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name:-0.007127046585083
name:-0.00037193298339844
Kuramitsu; Hideki Patent Filings

Kuramitsu; Hideki

Patent Applications and Registrations

Patent applications and USPTO patent grants for Kuramitsu; Hideki.The latest application filed is for "electrochemical sensor device and electrochemical measuring method using the same".

Company Profile
0.7.4
  • Kuramitsu; Hideki - Toyama JP
  • Kuramitsu; Hideki - Toyama-shi JP
  • Kuramitsu; Hideki - Osaka JP
  • Kuramitsu; Hideki - Hirakata JP
  • Kuramitsu, Hideki - Hirakata-shi JP
  • Kuramitsu; Hideki - Neyagawa JP
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Electrochemical sensor device and electrochemical measuring method using the same
Grant 8,303,800 - Fukuda , et al. November 6, 2
2012-11-06
Electrochemical Sensor Device And Electrochemical Measuring Method Using The Same
App 20110042237 - Fukuda; Junji ;   et al.
2011-02-24
Capacitor and production method therefor
Grant 7,049,679 - Nagai , et al. May 23, 2
2006-05-23
Laminated ceramic electronic component and method of manufacturing the electronic component
Grant 7,042,706 - Nagai , et al. May 9, 2
2006-05-09
Multilayer ceramic electronic component manufacturing method including a sintered adhesive layer with a resin and inorganic powder
Grant 7,014,725 - Nagai , et al. March 21, 2
2006-03-21
Electronic device of ceramic
Grant 6,780,267 - Kuramitsu , et al. August 24, 2
2004-08-24
Laminated ceramic electronic component and method of manufacturing the electronic component
App 20040090721 - Nagai, Atsuo ;   et al.
2004-05-13
Capacitor and production method therefor
App 20040087102 - Nagai, Atsuo ;   et al.
2004-05-06
Multilayer ceramic electronic component manufacturing method
App 20040070903 - Nagai, Atsuo ;   et al.
2004-04-15
Method of manufacturing ceramic electronic components
Grant 6,602,370 - Kuramitsu , et al. August 5, 2
2003-08-05
Method for manufacturing a ceramic electronic component by electroless metal plating
Grant 4,311,729 - Itakura , et al. January 19, 1
1982-01-19

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