Kuraishi; Fumio
Patent Applications and Registrations
Patent applications and USPTO patent grants for Kuraishi; Fumio.The latest application filed is for "semiconductor package having a heat slug".
- Kuraishi; Fumio - Nagano JP
| Patent | Date |
|---|---|
| Semiconductor package having a heat slug Grant 6,081,426 - Takeda , et al. June 27, 2 | 2000-06-27 |
| Method for producing a semiconductor package Grant 6,074,567 - Kuraishi , et al. June 13, 2 | 2000-06-13 |
| Semiconductor device having tab tape lead frame with reinforced outer leads Grant 5,859,471 - Kuraishi , et al. January 12, 1 | 1999-01-12 |
| Tape automated bonding in semiconductor technique Grant 5,384,204 - Yumoto , et al. January 24, 1 | 1995-01-24 |
| Semiconductor device having tab tape Grant 5,365,107 - Kuraishi , et al. November 15, 1 | 1994-11-15 |
| Semiconductor device and lead frame used therefor Grant 4,809,053 - Kuraishi February 28, 1 | 1989-02-28 |
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