Kuo; Hung-Yi
Patent Applications and Registrations
Patent applications and USPTO patent grants for Kuo; Hung-Yi.The latest application filed is for "photonic integrated circuit and package structure".
Company Profile
48.112.129
- Kuo; Hung-Yi - Taipei City TW
- Kuo; Hung-Yi - Taipei TW
- Kuo; Hung-Yi - Tapei TW
- Kuo; Hung-Yi - New Taipei TW
- KUO; HUNG-YI - New Taipei City TW
- Kuo; Hung-Yi - Tapei City TW
- Kuo; Hung-Yi - Hsin-Chu TW
- Kuo; Hung-Yi - Taipei County TW
- Kuo; Hung-Yi - Hsin-Tien TW
- Kuo; Hung-Yi - Taipei Hsien TW
- Kuo; Hung Yi - Shindian TW
- Kuo; Hung-Yi - Hsin-Tien City TW
- Kuo; Hung Yi - Shindian City TW
Patent Activity
| Patent | Date |
|---|---|
| Photonic Integrated Circuit And Package Structure App 20220299719 - Yu; Tsung-Yuan ; et al. | 2022-09-22 |
| Package Structure And Method Of Forming The Same App 20220285317 - Yu; Tsung-Yuan ; et al. | 2022-09-08 |
| Optical Device, Optical System And Method Of Forming The Same App 20220214501 - Kuo; Feng-Wei ; et al. | 2022-07-07 |
| Semiconductor Device Having A Heat Dissipation Structure Connected Chip Package App 20220208680 - Teng; Po-Yuan ; et al. | 2022-06-30 |
| Semiconductor Structure And Method Of Fabricating The Same App 20220165675 - Huang; Tzu-Sung ; et al. | 2022-05-26 |
| Packaged Semiconductor Devices With Wireless Charging Means App 20220166254 - YU; Chen-Hua ; et al. | 2022-05-26 |
| Photonic Package And Method Of Manufacture App 20220099887 - Yu; Chen-Hua ; et al. | 2022-03-31 |
| Semiconductor device having a heat dissipation structure connected chip package Grant 11,282,791 - Teng , et al. March 22, 2 | 2022-03-22 |
| Wireless charging package with chip integrated in coil center Grant 11,282,785 - Yu , et al. March 22, 2 | 2022-03-22 |
| Package structure, package-on-package structure and method of fabricating the same Grant 11,251,119 - Yu , et al. February 15, 2 | 2022-02-15 |
| Packaged semiconductor devices with wireless charging means Grant 11,251,644 - Yu , et al. February 15, 2 | 2022-02-15 |
| Semiconductor structure and method of fabricating the same Grant 11,244,906 - Huang , et al. February 8, 2 | 2022-02-08 |
| Semiconductor Structure And Method Of Fabricating The Same App 20210366833 - Huang; Tzu-Sung ; et al. | 2021-11-25 |
| Semiconductor Device and Method App 20210358870 - Huang; Tzu-Sung ; et al. | 2021-11-18 |
| Semiconductor structure and manufacturing method thereof Grant 11,177,355 - Yu , et al. November 16, 2 | 2021-11-16 |
| Semiconductor Package and Method App 20210327806 - Pan; Kuo Lung ; et al. | 2021-10-21 |
| Semiconductor devices and methods of forming the same Grant 11,139,249 - Yu , et al. October 5, 2 | 2021-10-05 |
| Semicondcutor Package And Manufacturing Method Of Semicondcutor Package App 20210305212 - Hsieh; Wei-Kang ; et al. | 2021-09-30 |
| Polymer-based-semiconductor structure with cavity Grant 11,133,236 - Yu , et al. September 28, 2 | 2021-09-28 |
| Die Stacking Structure and Method Forming Same App 20210288040 - Yu; Chen-Hua ; et al. | 2021-09-16 |
| Semiconductor device and method Grant 11,075,176 - Huang , et al. July 27, 2 | 2021-07-27 |
| Semiconductor Devices and Methods of Manufacture App 20210223489 - Weng; Chung-Ming ; et al. | 2021-07-22 |
| Semiconductor package and method Grant 11,049,805 - Pan , et al. June 29, 2 | 2021-06-29 |
| Package And Method Of Forming Same App 20210157052 - Tai; Chih-Hsuan ; et al. | 2021-05-27 |
| Semiconductor package and manufacturing method of semiconductor package Grant 11,004,827 - Hsieh , et al. May 11, 2 | 2021-05-11 |
