Kuo; Tz-Jun
Patent Applications and Registrations
Patent applications and USPTO patent grants for Kuo; Tz-Jun.The latest application filed is for "interconnect structure without barrier layer on bottom surface of via".
- Kuo; Tz-Jun - Hsinchu City TW
- Kuo; Tz-Jun - Hsinchu County TW
- Kuo; Tz-Jun - Hsinchu TW
- Kuo; Tz-Jun - Zhudong Township TW
| Patent | Date |
|---|---|
| Interconnect Structure without Barrier Layer on Bottom Surface of Via App 20220262675 - Kuo; Tz-Jun ; et al. | 2022-08-18 |
| Interconnect structure without barrier layer on bottom surface of via Grant 11,322,391 - Kuo , et al. May 3, 2 | 2022-05-03 |
| Via Structure And Methods For Forming The Same App 20210366765 - Lu; Meng-Pei ; et al. | 2021-11-25 |
| Method of Forming Metal Interconnection App 20200343177 - Yang; Shin-Yi ; et al. | 2020-10-29 |
| Method of forming metal interconnection Grant 10,714,424 - Yang , et al. | 2020-07-14 |
| Interconnect Structure Without Barrier Layer On Bottom Surface Of Via App 20200035546 - KUO; Tz-Jun ; et al. | 2020-01-30 |
| Interconnect structure without barrier layer on bottom surface of via Grant 10,453,740 - Kuo , et al. Oc | 2019-10-22 |
| Method of Forming Metal Interconnection App 20190115297 - Yang; Shin-Yi ; et al. | 2019-04-18 |
| Interconnect Structure Without Barrier Layer On Bottom Surface Of Via App 20190006230 - KUO; Tz-Jun ; et al. | 2019-01-03 |
| Method of forming metal interconnection Grant 10,163,786 - Yang , et al. Dec | 2018-12-25 |
| Method of forming metal interconnection Grant 9,972,529 - Yang , et al. May 15, 2 | 2018-05-15 |
| Method of forming an interconnection Grant 9,842,767 - Lee , et al. December 12, 2 | 2017-12-12 |
| Method for Via Plating with Seed Layer App 20170236750 - Yang; Shin-Yi ; et al. | 2017-08-17 |
| Method of Forming Metal Interconnection App 20170186685 - Yang; Shin-Yi ; et al. | 2017-06-29 |
| Method for via plating with seed layer Grant 9,640,431 - Yang , et al. May 2, 2 | 2017-05-02 |
| Method of forming metal interconnection Grant 9,613,856 - Yang , et al. April 4, 2 | 2017-04-04 |
| Method of Forming Metal Interconnection App 20170092536 - Yang; Shin-Yi ; et al. | 2017-03-30 |
| Method of Forming Metal Interconnection App 20170084483 - Yang; Shin-Yi ; et al. | 2017-03-23 |
| Method for Via Plating with Seed Layer App 20160240434 - Yang; Shin-Yi ; et al. | 2016-08-18 |
| Back end of the line (BEOL) interconnect scheme Grant 9,343,356 - Kuo , et al. May 17, 2 | 2016-05-17 |
| Method for via plating with seed layer Grant 9,324,608 - Yang , et al. April 26, 2 | 2016-04-26 |
| Method for Via Plating with Seed Layer App 20150255334 - Yang; Shin-Yi ; et al. | 2015-09-10 |
| Method for via plating with seed layer Grant 9,054,163 - Yang , et al. June 9, 2 | 2015-06-09 |
| Method for Via Plating with Seed Layer App 20150126030 - Yang; Shin-Yi ; et al. | 2015-05-07 |
| Method Of Semiconductor Integrated Circuit Fabrication App 20150017799 - Lee; Ming-Han ; et al. | 2015-01-15 |
| Back End of the Line (BEOL) Interconnect Scheme App 20140231998 - Kuo; Chi-Liang ; et al. | 2014-08-21 |
| Method of semiconductor integrated circuit fabrication Grant 8,749,060 - Lee , et al. June 10, 2 | 2014-06-10 |
| Method Of Semiconductor Integrated Circuit Fabrication App 20140084469 - Lee; Ming Han ; et al. | 2014-03-27 |
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