KURITA; Yoichiro

Patent Applications and Registrations

Patent applications and USPTO patent grants for KURITA; Yoichiro.The latest application filed is for "lidar system".

Company Profile

20.94.109

KURITA; Yoichiro - Minato JP
KURITA; Yoichiro - Minato Tokyo JP
Kurita; Yoichiro - Tokyo JP
Kurita; Yoichiro - Kanagawa JP
Kurita; Yoichiro - Kawasaki N/A JP
KURITA; Yoichiro - Kawasaki-Shi JP

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Lidar System App 20220107397 - HIRONO; Masatoshi ; et al.	2022-04-07
Electronic Device App 20220077081 - KURITA; Yoichiro ; et al.	2022-03-10
Electronic component module Grant 11,239,145 - Kurita , et al. February 1, 2	2022-02-01
Electronic Device App 20210217727 - KURITA; Yoichiro	2021-07-15
Bonding method of semiconductor chip and bonding apparatus of semiconductor chip Grant 11,018,112 - Kurita May 25, 2	2021-05-25
Electronic device Grant 10,991,673 - Kurita April 27, 2	2021-04-27
Electronic Component Module App 20210035900 - KURITA; Yoichiro ; et al.	2021-02-04
Electronic device Grant 10,879,227 - Kurita , et al. December 29, 2	2020-12-29
Bonding method of semiconductor chip and bonding apparatus of semiconductor chip Grant 10,847,497 - Kurita November 24, 2	2020-11-24
Semiconductor device Grant 10,672,750 - Kurita	2020-06-02
Semiconductor device including a re-interconnection layer and method for manufacturing same Grant 10,658,338 - Tajima , et al.	2020-05-19
Electronic Device App 20200118994 - KURITA; Yoichiro ; et al.	2020-04-16
Electronic device Grant 10,580,763 - Kurita , et al.	2020-03-03
Chip transfer member, chip transfer apparatus, and chip transfer method Grant 10,566,219 - Kurita , et al. Feb	2020-02-18
Bonding Method Of Semiconductor Chip And Bonding Apparatus Of Semiconductor Chip App 20200051953 - KURITA; Yoichiro	2020-02-13
Electronic Device App 20200035646 - KURITA; Yoichiro	2020-01-30
Semiconductor device Grant 10,510,725 - Kawasaki , et al. Dec	2019-12-17
Semiconductor device having stacked logic and memory chips Grant 10,497,688 - Tsukiyama , et al. De	2019-12-03
Electronic device Grant 10,475,767 - Kurita Nov	2019-11-12
Optical device and optical coupling module Grant 10,429,598 - Kurita , et al. O	2019-10-01
Optical Semiconductor Module App 20190285814 - FURUYAMA; Hideto ; et al.	2019-09-19
Semiconductor Device And Method For Manufacturing Same App 20190267350 - TAJIMA; Takayuki ; et al.	2019-08-29
Semiconductor device and method for manufacturing same Grant 10,396,060 - Kurita , et al. A	2019-08-27
Chip Transfer Member, Chip Transfer Apparatus, And Chip Transfer Method App 20190252219 - KURITA; Yoichiro ; et al.	2019-08-15
Method of manufacturing a semiconductor device Grant 10,373,929 - Kurita	2019-08-06
Semiconductor Device App 20190229104 - KURITA; Yoichiro	2019-07-25
Electronic Device App 20190206837 - KURITA; Yoichiro	2019-07-04
Semiconductor Device And Method For Manufacturing Same App 20190157252 - KURITA; Yoichiro ; et al.	2019-05-23
Electronic Device App 20190139953 - KURITA; Yoichiro ; et al.	2019-05-09
Semiconductor Device App 20190088634 - TSUKIYAMA; Satoshi ; et al.	2019-03-21
Method Of Manufacturing A Semiconductor Device App 20190088619 - KURITA; Yoichiro	2019-03-21
Semiconductor Device App 20190088625 - KAWASAKI; Kazushige ; et al.	2019-03-21
Electronic device Grant 10,224,318 - Kurita , et al.	2019-03-05
Optical semiconductor module Grant 10,203,460 - Furuyama , et al. Feb	2019-02-12
Semiconductor device and manufacturing method thereof Grant 10,128,223 - Kawasaki , et al. November 13, 2	2018-11-13
Semiconductor Device And Method Of Manufacturing Semiconductor Device App 20180308831 - KURITA; Yoichiro ; et al.	2018-10-25
