Kuo; Yian-Liang

Patent Applications and Registrations

Patent applications and USPTO patent grants for Kuo; Yian-Liang.The latest application filed is for "pad structure for enhanced bondability".

Company Profile

9.39.41

Kuo; Yian-Liang - Hsinchu City TW
Kuo; Yian-Liang - Hsinchu TW
Kuo; Yian-Liang - Toufen Township TW
Kuo; Yian-Liang - Hsin-Chu TW
Kuo; Yian-Liang - Miaoli County TW
Kuo, Yian-Liang - Hsin-Chu City TW

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Pad Structure For Enhanced Bondability App 20220139838 - Huang; Ru-Ying ; et al.	2022-05-05
Pad structure for enhanced bondability Grant 11,227,836 - Huang , et al. January 18, 2	2022-01-18
Method Of Analyzing Semiconductor Structure App 20210172995 - LIU; YI MIN ; et al.	2021-06-10
Interconnect Structures, Packaged Semiconductor Devices, and Methods of Packaging Semiconductor Devices App 20210098435 - Tu; Chia-Wei ; et al.	2021-04-01
Method of analyzing semiconductor structure Grant 10,955,459 - Liu , et al. March 23, 2	2021-03-23
Interconnect structures, packaged semiconductor devices, and methods of packaging semiconductor devices Grant 10,867,975 - Tu , et al. December 15, 2	2020-12-15
Integrated circuit packages and methods for forming the same Grant 10,770,366 - Tu , et al. Sep	2020-09-08
Pad Structure For Enhanced Bondability App 20200126920 - Huang; Ru-Ying ; et al.	2020-04-23
Integrated Circuit Packages and Methods for Forming the Same App 20200091027 - Tu; Chia-Wei ; et al.	2020-03-19
Method Of Analyzing Semiconductor Structure App 20200003825 - LIU; Yi Min ; et al.	2020-01-02
Integrated circuit packages and methods for forming the same Grant 10,510,635 - Tu , et al. Dec	2019-12-17
Packaging structures of integrated circuits Grant 10,453,818 - Tsai , et al. Oc	2019-10-22
Interconnect Structures, Packaged Semiconductor Devices, and Methods of Packaging Semiconductor Devices App 20190273071 - Tu; Chia-Wei ; et al.	2019-09-05
Interconnect structures, packaged semiconductor devices, and methods of packaging semiconductor devices Grant 10,340,258 - Tu , et al.	2019-07-02
Methods and apparatus of packaging semiconductor devices Grant 10,269,750 - Tu , et al.	2019-04-23
Integrated Circuit Packages and Methods for Forming the Same App 20180308778 - Tu; Chia-Wei ; et al.	2018-10-25
Integrated circuit packages and methods for forming the same Grant 10,056,312 - Tu , et al. August 21, 2	2018-08-21
Packaging Structures of Integrated Circuits App 20180151528 - Tsai; Tsung-Fu ; et al.	2018-05-31
Integrated Circuit Packages and Methods for Forming the Same App 20180025959 - Tu; Chia-Wei ; et al.	2018-01-25
Integrated circuit packages and methods for forming the same Grant 9,780,009 - Tu , et al. October 3, 2	2017-10-03
Methods and Apparatus of Packaging Semiconductor Devices App 20170256512 - Tu; Chia-Wei ; et al.	2017-09-07
Methods and apparatus of packaging semiconductor devices Grant 9,659,890 - Tu , et al. May 23, 2	2017-05-23
Protecting flip-chip package using pre-applied fillet Grant 9,620,414 - Tsai , et al. April 11, 2	2017-04-11
Interconnect Structures, Packaged Semiconductor Devices, and Methods of Packaging Semiconductor Devices App 20160322336 - Tu; Chia-Wei ; et al.	2016-11-03
Integrated Circuit Packages and Methods for Forming the Same App 20160086867 - Tu; Chia-Wei ; et al.	2016-03-24
Methods and Apparatus of Packaging Semiconductor Devices App 20160005704 - Tu; Chia-Wei ; et al.	2016-01-07
Integrated circuit packages and methods for forming the same Grant 9,196,532 - Tu , et al. November 24, 2	2015-11-24
Protecting Flip-Chip Package using Pre-Applied Fillet App 20150287640 - Tsai; Tsung-Fu ; et al.	2015-10-08
Methods and apparatus of packaging semiconductor devices Grant 9,136,235 - Tu , et al. September 15, 2	2015-09-15
Protecting flip-chip package using pre-applied fillet Grant 9,064,881 - Tsai , et al. June 23, 2	2015-06-23
Semiconductor device having under-bump metallization (UBM) structure and method of forming the same Grant 9,059,158 - Tsai , et al. June 16, 2	2015-06-16
Bond pad design for improved routing and reduced package stress Grant 9,053,943 - Chou , et al. June 9, 2	2015-06-09