| Semiconductor structure Grant 11,004,811 - Chen , et al. May 11, 2 | 2021-05-11 |
| Semiconductor device and method of manufacturing semiconductor device Grant 10,991,649 - Yu , et al. April 27, 2 | 2021-04-27 |
| Multi-Chip Semiconductor Package App 20210091059 - Lai; Yu-Chia ; et al. | 2021-03-25 |
| Package Structure, Package-on-package Structure And Method Of Fabricating The Same App 20210090993 - Yu; Tsung-Yuan ; et al. | 2021-03-25 |
| InFO Coil on Metal Plate with Slot App 20210057144 - Wang; Chuei-Tang ; et al. | 2021-02-25 |
| Semiconductor Device And Method Of Fabricating The Same App 20200411439 - Teng; Po-Yuan ; et al. | 2020-12-31 |
| InFO coil structure and methods of manufacturing same Grant 10,867,911 - Yu , et al. December 15, 2 | 2020-12-15 |
| Semiconductor Structure App 20200388584 - CHEN; VINCENT ; et al. | 2020-12-10 |
| Multi-chip semiconductor package Grant 10,847,505 - Lai , et al. November 24, 2 | 2020-11-24 |
| InFO coil on metal plate with slot Grant 10,847,304 - Wang , et al. November 24, 2 | 2020-11-24 |
| Stacked coil for wireless charging structure on InFO package Grant 10,825,602 - Yu , et al. November 3, 2 | 2020-11-03 |
| Wireless Charging Package with Chip Integrated in Coil Center App 20200343181 - Yu; Chen-Hua ; et al. | 2020-10-29 |
| Semiconductor Devices And Methods Of Forming The Same App 20200312774 - Yu; Chen-Hua ; et al. | 2020-10-01 |
| Semiconductor device and method Grant 10,790,244 - Huang , et al. September 29, 2 | 2020-09-29 |
| Semiconductor structure Grant 10,763,229 - Chen , et al. Sep | 2020-09-01 |
| Packaged Semiconductor Devices With Wireless Charging Means App 20200266664 - YU; Chen-Hua ; et al. | 2020-08-20 |
| Semiconductor device and manufacturing method thereof Grant 10,720,495 - Yu , et al. | 2020-07-21 |
| Wireless charging package with chip integrated in coil center Grant 10,720,388 - Yu , et al. | 2020-07-21 |
| Packaged semiconductor devices with wireless charging means Grant 10,651,675 - Yu , et al. | 2020-05-12 |
| Hexagonal Semiconductor Package Structure App 20200144861 - Huang; Tzu-Sung ; et al. | 2020-05-07 |
| Semiconductor Device And Method Of Manufacturing Semiconductor Device App 20200118916 - YU; TSUNG-YUAN ; et al. | 2020-04-16 |
| Semicondcutor Package And Manufacturing Method Of Semicondcutor Package App 20200091114 - Hsieh; Wei Kang ; et al. | 2020-03-19 |
| Stacked Coil for Wireless Charging Structure on InFO Package App 20200090855 - Yu; Chen-Hua ; et al. | 2020-03-19 |
| Semiconductor Structure App 20200075516 - CHEN; VINCENT ; et al. | 2020-03-05 |
| Dual-mode Wireless Charging Device App 20200066635 - LIANG; Shih-Wei ; et al. | 2020-02-27 |
| Polymer-Based-Semiconductor Structure with Cavity App 20200035576 - Yu; Chen-Hua ; et al. | 2020-01-30 |
| Hexagonal semiconductor package structure Grant 10,530,175 - Huang , et al. J | 2020-01-07 |
| Semiconductor Package and Method App 20200006220 - Pan; Kuo Lung ; et al. | 2020-01-02 |
| Semiconductor Device and Method App 20200006259 - Huang; Tzu-Sung ; et al. | 2020-01-02 |
| Method of manufacturing semiconductor device Grant 10,510,652 - Yu , et al. Dec | 2019-12-17 |
| Stacked coil for wireless charging structure on InFO package Grant 10,510,478 - Yu , et al. Dec | 2019-12-17 |
| Polymer-based-semiconductor structure with cavity Grant 10,504,810 - Yu , et al. Dec | 2019-12-10 |
| Dual-mode wireless charging device Grant 10,497,646 - Liang , et al. De | 2019-12-03 |
| Semiconductor structure Grant 10,475,755 - Chen , et al. Nov | 2019-11-12 |