Semiconductor device including protective film over a substrate Grant 10,096,574 - Tsukiyama , et al. October 9, 2	2018-10-09
Optical Coupling Module App 20180275360 - UEMURA; Hiroshi ; et al.	2018-09-27
Method of manufacturing semiconductor device Grant 10,032,758 - Kurita , et al. July 24, 2	2018-07-24
Semiconductor device including protective film over a substrate Grant 9,972,600 - Tsukiyama , et al. May 15, 2	2018-05-15
Optical Semiconductor Module App 20180128998 - FURUYAMA; Hideto ; et al.	2018-05-10
Electronic Device App 20180019237 - KURITA; Yoichiro ; et al.	2018-01-18
Electronic device Grant 9,847,325 - Kurita , et al. December 19, 2	2017-12-19
Bonding Method Of Semiconductor Chip And Bonding Apparatus Of Semiconductor Chip App 20170309594 - KURITA; Yoichiro	2017-10-26
Semiconductor Device And Manufacturing Method Thereof App 20170287889 - KAWASAKI; Kazushige ; et al.	2017-10-05
Semiconductor Device And Method Of Manufacturing Semiconductor Device App 20170263595 - Kurita; Yoichiro ; et al.	2017-09-14
Electronic Device App 20170236810 - KURITA; Yoichiro ; et al.	2017-08-17
Bonding method of semiconductor chip and bonding apparatus of semiconductor chip Grant 9,728,519 - Kurita August 8, 2	2017-08-08
Semiconductor device and manufacturing method thereof Grant 9,721,935 - Kawasaki , et al. August 1, 2	2017-08-01
Optical Device And Optical Coupling Module App 20170153401 - KURITA; Yoichiro ; et al.	2017-06-01
Semiconductor device and method of manufacturing the same Grant 9,595,507 - Kurita March 14, 2	2017-03-14
Semiconductor Device Including Protective Film Over A Substrate App 20160365336 - TSUKIYAMA; Satoshi ; et al.	2016-12-15
Electronic Device App 20160307875 - KURITA; Yoichiro ; et al.	2016-10-20
Semiconductor Device And Method Of Manufacturing The Same App 20160268232 - KURITA; Yoichiro	2016-09-15
Electronic device Grant 9,406,602 - Kurita , et al. August 2, 2	2016-08-02
Semiconductor device having fan-in and fan-out redistribution layers Grant 9,396,998 - Kurita , et al. July 19, 2	2016-07-19
Semiconductor Device App 20160204092 - KURITA; Yoichiro	2016-07-14
Bonding Method Of Semiconductor Chip And Bonding Apparatus Of Semiconductor Chip App 20160126218 - KURITA; Yoichiro	2016-05-05
Semiconductor device Grant 9,324,699 - Kurita April 26, 2	2016-04-26
Semiconductor Device App 20160079184 - TSUKIYAMA; Satoshi ; et al.	2016-03-17
Semiconductor Memory Device App 20160071604 - KURITA; Yoichiro ; et al.	2016-03-10
Semiconductor Device And Manufacturing Method Thereof App 20150262989 - KAWASAKI; Kazushige ; et al.	2015-09-17
Semiconductor Device And Method For Manufacturing Same App 20150262877 - KURITA; Yoichiro ; et al.	2015-09-17
Electronic Device App 20150137348 - KURITA; Yoichiro ; et al.	2015-05-21
Semiconductor Device And Method Of Manufacturing The Same App 20150069596 - KAWASAKI; Kazushige ; et al.	2015-03-12
Electronic device Grant 8,975,750 - Kurita , et al. March 10, 2	2015-03-10
Semiconductor Device App 20150041978 - KURITA; Yoichiro	2015-02-12
Semiconductor device and method of manufacturing the same Grant 8,916,976 - Tago , et al. December 23, 2	2014-12-23
Electronic Device App 20140346681 - KURITA; Yoichiro ; et al.	2014-11-27
Semiconductor device Grant 8,890,305 - Kurita November 18, 2	2014-11-18
Electronic device Grant 8,823,174 - Kurita , et al. September 2, 2	2014-09-02
Electronic Device App 20140103524 - KURITA; Yoichiro ; et al.	2014-04-17
Electronic device and method of manufacturing the same Grant 8,685,796 - Kurita , et al. April 1, 2	2014-04-01
