| Patent | Date |
|---|
Heat pipe
Grant 11,384,993 - Kurashima , et al. July 12, 2 | 2022-07-12 |
Loop heat pipe
Grant 11,333,443 - Tanaka , et al. May 17, 2 | 2022-05-17 |
Flat Loop Heat Pipe
App 20220011055 - Kurashima; Nobuyuki | 2022-01-13 |
Flat loop heat pipe
Grant 11,143,461 - Kurashima October 12, 2 | 2021-10-12 |
Loop heat pipe
Grant 10,962,301 - Kurashima March 30, 2 | 2021-03-30 |
Loop-type Heat Pipe
App 20200378686 - Machida; Yoshihiro ; et al. | 2020-12-03 |
Loop heat pipe and method of manufacturing loop heat pipe
Grant 10,712,098 - Kurashima | 2020-07-14 |
Loop heat pipe
Grant 10,704,838 - Machida , et al. | 2020-07-07 |
Loop Heat Pipe
App 20200096261 - Tanaka; Koichi ; et al. | 2020-03-26 |
Loop Heat Pipe
App 20200025463 - KURASHIMA; Nobuyuki | 2020-01-23 |
Loop heat pipe and electronic device
Grant 10,524,388 - Machida , et al. Dec | 2019-12-31 |
Loop heat pipe and electronic device
Grant 10,495,386 - Kiso , et al. De | 2019-12-03 |
Heat pipe
Grant 10,497,640 - Kurashima De | 2019-12-03 |
Heat Pipe
App 20190277574 - KURASHIMA; Nobuyuki ; et al. | 2019-09-12 |
Loop heat pipe
Grant 10,408,546 - Kurashima , et al. Sept | 2019-09-10 |
Flat Loop Heat Pipe
App 20190264989 - Kurashima; Nobuyuki | 2019-08-29 |
Heat pipe
Grant 10,352,626 - Kurashima , et al. July 16, 2 | 2019-07-16 |
Loop Heat Pipe And Electronic Device
App 20190204017 - KISO; Takahiko ; et al. | 2019-07-04 |
Loop Heat Pipe And Electronic Device
App 20190090385 - Machida; Yoshihiro ; et al. | 2019-03-21 |
Loop Heat Pipe And Method Of Manufacturing Loop Heat Pipe
App 20190017749 - KURASHIMA; Nobuyuki | 2019-01-17 |
Heat Pipe
App 20190013257 - Kurashima; Nobuyuki | 2019-01-10 |
Heat Pipe
App 20180164043 - KURASHIMA; Nobuyuki ; et al. | 2018-06-14 |
Loop Heat Pipe
App 20180142960 - KURASHIMA; Nobuyuki ; et al. | 2018-05-24 |
Loop Heat Pipe
App 20180058767 - MACHIDA; Yoshihiro ; et al. | 2018-03-01 |
Electronic component incorporated substrate and method for manufacturing electronic component incorporated substrate
Grant 9,137,900 - Tanaka , et al. September 15, 2 | 2015-09-15 |
Electronic component built-in substrate
Grant 9,059,088 - Kurashima , et al. June 16, 2 | 2015-06-16 |
Electronic component incorporated substrate
Grant 9,036,362 - Tanaka , et al. May 19, 2 | 2015-05-19 |
Built-in electronic component substrate and method for manufacturing the substrate
Grant 8,987,919 - Tanaka , et al. March 24, 2 | 2015-03-24 |
Built-in Electronic Component Substrate And Method For Manufacturing The Substrate
App 20140210109 - TANAKA; Koichi ; et al. | 2014-07-31 |
Semiconductor device
Grant 8,736,053 - Tanaka , et al. May 27, 2 | 2014-05-27 |
Electronic Component Incorporated Substrate And Method For Manufacturing Electronic Component Incorporated Substrate
App 20140063768 - Tanaka; Koichi ; et al. | 2014-03-06 |
Electronic Component Incorporated Substrate
App 20140063764 - TANAKA; Koichi ; et al. | 2014-03-06 |
Electronic Component Built-in Substrate And Method Of Manufacturing The Same
App 20140054773 - KURASHIMA; Nobuyuki ; et al. | 2014-02-27 |
Semiconductor device manufacturing method
Grant 8,575,030 - Minamihaba , et al. November 5, 2 | 2013-11-05 |
CMP slurry for metallic film, polishing method and method of manufacturing semiconductor device
Grant 8,337,715 - Minamihaba , et al. December 25, 2 | 2012-12-25 |
Method Of Manufacturing Semiconductor Device, And Semiconductor Device
App 20120319274 - TANAKA; Koichi ; et al. | 2012-12-20 |
Manufacturing method of a semiconductor device
Grant 8,174,125 - Kurashima , et al. May 8, 2 | 2012-05-08 |
Semiconductor Device Manufacturing Method
App 20120034846 - MINAMIHABA; Gaku ; et al. | 2012-02-09 |
Cleaning Apparatus And Method Of Fabricating Semiconductor Device
App 20110192420 - KURASHIMA; Nobuyuki ; et al. | 2011-08-11 |
