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name:-0.0067780017852783
name:-0.00059103965759277
Kurematsu; Yasumi Patent Filings

Kurematsu; Yasumi

Patent Applications and Registrations

Patent applications and USPTO patent grants for Kurematsu; Yasumi.The latest application filed is for "inline-type wafer conveyance device".

Company Profile
0.5.6
  • Kurematsu; Yasumi - Fuchu JP
  • Kurematsu; Yasumi - Tokyo JP
  • Kurematsu; Yasumi - Fuchu-shi JP
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Substrate supporting/transferring tray
Grant 8,147,242 - Shibagaki , et al. April 3, 2
2012-04-03
Inline-type wafer conveyance device
Grant 8,092,139 - Watanabe , et al. January 10, 2
2012-01-10
Inline-type wafer conveyance device
Grant 8,016,537 - Watanabe , et al. September 13, 2
2011-09-13
Inline-type Wafer Conveyance Device
App 20100239394 - Watanabe; Naoki ;   et al.
2010-09-23
Inline-type Wafer Conveyance Device
App 20100215460 - Watanabe; Naoki ;   et al.
2010-08-26
Substrate supporting/transferring tray
Grant 7,780,440 - Shibagaki , et al. August 24, 2
2010-08-24
Inline-type Wafer Conveyance Device
App 20100189532 - Watanabe; Naoki ;   et al.
2010-07-29
Substrate heat treatment apparatus and substrate transfer tray used in substrate heat treatment
Grant 7,732,739 - Shibagaki , et al. June 8, 2
2010-06-08
Substrate Supporting/transferring Tray
App 20100084392 - SHIBAGAKI; Masami ;   et al.
2010-04-08
Substrate Supporting/Transferring Tray
App 20080128969 - Shibagaki; Masami ;   et al.
2008-06-05
Substrate Heat Treatment Apparatus And Substrate Transfer Tray Used In Substrate Heat Treatment
App 20070194001 - Shibagaki; Masami ;   et al.
2007-08-23

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