Electronic device Grant 8,633,591 - Kurita , et al. January 21, 2	2014-01-21
Semiconductor Device App 20130334705 - KURITA; Yoichiro	2013-12-19
Wiring board, semiconductor device, and method for manufacturing wiring board and semiconductor device Grant 8,552,570 - Kikuchi , et al. October 8, 2	2013-10-08
Semiconductor device Grant 8,541,874 - Kurita September 24, 2	2013-09-24
Semiconductor package and method of manufacturing the same Grant 8,456,020 - Kurita , et al. June 4, 2	2013-06-04
Electronic Device App 20130099390 - KURITA; Yoichiro ; et al.	2013-04-25
Method of stacking semiconductor chips including forming an interconnect member and a through electrode Grant 8,395,269 - Kawano , et al. March 12, 2	2013-03-12
Electronic device and method of manufacturing the same Grant 8,354,340 - Kurita , et al. January 15, 2	2013-01-15
Semiconductor device and manufacturing method thereof Grant 8,349,649 - Kurita January 8, 2	2013-01-08
Semiconductor Element And Method Of Manufacturing The Same App 20120322204 - KURITA; Yoichiro	2012-12-20
Electronic device, relay member, and mounting substrate, and method for manufacturing the electronic device Grant 8,304,870 - Kurita November 6, 2	2012-11-06
Semiconductor Device App 20120248620 - KURITA; Yoichiro	2012-10-04
Manufacturing method for electronic devices Grant 8,278,143 - Kurita October 2, 2	2012-10-02
Semiconductor device having a sealing resin and method of manufacturing the same Grant 8,207,605 - Kurita June 26, 2	2012-06-26
Semiconductor device having a sealing resin and method of manufacturing the same Grant 8,193,033 - Kurita June 5, 2	2012-06-05
Method for manufacturing semiconductor device Grant 8,114,766 - Soejima , et al. February 14, 2	2012-02-14
Semiconductor device and method of manufacturing the same Grant 8,058,165 - Kawano , et al. November 15, 2	2011-11-15
Wiring board, semiconductor device, and method of manufacturing the same Grant 8,050,050 - Yamamichi , et al. November 1, 2	2011-11-01
Manufacturing method for electronic devices App 20110253767 - Kurita; Yoichiro	2011-10-20
Semiconductor device Grant 8,039,969 - Kurita October 18, 2	2011-10-18
Multilayered wiring board, semiconductor device in which multilayered wiring board is used, and method for manufacturing the same Grant 8,039,756 - Kikuchi , et al. October 18, 2	2011-10-18
Semiconductor device and method of manufacturing the same Grant 8,035,231 - Kurita , et al. October 11, 2	2011-10-11
Semiconductor device and method of manufacturing the same Grant 8,030,201 - Soejima , et al. October 4, 2	2011-10-04
Electronic device, relay member, and mounting substrate, and method for manufacturing the electronic device App 20110221050 - Kurita; Yoichiro	2011-09-15
Electronic Device And Manufacturing Method Of Electronic Device App 20110221071 - MOTOHASHI; Norikazu ; et al.	2011-09-15
Manufacturing method for electronic devices Grant 7,977,158 - Kurita July 12, 2	2011-07-12
Semiconductor element and method of manufacturing the same App 20110104887 - Kurita; Yoichiro	2011-05-05
Optical transmission apparatus to which optical cable is connected Grant 7,931,411 - Kurita April 26, 2	2011-04-26
Semiconductor Package And Method Of Manufacturing The Same App 20110089561 - KURITA; Yoichiro ; et al.	2011-04-21
Semiconductor Device And Manufacturing Method Thereof App 20110089573 - KURITA; YOICHIRO	2011-04-21
Electronic device and method of manufacturing the same Grant 7,928,001 - Kurita , et al. April 19, 2	2011-04-19
Method of forming metal interconnect layers for flip chip device Grant 7,927,999 - Kurita , et al. April 19, 2	2011-04-19
