Kurita; Masaaki

Patent Applications and Registrations

Patent applications and USPTO patent grants for Kurita; Masaaki.The latest application filed is for "liquid jet discharge device".

Company Profile

2.10.12

Kurita; Masaaki - Kanagawa JP
Kurita; Masaaki - Wakayama-city Wakayama
Kurita; Masaaki - Kasugai JP
Kurita; Masaaki - Kasugai-shi JP
Kurita; Masaaki - Hiratsuka N/A JP
Kurita; Masaaki - Hiratsuka-shi JP
Kurita; Masaaki - Mobara JP

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Method for measuring glycated protein using interdigitated electrode Grant 11,262,345 - Ueda , et al. March 1, 2	2022-03-01
Liquid Jet Discharge Device App 20210138786 - Tagawa; Yoshiyuki ; et al.	2021-05-13
Polygon mirror, method for manufacturing polygon mirror, and reflecting mirror Grant 10,451,779 - Kurita , et al. Oc	2019-10-22
Transfer substrate for forming metal wiring and method for forming metal wiring with the transfer substrate Grant 10,256,113 - Ogashiwa , et al.	2019-04-09
Method for Measuring Glycated Protein Using Interdigitated Electrode App 20180246077 - Ueda; Yuki ; et al.	2018-08-30
Polygon Mirror, Method For Manufacturing Polygon Mirror, And Reflecting Mirror App 20170205544 - Kurita; Masaaki ; et al.	2017-07-20
Biosensor And Method For Manufacturing Same App 20150369770 - INOSE; Yuka ; et al.	2015-12-24
Biosensor And Process For Producing Same App 20150362501 - KURITA; Masaaki ; et al.	2015-12-17
Resonator electrode material excellent in aging property, piezoelectric resonator using the same material, and sputtering target made of the same material Grant 9,065,418 - Ogashiwa , et al. June 23, 2	2015-06-23
Transfer substrate for forming metal wiring and method for forming metal wiring using said transfer substrate Grant 8,912,088 - Ogashiwa , et al. December 16, 2	2014-12-16
Transfer Substrate For Forming Metal Wiring Line And Method For Forming Metal Wiring Line By Means Of Said Transfer Substrate App 20140262003 - Ogashiwa; Toshinori ; et al.	2014-09-18
Transfer Substrate For Forming Metal Wiring And Method For Forming Metal Wiring Using Said Transfer Substrate App 20130196504 - Ogashiwa; Toshinori ; et al.	2013-08-01
Oscillator Electrode Material Having Excellent Aging Characteristics, Piezoelectric Oscillator Using The Material And Sputtering Target Comprising The Material App 20120248943 - Ogashiwa; Toshinori ; et al.	2012-10-04
Display device and method of manufacturing the same Grant 7,388,228 - Tanabe , et al. June 17, 2	2008-06-17
Display device and method of manufacturing the same App 20050242354 - Tanabe, Hideo ; et al.	2005-11-03
Display device with an improved contact hole arrangement for contacting a semiconductor layer through an insulation film Grant 6,936,847 - Tanabe , et al. August 30, 2	2005-08-30
Display device with an improved contact hole arrangement for contacting a semiconductor layer through an insulation film App 20030209709 - Tanabe, Hideo ; et al.	2003-11-13
Display device with an improved contact hole arrangement for contacting a semiconductor layer through an insulation film Grant 6,624,443 - Tanabe , et al. September 23, 2	2003-09-23
Display device and method of manufacturing the same App 20020104992 - Tanabe, Hideo ; et al.	2002-08-08

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