Packaging devices, methods of manufacture thereof, and packaging methods Grant 8,994,155 - Tsai , et al. March 31, 2	2015-03-31
Semiconductor Device Having Under-bump Metallization (ubm) Structure And Method Of Forming The Same App 20140327136 - TSAI; Tsung-Fu ; et al.	2014-11-06
Post-passivation interconnect structure and methods for forming the same Grant 8,846,548 - Tu , et al. September 30, 2	2014-09-30
Semiconductor device having under-bump metallization (UBM) structure and method of forming the same Grant 8,803,338 - Tsai , et al. August 12, 2	2014-08-12
Post-Passivation Interconnect Structure and Methods for Forming the Same App 20140191392 - Tu; Chia-Wei ; et al.	2014-07-10
Packaging Devices, Methods of Manufacture Thereof, and Packaging Methods App 20140110836 - Tsai; Tsung-Fu ; et al.	2014-04-24
Methods and Apparatus of Packaging Semiconductor Devices App 20140057431 - Tu; Chia-Wei ; et al.	2014-02-27
Semiconductor Device Having Under-bump Metallization (ubm) Structure And Method Of Forming The Same App 20140042619 - TSAI; Tsung-Fu ; et al.	2014-02-13
Integrated Circuit Packages and Methods for Forming the Same App 20130341800 - Tu; Chia-Wei ; et al.	2013-12-26
Metal bump structure Grant 8,581,399 - Tsai , et al. November 12, 2	2013-11-12
Under-bump metallization (UBM) structure and method of forming the same Grant 8,581,420 - Tsai , et al. November 12, 2	2013-11-12
Protecting sidewalls of semiconductor chips using insulation films Grant 8,580,657 - Kuo , et al. November 12, 2	2013-11-12
Methods and apparatus of under bump metallization in packaging semiconductor devices Grant 8,569,886 - Tu , et al. October 29, 2	2013-10-29
Protecting T-contacts of chip scale packages from moisture Grant 8,507,316 - Chu , et al. August 13, 2	2013-08-13
Methods and Apparatus of Packaging Semiconductor Devices App 20130127052 - Tu; Chia-Wei ; et al.	2013-05-23
Packaging Structures of Integrated Circuits App 20130087925 - Tsai; Tsung-Fu ; et al.	2013-04-11
Metal Bump Structure App 20130026621 - TSAI; Tsung-Fu ; et al.	2013-01-31
Method Of Forming A Bond Pad Design For Improved Routing And Reduced Package Stress App 20120329263 - CHOU; Yi-Mang ; et al.	2012-12-27
Bond Pad Design For Improved Routing And Reduced Package Stress App 20120326336 - CHOU; Yi-Mang ; et al.	2012-12-27
Thermal gradient reflow for forming columnar grain structures for solder bumps Grant 8,308,052 - Chang , et al. November 13, 2	2012-11-13
Protecting T-Contacts of Chip Scale Packages from Moisture App 20120161308 - Chu; Hui-Chen ; et al.	2012-06-28
Thermal Gradient Reflow for Forming Columnar Grain Structures for Solder Bumps App 20120125981 - Chang; Chih-Horng ; et al.	2012-05-24
Protecting Flip-Chip Package using Pre-Applied Fillet App 20120119354 - Tsai; Tsung-Fu ; et al.	2012-05-17
Under-bump Metallization (ubm) Structure And Method Of Forming The Same App 20120091576 - TSAI; Tsung-Fu ; et al.	2012-04-19
Protecting Sidewalls of Semiconductor Chips using Insulation Films App 20100072635 - Kuo; Yian-Liang ; et al.	2010-03-25
Apparatus and method for testing conductive bumps Grant 7,439,751 - Kuo , et al. October 21, 2	2008-10-21
Integrated circuit package bond pad having plurality of conductive members Grant 7,372,153 - Kuo , et al. May 13, 2	2008-05-13
Apparatus and method for testing conductive bumps App 20080074130 - Kuo; Yian-Liang ; et al.	2008-03-27
Heat spreader ball grid array (HSBGA) design for low-k integrated circuits (IC) Grant 7,180,173 - Kuo , et al. February 20, 2	2007-02-20
Apparatus and method for testing conductive bumps Grant 7,102,372 - Kuo September 5, 2	2006-09-05
Solder mask removal method Grant 7,081,209 - Kuo July 25, 2	2006-07-25
Apparatus and method for testing conductive bumps App 20060103399 - Kuo; Yian-Liang	2006-05-18
Heat spreader ball grid array (HSBGA) design for low-k integrated circuits (IC) App 20050110140 - Kuo, Yian-Liang ; et al.	2005-05-26
Integrated circuit package bond pad having plurality of conductive members App 20050073058 - Kuo, Yian-Liang ; et al.	2005-04-07
SBGA design for low-k integrated circuits (IC) App 20050051893 - Kuo, Yian-Liang ; et al.	2005-03-10
Solder mask removal method App 20050006342 - Kuo, Yian-Liang	2005-01-13

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