Wiring Board, Semiconductor Device, And Method Of Manufacturing The Same App 20110075389 - YAMAMICHI; Shintaro ; et al.	2011-03-31
Wiring board, semiconductor device, and method of manufacturing the same Grant 7,889,514 - Yamamichi , et al. February 15, 2	2011-02-15
Wiring board, semiconductor device in which wiring board is used, and method for manufacturing the same Grant 7,880,295 - Kikuchi , et al. February 1, 2	2011-02-01
Semiconductor device and method for manufacturing the same App 20100327427 - Kimura; Takehiro ; et al.	2010-12-30
Semiconductor Device Having A Sealing Resin And Method Of Manufacturing The Same App 20100314749 - KURITA; Yoichiro	2010-12-16
Semiconductor Device And Method Of Manufacturing The Same App 20100297811 - KAWANO; Masaya ; et al.	2010-11-25
Wiring Board, Semiconductor Device, And Method For Manufacturing Wiring Board And Semiconductor Device App 20100295191 - Kikuchi; Katsumi ; et al.	2010-11-25
Manufacturing method for electronic devices App 20100291732 - Kurita; Yoichiro	2010-11-18
Semiconductor device and semiconductor wafer and a method for manufacturing the same Grant 7,812,457 - Kurita October 12, 2	2010-10-12
Semiconductor device Grant 7,812,446 - Kurita October 12, 2	2010-10-12
Semiconductor device and method of manufacturing the same Grant 7,800,233 - Kawano , et al. September 21, 2	2010-09-21
Semiconductor device and method for manufacturing the same Grant 7,795,721 - Kurita September 14, 2	2010-09-14
Wiring board, semiconductor device in which wiring board is used, and method for manufacturing the same Grant 7,791,186 - Kikuchi , et al. September 7, 2	2010-09-07
Manufacturing method for electronic devices Grant 7,772,032 - Kurita August 10, 2	2010-08-10
Flip-chip type semiconductor device Grant 7,763,985 - Kurita , et al. July 27, 2	2010-07-27
Electronic circuit chip, and electronic circuit device and method for manufacturing the same Grant 7,759,786 - Kurita , et al. July 20, 2	2010-07-20
Semiconductor device and method of manufacturing the same App 20100144091 - Kawano; Masaya ; et al.	2010-06-10
Wiring Boad, Semiconductor Device In Which Wiring Board Is Used, And Method For Manufaturing The Same App 20100127405 - KIKUCHI; Katsumi ; et al.	2010-05-27
Semiconductor Device And Method Of Manufacturing The Same App 20100087058 - SOEJIMA; Koji ; et al.	2010-04-08
Semiconductor device including a heat-transmitting and electromagnetic-noise-blocking substance and method of manufacturing the same Grant 7,667,312 - Kawakami , et al. February 23, 2	2010-02-23
Semiconductor device and semiconductor wafer and a method for manufacturing the same Grant 7,663,244 - Kurita February 16, 2	2010-02-16
Semiconductor device Grant 7,656,046 - Kurita , et al. February 2, 2	2010-02-02
Semiconductor device and method of manufacturing the same Grant 7,652,375 - Soejima , et al. January 26, 2	2010-01-26
Optical transmission apparatus to which optical cable is connected App 20090310921 - Kurita; Yoichiro	2009-12-17
Thin planar semiconductor device Grant 7,622,801 - Kurita November 24, 2	2009-11-24
Semiconductor Module Having An Interconnection Structure App 20090273092 - Kurita; Yoichiro ; et al.	2009-11-05
Semiconductor chip and method for manufacturing the same and semiconductor device Grant 7,598,590 - Kawano , et al. October 6, 2	2009-10-06
Method for manufacturing semiconductor module using interconnection structure Grant 7,598,117 - Kurita , et al. October 6, 2	2009-10-06
Semiconductor device with a dummy electrode Grant 7,592,692 - Kurita September 22, 2	2009-09-22
Semiconductor Chip And Method For Manufacturing The Same And Semiconductor Device App 20090224387 - KAWANO; Masaya ; et al.	2009-09-10
