Kurita; Satoru

Patent Applications and Registrations

Patent applications and USPTO patent grants for Kurita; Satoru.The latest application filed is for "transport apparatus".

Company Profile

7.12.29

Kurita; Satoru - Tokyo JP
Kurita; Satoru - Okayama JP
KURITA; Satoru - Kanagawa JP
KURITA; Satoru - Okayama-shi Okayama-ken
Kurita; Satoru - Saitama JP
Kurita; Satoru - Iruma-shi JP

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Joining material and joining method using same Grant 11,453,053 - Kurita , et al. September 27, 2	2022-09-27
Bonding material and bonding method using same Grant 10,903,185 - Endoh , et al. January 26, 2	2021-01-26
Bonding material and bonding method using same Grant 10,821,558 - Endoh , et al. November 3, 2	2020-11-03
Transport Apparatus App 20200299118 - KURITA; Satoru ; et al.	2020-09-24
Bonding Material And Bonding Method Employing Same App 20200094318 - FUJIMOTO; Hideyuki ; et al.	2020-03-26
Electronic Part Mounting Substrate And Method For Producing Same App 20200083062 - Sunachi; Naoya ; et al.	2020-03-12
Bonding Material And Bonded Product Using Same App 20200035637 - Hori; Tatsuro ; et al.	2020-01-30
Bonding material and bonding method using same Grant 10,543,569 - Kurita , et al. Ja	2020-01-28
Method For Producing Silver Nanowire Ink, Silver Nanowire Ink, And Transparent Conductive Coated Film App 20190382607 - SATO; Kimitaka ; et al.	2019-12-19
Electronic part mounting substrate and method for producing same Grant 10,510,557 - Sunachi , et al. Dec	2019-12-17
Bonding Material And Bonding Method Using Same App 20190283129 - Endoh; Keiichi ; et al.	2019-09-19
Bonding material and bonding method using same Grant 10,328,534 - Endoh , et al.	2019-06-25
Joining Material And Joining Method Using Same App 20190118257 - Kurita; Satoru ; et al.	2019-04-25
Method For Joining Electronic Part Using A Joining Silver Sheet App 20180331063 - KURITA; Satoru ; et al.	2018-11-15
Method of attaching an electronic part to a copper plate having a surface roughness Grant 9,831,157 - Sunachi , et al. November 28, 2	2017-11-28
Bonding Material And Bonding Method Using Same App 20170252874 - Endoh; Keiichi ; et al.	2017-09-07
Metal nanoparticle dispersion, method for producing metal nanoparticle dispersion, and bonding method Grant 9,662,748 - Endoh , et al. May 30, 2	2017-05-30
Bonding Material And Bonding Method Using Same App 20170120395 - Kurita; Satoru ; et al.	2017-05-04
Bonding material and bonding method in which said bonding material is used Grant 9,533,380 - Endoh , et al. January 3, 2	2017-01-03
Joining Silver Sheet, Method For Manufacturing Same, And Method For Joining Electronic Part App 20160254243 - KURITA; Satoru ; et al.	2016-09-01
Electronic Part Mounting Substrate And Method For Producing Same App 20160211195 - Sunachi; Naoya ; et al.	2016-07-21
Bonding Material And Bonding Method Using Same App 20160136763 - Endoh; Keiichi ; et al.	2016-05-19
Metal Paste For Joining, Joining Method And Joined Body App 20160121435 - FURUKAWA; Masashi ; et al.	2016-05-05
Metal Nanoparticle Dispersion, Method For Producing Metal Nanoparticle Dispersion, And Bonding Method App 20160101486 - ENDOH; Keiichi ; et al.	2016-04-14
Bonding material comprising coated silver nanoparticles and bonded object produced using same Grant 9,273,235 - Kurita , et al. March 1, 2	2016-03-01
Bonding Material And Bonding Method In Which Said Bonding Material Is Used App 20150028085 - Endoh; Keiichi ; et al.	2015-01-29
Electronic Part Mounting Substrate And Method For Producing Same App 20140147695 - Sunachi; Naoya ; et al.	2014-05-29
Low-temperature Sinterable Metal Nanoparticle Composition And Electronic Article Formed Using The Composition App 20140120359 - JABLONSKI; Gregory A ; et al.	2014-05-01
Bonding Material And Bonded Object Produced Using Same App 20140113109 - Kurita; Satoru ; et al.	2014-04-24
Bonding Material And Bonding Body, And Bonding Method App 20130323529 - Kurita; Satoru ; et al.	2013-12-05
Metal Nanoparticle Paste, Electronic Component Assembly Using Metal Nanoparticle Paste, Led Module, And Method For Forming Circuit For Printed Wiring Board App 20130265735 - Nakatani; Isao ; et al.	2013-10-10
Method of removing lead, reclaimed metals and reclaimed products App 20100112361 - Kurita; Satoru ; et al.	2010-05-06

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