Kurita; Tomoharu

Patent Applications and Registrations

Patent applications and USPTO patent grants for Kurita; Tomoharu.The latest application filed is for "polyamideimide resin, as well as a colorless and transparent flexible metal-clad laminate and circuit board obtained therefrom".

Company Profile

0.4.5

Kurita; Tomoharu - Shiga JP
Kurita; Tomoharu - Ohtsu JP
Kurita; Tomoharu - Otsu JP
Kurita; Tomoharu - Otsu-shi JP
Kurita; Tomoharu - Ohtsu-shi JP

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Polyamideimide resin, as well as a colorless and transparent flexible metal-clad laminate and circuit board obtained therefrom Grant 8,222,365 - Shimeno , et al. July 17, 2	2012-07-17
Polyamide-imide resin, flexible metal-clad laminate, and flexible printed wiring board Grant 7,728,102 - Kurita , et al. June 1, 2	2010-06-01
Polyamideimide Resin, As Well As A Colorless And Transparent Flexible Metal-clad Laminate And Circuit Board Obtained Therefrom App 20100018756 - Shimeno; Katsuya ; et al.	2010-01-28
Flexible metal-clad laminate and method for producing the same Grant 7,468,197 - Kurita , et al. December 23, 2	2008-12-23
Polyamide-imide resin, flexible metal-clad laminate, and flexible printed wiring board Grant 7,364,799 - Kurita , et al. April 29, 2	2008-04-29
Flexible metal-clad laminate and method for producing the same App 20070009710 - Kurita; Tomoharu ; et al.	2007-01-11
Polyamide-imide resin, flexible metal-clad laminate, and flexible printed wiring board App 20060293498 - Kurita; Tomoharu ; et al.	2006-12-28
Polyamide-imide resin, flexible metal-clad laminate, and flexible printed wiring board App 20050165209 - Kurita, Tomoharu ; et al.	2005-07-28
Flexible metal-clad laminate and process for preparing the same App 20020160211 - Kurita, Tomoharu ; et al.	2002-10-31

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