Thin planar semiconductor device having electrodes on both surfaces and method of fabricating same Grant 7,556,983 - Kurita July 7, 2	2009-07-07
Flip-chip type semiconductor device Grant 7,554,205 - Kurita , et al. June 30, 2	2009-06-30
Manufacturing method for electronic devices App 20090137082 - Kurita; Yoichiro	2009-05-28
Method of manufacturing electronic circuit device Grant 7,538,022 - Kurita , et al. May 26, 2	2009-05-26
Flip-chip Type Semiconductor Device App 20090051029 - KURITA; Yoichiro ; et al.	2009-02-26
Semiconductor device-composing substrate and semiconductor device Grant 7,495,345 - Kurita , et al. February 24, 2	2009-02-24
Semiconductor Package and Method for Producing Same App 20090001604 - Tanaka; Daisuke ; et al.	2009-01-01
Semiconductor element and method of manufacturing the same App 20080296765 - Kurita; Yoichiro	2008-12-04
Semiconductor Device And Method Of Manufacturing The Same App 20080296779 - MATSUI; Satoshi ; et al.	2008-12-04
Semiconductor Device App 20080265390 - Kurita; Yoichiro	2008-10-30
Semiconductor Device Having A Sealing Resin And Method Of Manufacturing The Same App 20080265434 - Kurita; Yoichiro	2008-10-30
Semiconductor Device And Method Of Manufacturing The Same App 20080237883 - TAGO; Masamoto ; et al.	2008-10-02
Semiconductor Device And Method Of Manufacturing The Same App 20080203565 - KURITA; Yoichiro ; et al.	2008-08-28
Thin Planar Semiconductor Device Having Electrodes On Both Surfaces And Method Of Fabricating Same App 20080169550 - Kurita; Yoichiro	2008-07-17
Semiconductor device and method of manufacturing the same App 20080136020 - Soejima; Koji ; et al.	2008-06-12
Semiconductor device including microstrip line and coplanar line App 20080128916 - Soejima; Koji ; et al.	2008-06-05
Bonding method and bonding apparatus Grant 7,370,786 - Kurita , et al. May 13, 2	2008-05-13
Electronic Device And Method Of Manufacturing The Same App 20080079164 - KURITA; Yoichiro ; et al.	2008-04-03
Electronic Device And Method Of Manufacturing The Same App 20080079157 - Kurita; Yoichiro ; et al.	2008-04-03
Electronic Device And Method Of Manufacturing The Same App 20080079163 - Kurita; Yoichiro ; et al.	2008-04-03
Semiconductor Device And Semiconductor Wafer And A Method For Manufacturing The Same App 20070278698 - KURITA; Yoichiro	2007-12-06
Flip-chip type semiconductor device App 20070216035 - Kurita; Yoichiro ; et al.	2007-09-20
SOI substrate and method for manufacturing the same Grant 7,262,486 - Kawano , et al. August 28, 2	2007-08-28
Semiconductor device App 20070158837 - Kurita; Yoichiro ; et al.	2007-07-12
Flip-chip type semiconductor device, production process for manufacturing such flip-chip type semiconductor device, and production process for manufacturing electronic product using such flip-chip type semiconductor device Grant 7,238,548 - Kurita , et al. July 3, 2	2007-07-03
Semiconductor device and method of manufacturing the same App 20070126085 - Kawano; Masaya ; et al.	2007-06-07
Semiconductor device App 20070090469 - Kurita; Yoichiro	2007-04-26
Method for manufacturing semiconductor module using interconnection structure App 20070086166 - Kurita; Yoichiro ; et al.	2007-04-19
Interconnect substrate and electronic circuit device App 20070080449 - Kurita; Yoichiro ; et al.	2007-04-12
Semiconductor device App 20070080467 - Kurita; Yoichiro	2007-04-12
Multilayered wiring board, semiconductor device in which multilayered wiring board is used, and method for manufacturing the same App 20070079986 - Kikuchi; Katsumi ; et al.	2007-04-12
Wiring board, semiconductor device, and method of manufacturing the same App 20070079987 - Yamamichi; Shintaro ; et al.	2007-04-12