| Multi-Chip Semiconductor Package App 20190312018 - Lai; Yu-Chia ; et al. | 2019-10-10 |
| Stacked Coil for Wireless Charging Structure on InFO Package App 20190279810 - Yu; Chen-Hua ; et al. | 2019-09-12 |
| Programmable Inductor App 20190252117 - Yu; Chen-Hua ; et al. | 2019-08-15 |
| Semiconductor Structure And Manufacturing Method Thereof App 20190237553 - YU; CHEN-HUA ; et al. | 2019-08-01 |
| Stacked coil for wireless charging structure on InFO package Grant 10,304,614 - Yu , et al. | 2019-05-28 |
| Stacked coil for wireless charging structure on InFO package Grant 10,269,481 - Yu , et al. | 2019-04-23 |
| Method for manufacturing semiconductor structure Grant 10,269,737 - Huang , et al. | 2019-04-23 |
| Info coil structure and methods of manufacturing same Grant 10,269,702 - Yu , et al. | 2019-04-23 |
| Programmable inductor Grant 10,269,489 - Yu , et al. | 2019-04-23 |
| Semiconductor structure and manufacturing method thereof Grant 10,269,904 - Yu , et al. | 2019-04-23 |
| Semiconductor Device and Method App 20190103370 - Huang; Tzu-Sung ; et al. | 2019-04-04 |
| Stacked Coil for Wireless Charging Structure on InFO Package App 20190096565 - Yu; Chen-Hua ; et al. | 2019-03-28 |
| Wireless Charging Package with Chip Integrated in Coil Center App 20190088595 - Yu; Chen-Hua ; et al. | 2019-03-21 |
| Semiconductor Structure App 20190067222 - CHEN; VINCENT ; et al. | 2019-02-28 |
| Packaged Semiconductor Devices With Wireless Charging Means App 20190020212 - YU; Chen-Hua ; et al. | 2019-01-17 |
| InFO Coil on Metal Plate with Slot App 20190006085 - Wang; Chuei-Tang ; et al. | 2019-01-03 |
| Wireless charging package with chip integrated in coil center Grant 10,163,780 - Yu , et al. Dec | 2018-12-25 |
| InFO Coil Structure and Methods of Manufacturing Same App 20180331032 - Yu; Chen-Hua ; et al. | 2018-11-15 |
| Fan-out package structure, antenna system and associated method Grant 10,128,203 - Chen , et al. November 13, 2 | 2018-11-13 |
| Method of manufacturing a semiconductor structure Grant 10,115,685 - Chen , et al. October 30, 2 | 2018-10-30 |
| Packaged semiconductor devices with wireless charging means Grant 10,097,030 - Yu , et al. October 9, 2 | 2018-10-09 |
| Securing mechanism and electronic device with same Grant 10,091,910 - Wu , et al. October 2, 2 | 2018-10-02 |
| InFO coil on metal plate with slot Grant 10,074,472 - Wang , et al. September 11, 2 | 2018-09-11 |
| Semicondcutor structure and semiconductor manufacturing process thereof Grant 10,062,654 - Lai , et al. August 28, 2 | 2018-08-28 |
| Polymer-Based-Semiconductor Structure with Cavity App 20180240724 - Yu; Chen-Hua ; et al. | 2018-08-23 |
| Method Of Manufacturing A Semiconductor Structure App 20180226368 - CHEN; VINCENT ; et al. | 2018-08-09 |
| Securing Mechanism And Electronic Device With Same App 20180213682 - WU; AN-CHIH ; et al. | 2018-07-26 |
| Calibration kits for RF passive devices Grant 10,020,271 - Chen , et al. July 10, 2 | 2018-07-10 |
| Inductor system and method Grant 9,984,965 - Tsai , et al. May 29, 2 | 2018-05-29 |
| Polymer based-semiconductor structure with cavity Grant 9,953,892 - Kuo , et al. April 24, 2 | 2018-04-24 |
| Semiconductor structure and manufacturing method thereof Grant 9,953,936 - Chen , et al. April 24, 2 | 2018-04-24 |
| Optical sensing system and associated electronic device Grant 9,943,239 - Kuo , et al. April 17, 2 | 2018-04-17 |
| Inductor System and Method App 20180076135 - Tsai; Hao-Yi ; et al. | 2018-03-15 |
| Method Of Manufacturing Semiconductor Device App 20180047664 - YU; TSUNG-YUAN ; et al. | 2018-02-15 |