Post-cmp Treating Liquid And Manufacturing Method Of Semiconductor Device Using The Same
App 20110195888 - KURASHIMA; Nobuyuki ; et al. | 2011-08-11 |
Post-CMP treating liquid and manufacturing method of semiconductor device using the same
Grant 7,951,717 - Kurashima , et al. May 31, 2 | 2011-05-31 |
CMP slurry for metallic film, polishing method and method of manufacturing semiconductor device
App 20110062374 - Minamihaba; Gaku ; et al. | 2011-03-17 |
CMP slurry for metallic film, polishing method and method of manufacturing semiconductor device
Grant 7,842,191 - Minamihaba , et al. November 30, 2 | 2010-11-30 |
Aqueous dispersion for CMP, polishing method and method for manufacturing semiconductor device
Grant 7,833,431 - Minamihaba , et al. November 16, 2 | 2010-11-16 |
Method of manufacturing electronic component integrated substrate
Grant 7,827,681 - Kurashima , et al. November 9, 2 | 2010-11-09 |
Method of manufacturing semiconductor device
Grant 7,825,028 - Kurashima , et al. November 2, 2 | 2010-11-02 |
Mold Resin Molding Method And Mold Resin Molding Apparatus
App 20100155992 - Kurashima; Nobuyuki ; et al. | 2010-06-24 |
Post-cmp Treating Liquid And Manufacturing Method Of Semiconductor Device Using The Same
App 20100093585 - Kurashima; Nobuyuki ; et al. | 2010-04-15 |
Post-CMP treating liquid and manufacturing method of semiconductor device using the same
Grant 7,655,559 - Kurashima , et al. February 2, 2 | 2010-02-02 |
Manufacturing Method Of A Semiconductor Device
App 20090184415 - Kurashima; Nobuyuki ; et al. | 2009-07-23 |
Chemical Mechanical Polishing Slurry And Semiconductor Device Manufacturing Method
App 20090176372 - MINAMIHABA; Gaku ; et al. | 2009-07-09 |
Manufacturing method of a semiconductor device
Grant 7,521,350 - Kurashima , et al. April 21, 2 | 2009-04-21 |
Polishing Liquid And Method For Manufacturing Semiconductor Device
App 20090068840 - MINAMIHABA; Gaku ; et al. | 2009-03-12 |
Method of manunfacturing semiconductor device
App 20090061626 - Kurashima; Nobuyuki ; et al. | 2009-03-05 |
Through electrode and method for forming the same
Grant 7,498,259 - Yamano , et al. March 3, 2 | 2009-03-03 |
Method for fabricating semiconductor device and polishing method
Grant 7,494,931 - Fukushima , et al. February 24, 2 | 2009-02-24 |
Method Of Manufacturing Electronic Component Integrated Substrate
App 20080307642 - Kurashima; Nobuyuki ; et al. | 2008-12-18 |
Post-cmp Treating Liquid And Manufacturing Method Of Semiconductor Device Using The Same
App 20080216415 - KURASHIMA; Nobuyuki ; et al. | 2008-09-11 |
Semiconductor device including a discontinuous film and method for manufacturing the same
App 20080124927 - Minamihaba; Gaku ; et al. | 2008-05-29 |
Cleaning Composition, Cleaning Method, And Manufacturing Method Of Semiconductor Device
App 20080045016 - Andou; Michiaki ; et al. | 2008-02-21 |
Semiconductor device including a discontinuous film and method for manufacturing the same
Grant 7,307,344 - Minamihaba , et al. December 11, 2 | 2007-12-11 |
Slurry for touch-up CMP and method of manufacturing semiconductor device
App 20070232068 - Minamihaba; Gaku ; et al. | 2007-10-04 |
Post-cmp Treating Liquid And Manufacturing Method Of Semiconductor Device Using The Same
App 20070190770 - Kurashima; Nobuyuki ; et al. | 2007-08-16 |
Aqueous Dispersion For Cmp, Polishing Method And Method For Manufacturing Semiconductor Device
App 20070128873 - MINAMIHABA; Gaku ; et al. | 2007-06-07 |
CMP slurry and method of manufacturing semiconductor device
Grant 7,198,729 - Kurashima , et al. April 3, 2 | 2007-04-03 |
Method for fabricating semiconductor device and polishing method
App 20070072427 - Fukushima; Dai ; et al. | 2007-03-29 |
