name:-0.0137779712677
name:-0.0091400146484375
name:-0.0035231113433838
Kuo; Li-Wei Patent Filings

Kuo; Li-Wei

Patent Applications and Registrations

Patent applications and USPTO patent grants for Kuo; Li-Wei.The latest application filed is for "system and method for detecting illuminance".

Company Profile
3.7.9
  • Kuo; Li-Wei - Hsinchu TW
  • Kuo; Li-Wei - Taipei TW
  • KUO; LI-WEI - Hsinchu City TW
  • KUO; LI-WEI - Taipei City TW
  • Kuo; Li-Wei - Bade TW
  • KUO; Li-Wei - Bade City TW
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Trademarks
Patent Activity
PatentDate
System and method for detecting illuminance having a light sensor comprising a light emitting diode receiving a ray of light and generating a sensing voltage
Grant 10,928,247 - Su , et al. February 23, 2
2021-02-23
Composite intelligent biological phototherapy device
Grant 10,912,948 - Lin , et al. February 9, 2
2021-02-09
System And Method For Detecting Illuminance
App 20190383660 - SU; FANG-CI ;   et al.
2019-12-19
Composite Intelligent Biological Phototherapy Device
App 20190111277 - LIN; YI-CHENG ;   et al.
2019-04-18
Wideband magnetic resonance imaging apparatus and method
Grant 8,049,496 - Chen , et al. November 1, 2
2011-11-01
Method and apparatus for simultaneously acquiring multiple slices/slabs in magnetic resonance system
Grant 8,022,701 - Chen , et al. September 20, 2
2011-09-20
Wideband Magnetic Resonance Imaging Apparatus And Method
App 20100148773 - Chen; Jyh-Horng ;   et al.
2010-06-17
Electrically conductive substrate with high heat conductivity
Grant 7,655,292 - Kuo February 2, 2
2010-02-02
Method And Apparatus For Simultaneously Acquiring Multiple Slices/slabs In Magnetic Resonance System
App 20090278538 - Chen; Jyh-Horng ;   et al.
2009-11-12
Electrically Conductive Substrate With High Heat Conductivity
App 20080254207 - KUO; Li-Wei
2008-10-16
Carrier board and method for manufacturing the same
App 20080070012 - Kuo; Li-Wei ;   et al.
2008-03-20
Base of a circuit board with a heat dissipating capability
App 20070267216 - Kuo; Li-Wei
2007-11-22
Light emitting diode bulb having high heat dissipating efficiency
Grant 6,864,513 - Lin , et al. March 8, 2
2005-03-08
Method of fabricating light emitting diode device with multiple encapsulants
Grant 6,830,496 - Lin , et al. December 14, 2
2004-12-14
Light emitting diode bulb having high heat dissipating efficiency
App 20040222516 - Lin, Ting-Hao ;   et al.
2004-11-11
Light emitting diode device and method of fabricating the devices
App 20040140764 - Lin, Ting-Hao ;   et al.
2004-07-22

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