loadpatents
name:-0.0097708702087402
name:-0.0088179111480713
name:-0.00048398971557617
Kurimoto; Satoru Patent Filings

Kurimoto; Satoru

Patent Applications and Registrations

Patent applications and USPTO patent grants for Kurimoto; Satoru.The latest application filed is for "copper-based slide member".

Company Profile
0.8.7
  • Kurimoto; Satoru - Inuyama JP
  • Kurimoto; Satoru - Nagoya JP
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Copper-based slide member
Grant 9,039,965 - Toda , et al. May 26, 2
2015-05-26
Thrust bearing for turbocharger of internal-combustion engine
Grant 8,790,574 - Toda , et al. July 29, 2
2014-07-29
Copper-based Slide Member
App 20130089459 - Toda; Kazuaki ;   et al.
2013-04-11
Thrust Bearing For Turbocharger Of Internal-combustion Engine
App 20120251383 - Toda; Kazuaki ;   et al.
2012-10-04
Sliding material made of copper alloy, method of producing same, sliding bearing material, and method of producing same
Grant 6,905,779 - Sakai , et al. June 14, 2
2005-06-14
Sliding material made of copper alloy, method of producing same, sliding bearing material, and method of producing same
App 20040161625 - Sakai, Kenji ;   et al.
2004-08-19
Copper-based sliding material, method of manufacturing the same, and sliding bearing
Grant 6,692,548 - Sakai , et al. February 17, 2
2004-02-17
Copper alloy sliding material
Grant 6,652,675 - Sakai , et al. November 25, 2
2003-11-25
Composite sliding material
Grant 6,602,615 - Sakai , et al. August 5, 2
2003-08-05
Composite sliding material
App 20030008169 - Sakai, Kenji ;   et al.
2003-01-09
Copper-based sliding material, method of manufacturing the same, and sliding bearing
App 20020026855 - Sakai, Kenji ;   et al.
2002-03-07
Copper alloy sliding material
Grant 6,334,914 - Sakai , et al. January 1, 2
2002-01-01
Copper alloy sliding material
App 20010021353 - Sakai, Kenji ;   et al.
2001-09-13
Copper alloy sliding material
App 20010019779 - Sakai, Kenji ;   et al.
2001-09-06

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