Kurihara; Tetsuo
Patent Applications and Registrations
Patent applications and USPTO patent grants for Kurihara; Tetsuo.The latest application filed is for "polyamide resin molded body".
- Kurihara; Tetsuo - Tokyo JP
- Kurihara; Tetsuo - Chiyoda-ku JP
- Kurihara; Tetsuo - Utsunomiya JP
| Patent | Date |
|---|---|
| Polyamide resin molded body Grant 10,767,046 - Kurihara , et al. Sep | 2020-09-08 |
| Polyamide Resin Molded Body App 20190169431 - KURIHARA; Tetsuo ; et al. | 2019-06-06 |
| Polyamide resin composition, polyamide resin composition pellet group, molded article, and method for producing a polyamide resin composition Grant 10,066,104 - I , et al. September 4, 2 | 2018-09-04 |
| Polyamide Resin Composition, Polyamide Resin Composition Pellet Group, Molded Article, And Method For Producing A Polyamide Resin Composition App 20170267861 - I; Shunichiro ; et al. | 2017-09-21 |
| Reinforced polyamide resin pellet Grant 9,260,585 - Sasaki , et al. February 16, 2 | 2016-02-16 |
| Reinforced Polyamide Resin Pellet App 20140135441 - Sasaki; Yukiyoshi ; et al. | 2014-05-15 |
| Resin composition Grant 8,691,898 - Kamo , et al. April 8, 2 | 2014-04-08 |
| Resin Composition App 20070270530 - Kamo; Hiroshi ; et al. | 2007-11-22 |
| Heat exchanger Grant 4,379,486 - Kurihara April 12, 1 | 1983-04-12 |
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