Aqueous dispersion for chemical mechanical polishing, kit for preparing the aqueous dispersion, chemical mechanical polishing process, and process for producing semiconductor devices
App 20070049180 - Shida; Hirotaka ; et al. | 2007-03-01 |
Through electrode and method for forming the same
App 20060267210 - Yamano; Takaharu ; et al. | 2006-11-30 |
CMP slurry for metallic film, polishing method and method of manufacturing semiconductor device
App 20060243702 - Minamihaba; Gaku ; et al. | 2006-11-02 |
Method of manufacturing semiconductor device
Grant 7,105,423 - Yamano , et al. September 12, 2 | 2006-09-12 |
Manufacturing method of a semiconductor device
App 20060151888 - Kurashima; Nobuyuki ; et al. | 2006-07-13 |
Semiconductor device and method for manufacturing the same
App 20060131751 - Minamihaba; Gaku ; et al. | 2006-06-22 |
Semiconductor device containing a dummy wire
Grant 7,042,099 - Kurashima , et al. May 9, 2 | 2006-05-09 |
Polishing slurry for use in CMP of SiC series compound, polishing method, and method of manufacturing semiconductor device
Grant 6,995,090 - Minamihaba , et al. February 7, 2 | 2006-02-07 |
Method of manufacturing semiconductor device
App 20060012047 - Kurashima; Nobuyuki ; et al. | 2006-01-19 |
Through electrode and method for forming the same
App 20060001173 - Yamano; Takaharu ; et al. | 2006-01-05 |
Method of manufacturing semiconductor device
App 20050255686 - Yamano, Takaharu ; et al. | 2005-11-17 |
Method of manufacturing semiconductor device
App 20050218008 - Fukushima, Dai ; et al. | 2005-10-06 |
Semiconductor device fabrication method and apparatus
Grant 6,945,854 - Kurashima , et al. September 20, 2 | 2005-09-20 |
Chemical mechanical polishing aqueous dispersion and chemical mechanical polishing method
Grant 6,935,928 - Uchikura , et al. August 30, 2 | 2005-08-30 |
Slurry for chemical mechanical polishing and method of manufacturing semiconductor device
Grant 6,924,227 - Minamihaba , et al. August 2, 2 | 2005-08-02 |
Post-CMP treating liquid and method for manufacturing semiconductor device
App 20050118819 - Minamihaba, Gaku ; et al. | 2005-06-02 |
Semiconductor device fabrication method and apparatus
App 20050113001 - Kurashima, Nobuyuki ; et al. | 2005-05-26 |
Post-CMP treating liquid and method for manufacturing semiconductor device
Grant 6,858,539 - Minamihaba , et al. February 22, 2 | 2005-02-22 |
Chemical mechanical polishing aqueous dispersion and chemical mechanical polishing method
App 20050037693 - Uchikura, Kazuhito ; et al. | 2005-02-17 |
CMP slurry and method of manufacturing semiconductor device
App 20050003666 - Kurashima, Nobuyuki ; et al. | 2005-01-06 |
CMP slurry and method of manufacturing semiconductor device
Grant 6,790,769 - Kurashima , et al. September 14, 2 | 2004-09-14 |
Semiconductor device and its manufacturing method
App 20040119164 - Kurashima, Nobuyuki ; et al. | 2004-06-24 |
Method of manufacturing semiconductor device
Grant 6,737,363 - Miyajima , et al. May 18, 2 | 2004-05-18 |
Post-CMP treating liquid and method for manufacturing semiconductor device
App 20040082180 - Minamihaba, Gaku ; et al. | 2004-04-29 |
Polishing apparatus, polishing method and method of manufacturing semiconductor device
App 20040002292 - Fukushima, Dai ; et al. | 2004-01-01 |
Polishing slurry for use in CMPof SiC series compound, polishing method, and method of manufacturing semiconductor device
App 20030124850 - Minamihaba, Gaku ; et al. | 2003-07-03 |
CMP slurry and method of manufacturing semiconductor device
App 20030100186 - Kurashima, Nobuyuki ; et al. | 2003-05-29 |
Method of manufacturing semiconductor device
App 20020061657 - Miyajima, Hideshi ; et al. | 2002-05-23 |
Slurry for chemical mechanical polishing and method of manufacturing semiconductor device
App 20020023389 - Minamihaba, Gaku ; et al. | 2002-02-28 |
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