Electronic circuit chip, and electronic circuit device and method for manufacturing the same App 20070080444 - Kurita; Yoichiro ; et al.	2007-04-12
Wiring board, semiconductor device in which wiring board is used, and method for manufacturing the same App 20070080439 - Kikuchi; Katsumi ; et al.	2007-04-12
Semiconductor device and method of manufacturing the same App 20070026662 - Kawano; Masaya ; et al.	2007-02-01
Semiconductor device-composing substrate and semiconductor device App 20070023906 - Kurita; Yoichiro ; et al.	2007-02-01
Method of manufacturing electronic circuit device App 20070020804 - Kurita; Yoichiro ; et al.	2007-01-25
Semiconductor device and method of manufacturing the same App 20060226556 - Kurita; Yoichiro ; et al.	2006-10-12
Thin planar semiconductor device having electrodes on both surfaces and method of fabricating same App 20060128060 - Kurita; Yoichiro	2006-06-15
Thin planar semiconductor device having electrodes on both surfaces and method of fabricating same Grant 7,034,386 - Kurita April 25, 2	2006-04-25
Semiconductor device and method for manufacturing the same App 20060063312 - Kurita; Yoichiro	2006-03-23
Semiconductor device and semiconductor wafer and a method for manufacturing the same App 20060014364 - Kurita; Yoichiro	2006-01-19
Bonding method and bonding apparatus App 20060011706 - Kurita; Yoichiro ; et al.	2006-01-19
Semiconductor chip and method for manufacturing the same and semiconductor device App 20060006493 - Kawano; Masaya ; et al.	2006-01-12
SOI substrate and method for manufacturing the same App 20060001090 - Kawano; Masaya ; et al.	2006-01-05
Bonding method and bonding apparatus Grant 6,932,262 - Kurita , et al. August 23, 2	2005-08-23
Semiconductor device and method for manufacturing the same Grant 6,930,396 - Kurita , et al. August 16, 2	2005-08-16
Flip-chip type semiconductor device, production process for manufacturing such flip-chip type semiconductor device, and production process for manufacturing electronic product using such flip-chip type semiconductor device App 20050040541 - Kurita, Yoichiro ; et al.	2005-02-24
Semiconductor device Grant 6,822,336 - Kurita November 23, 2	2004-11-23
Bonding tool capable of bonding inner leads of tab tapes to electrode pads in high quality and high productivity and bonding method Grant 6,814,274 - Kurita , et al. November 9, 2	2004-11-09
Bonding method and bonding apparatus App 20040214406 - Kurita, Yoichiro ; et al.	2004-10-28
Semiconductor device and manufacturing method thereof Grant 6,753,238 - Kurita June 22, 2	2004-06-22
Electric terminal for an electronic device Grant 6,740,811 - Kurita May 25, 2	2004-05-25
Semiconductor device and method of manufacturing the same App 20040051170 - Kawakami, Satoko ; et al.	2004-03-18
Semiconductor device and method for manufacturing the same App 20030189259 - Kurita, Yoichiro ; et al.	2003-10-09
Semiconductor device and manufacturing method thereof App 20030164547 - Kurita, Yoichiro	2003-09-04
Bonding tool capable of bonding inner leads of tab tapes to electrode pads in high quality and high productivity and bonding method App 20030010812 - Kurita, Yoichiro ; et al.	2003-01-16
Semiconductor device App 20030001253 - Kurita, Yoichiro	2003-01-02
Thin planar semiconductor device having electrodes on both surfaces and method of fabricating same App 20020135057 - Kurita, Yoichiro	2002-09-26
Manufacturing method of semiconductor device App 20020106903 - Kurita, Yoichiro ; et al.	2002-08-08
Electric terminal for an electronic device App 20020066584 - Kurita, Yoichiro	2002-06-06