loadpatents
Patent applications and USPTO patent grants for Kuo; Jen-I.The latest application filed is for "coupling device with electro-magnetic compensation".
Patent | Date |
---|---|
Coupling device with electro-magnetic compensation Grant 7,508,282 - Kuo , et al. March 24, 2 | 2009-03-24 |
Coupling device with electro-magnetic compensation App 20080111650 - Kuo; Jen-I ;   et al. | 2008-05-15 |
Method of fabricating a ceramic substrate with a thermal conductive plug of a multi-chip package Grant 7,222,419 - Horng , et al. May 29, 2 | 2007-05-29 |
Method for fabricating multi-layer ceramic substrate App 20060032574 - Kuo; Jen-I ;   et al. | 2006-02-16 |
Lamination process of packaging substrate App 20040108058 - Kuo, Jen-I ;   et al. | 2004-06-10 |
Method of fabricating a ceramic substrate with a thermal conductive plug of a multi-chip package App 20040045656 - Horng, Gwo-Ji ;   et al. | 2004-03-11 |
Method of fabricating a ceramic substrate with a thermal conductive plug of a multi-chip package App 20030110629 - Horng, Gwo-Ji ;   et al. | 2003-06-19 |
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