Shigeo Patent Filings

Kuroda; Shigeo

Patent Applications and Registrations

Patent applications and USPTO patent grants for Kuroda; Shigeo.The latest application filed is for "intermediary transfer belt, manufacturing method of the intermediary transfer belt, and image forming apparatus".

Company Profile
1.9.2
  • Kuroda; Shigeo - Nagoya-shi JP
  • Kuroda; Shigeo - Moriya-shi JP
  • Kuroda; Shigeo - Ohme JP
  • Kuroda; Shigeo - Ome JP
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Intermediary Transfer Belt, Manufacturing Method Of The Intermediary Transfer Belt, And Image Forming Apparatus
App 20200019093 - Tsuruga; Ryosuke ;   et al.
2020-01-16
Image Forming Method And Image Forming Apparatus
App 20090058916 - Kuroda; Shigeo
2009-03-05
Method of manufacturing semiconductor integrated circuit device
Grant 5,223,454 - Uda , et al. June 29, 1
1993-06-29
Wafer scale of full wafer memory system, packaging method thereof, and wafer processing method employed therein
Grant 5,191,224 - Tazunoki , et al. March 2, 1
1993-03-02
Process of manufacturing semiconductor integrated circuit device having trench and field isolation regions
Grant 5,141,888 - Kawaji , et al. August 25, 1
1992-08-25
Semiconductor device having leads for mounting to a surface of a printed circuit board
Grant 5,067,007 - Otsuka , et al. November 19, 1
1991-11-19
Method of manufacturing semiconductor integrated circuit device
Grant 5,049,972 - Uda , et al. September 17, 1
1991-09-17
Process of manufacturing semiconductor integrated circuit device and product formed thereby
Grant 5,011,788 - Kawaji , et al. April 30, 1
1991-04-30
Semiconductor device and method of mounting the semiconductor device
Grant 4,965,653 - Otsuka , et al. October 23, 1
1990-10-23
Semiconductor IC with dual groove isolation
Grant 4,819,054 - Kawaji , et al. April 4, 1
1989-04-04
Electric component part having lead terminals
Grant 4,739,125 - Watanabe , et al. April 19, 1
1988-04-19

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