Kuo; Po Chen
Patent Applications and Registrations
Patent applications and USPTO patent grants for Kuo; Po Chen.The latest application filed is for "techniques for forming semiconductor device packages and related packages, intermediate products, and methods".
- Kuo; Po Chen - Tainan TW
- Kuo; Po-Chen - Tainan City TW
| Patent | Date |
|---|---|
| Techniques For Forming Semiconductor Device Packages And Related Packages, Intermediate Products, And Methods App 20220037282 - Yang; Po Chih ; et al. | 2022-02-03 |
| Techniques for forming semiconductor device packages and related packages, intermediate products, and methods Grant 11,171,109 - Yang , et al. November 9, 2 | 2021-11-09 |
| Techniques For Forming Semiconductor Device Packages And Related Packages, Intermediate Products, And Methods App 20210091036 - Yang; Po Chih ; et al. | 2021-03-25 |
| Semiconductor device with modified pad spacing structure Grant 9,922,948 - Kuo March 20, 2 | 2018-03-20 |
| Semiconductor Device With Modified Pad Spacing Structure App 20170287858 - Kuo; Po-Chen | 2017-10-05 |
| Stacked semiconductor device Grant 9,640,502 - Kuo May 2, 2 | 2017-05-02 |
| Stacked Semiconductor Device App 20160300808 - Kuo; Po-Chen | 2016-10-13 |
| Method For Coupling Circuit Element And Package Structure App 20160181127 - KUO; PO-CHEN | 2016-06-23 |
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