Kuramoto; Takeo

Patent Applications and Registrations

Patent applications and USPTO patent grants for Kuramoto; Takeo.The latest application filed is for "solder bump formation on a circuit board using a transfer sheet".

Company Profile

0.9.5

Kuramoto; Takeo - Atsugi JP
Kuramoto; Takeo - Kanagawa JP
Kuramoto, Takeo - Atsugi-shi JP
Kuramoto, Takeo - Tokyo JP

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Solder precoating method and workpiece for electronic equipment Grant 9,821,397 - Kuramoto , et al. November 21, 2	2017-11-21
Solder bump formation on a circuit board using a transfer sheet Grant 8,701,973 - Kuramoto , et al. April 22, 2	2014-04-22
Solder Bump Formation On A Circuit Board Using A Transfer Sheet App 20110297433 - Kuramoto; Takeo ; et al.	2011-12-08
Solder Precoating Method and Workpiece For Electronic Equipment App 20080213613 - Kuramoto; Takeo ; et al.	2008-09-04
Solder ball assembly for bump formation and method for its manufacture Grant 7,112,888 - Kuramoto , et al. September 26, 2	2006-09-26
Solder ball assembly, a method for its manufacture, and a method of forming solder bumps Grant 6,919,634 - Kuramoto , et al. July 19, 2	2005-07-19
Solder ball assembly for bump formation and method for its manufacture App 20040145064 - Kuramoto, Takeo ; et al.	2004-07-29
Solder ball assembly, a method for its manufacture, and a method of forming solder bumps App 20040070084 - Kuramoto, Takeo ; et al.	2004-04-15
Solder circuit App 20010020744 - Kuramoto, Takeo ; et al.	2001-09-13
Ampere-volt-wattmeter or the like Grant D271,948 - Kuramoto December 27, 1	1983-12-27
Volt-ohm-ammeter or the like Grant D264,057 - Kuramoto April 27, 1	1982-04-27
Volt-ohm-ammeter or the like Grant D256,896 - Kuramoto September 16, 1	1980-09-16

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