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Patent applications and USPTO patent grants for Kurematsu; Yasumi.The latest application filed is for "inline-type wafer conveyance device".
Patent | Date |
---|---|
Substrate supporting/transferring tray Grant 8,147,242 - Shibagaki , et al. April 3, 2 | 2012-04-03 |
Inline-type wafer conveyance device Grant 8,092,139 - Watanabe , et al. January 10, 2 | 2012-01-10 |
Inline-type wafer conveyance device Grant 8,016,537 - Watanabe , et al. September 13, 2 | 2011-09-13 |
Inline-type Wafer Conveyance Device App 20100239394 - Watanabe; Naoki ;   et al. | 2010-09-23 |
Inline-type Wafer Conveyance Device App 20100215460 - Watanabe; Naoki ;   et al. | 2010-08-26 |
Substrate supporting/transferring tray Grant 7,780,440 - Shibagaki , et al. August 24, 2 | 2010-08-24 |
Inline-type Wafer Conveyance Device App 20100189532 - Watanabe; Naoki ;   et al. | 2010-07-29 |
Substrate heat treatment apparatus and substrate transfer tray used in substrate heat treatment Grant 7,732,739 - Shibagaki , et al. June 8, 2 | 2010-06-08 |
Substrate Supporting/transferring Tray App 20100084392 - SHIBAGAKI; Masami ;   et al. | 2010-04-08 |
Substrate Supporting/Transferring Tray App 20080128969 - Shibagaki; Masami ;   et al. | 2008-06-05 |
Substrate Heat Treatment Apparatus And Substrate Transfer Tray Used In Substrate Heat Treatment App 20070194001 - Shibagaki; Masami ;   et al. | 2007-08-23 |
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