| Hexagonal Semiconductor Package Structure App 20180048177 - Huang; Tzu-Sung ; et al. | 2018-02-15 |
| Method For Manufacturing Semiconductor Structure App 20180033750 - HUANG; CHANG-PIN ; et al. | 2018-02-01 |
| Dual-mode Wireless Charging Device App 20180033725 - LIANG; Shih-Wei ; et al. | 2018-02-01 |
| Semicondcutor Structure And Semiconductor Manufacturing Process Thereof App 20180025997 - Lai; Yu-Chia ; et al. | 2018-01-25 |
| Calibration Kits for RF Passive Devices App 20180019217 - Chen; Jie ; et al. | 2018-01-18 |
| Wireless Charging Package with Chip Integrated in Coil Center App 20170373004 - Yu; Chen-Hua ; et al. | 2017-12-28 |
| Conductive Terminal On Integrated Circuit App 20170372999 - Lai; Yu-Chia ; et al. | 2017-12-28 |
| Conductive terminal on integrated circuit Grant 9,852,985 - Lai , et al. December 26, 2 | 2017-12-26 |
| Stacked Coil for Wireless Charging Structure on InFO Package App 20170345548 - Yu; Chen-Hua ; et al. | 2017-11-30 |
| Inductor system and method Grant 9,812,392 - Chen , et al. November 7, 2 | 2017-11-07 |
| Packaged Semiconductor Devices With Wireless Charging Means App 20170317023 - YU; Chen-Hua ; et al. | 2017-11-02 |
| Calibration kits for RF passive devices Grant 9,799,614 - Chen , et al. October 24, 2 | 2017-10-24 |
| Package structures having height-adjusted molding members and methods of forming the same Grant 9,799,615 - Huang , et al. October 24, 2 | 2017-10-24 |
| Semiconductor structure and manufacturing method thereof Grant 9,786,618 - Huang , et al. October 10, 2 | 2017-10-10 |
| Capacitor in post-passivation structures and methods of forming the same Grant 9,786,591 - Tsai , et al. October 10, 2 | 2017-10-10 |
| Wireless charging package with chip integrated in coil center Grant 9,761,522 - Chu , et al. September 12, 2 | 2017-09-12 |
| Optical Sensing System And Associated Electronic Device App 20170251937 - KUO; HUNG-YI ; et al. | 2017-09-07 |
| Inductor System and Method App 20170243820 - Chen; Hsien-Wei ; et al. | 2017-08-24 |
| Fan-out Package Structure, Antenna System And Associated Method App 20170221838 - CHEN; WEI-TING ; et al. | 2017-08-03 |
| Wireless Charging Package with Chip Integrated in Coil Center App 20170221819 - Chu; Chiang-Jui ; et al. | 2017-08-03 |
| Info Coil Structure and Methods of Manufacturing Same App 20170221820 - Yu; Chen-Hua ; et al. | 2017-08-03 |
| InFO Coil on Metal Plate with Slot App 20170171979 - Wang; Chuei-Tang ; et al. | 2017-06-15 |
| Semiconductor Structure And Manufacturing Method Thereof App 20170141056 - HUANG; CHANG-PIN ; et al. | 2017-05-18 |
| Semiconductor Device And Method Of Forming The Same App 20170133339 - LII; MIRNG-JI ; et al. | 2017-05-11 |
| Inductor system and method Grant 9,647,054 - Tsai , et al. May 9, 2 | 2017-05-09 |
| Polymer-Based-Semiconductor Structure with Cavity App 20170125317 - Kuo; Hung-Yi ; et al. | 2017-05-04 |
| Semiconductor Structure And Manufacturing Method Thereof App 20170126047 - CHEN; VINCENT ; et al. | 2017-05-04 |
| Integrated Fan-out (info) Package Structures And Methods Of Forming Same App 20170110425 - Huang; Chang-Pin ; et al. | 2017-04-20 |
| Capacitor in Post-Passivation Structures and Methods of Forming the Same App 20170040256 - Tsai; Hao-Yi ; et al. | 2017-02-09 |
| Inductor for post passivation interconnect and a method of forming Grant 9,553,045 - Tsai , et al. January 24, 2 | 2017-01-24 |
| Single mask package apparatus Grant 9,530,757 - Yu , et al. December 27, 2 | 2016-12-27 |
| 3D package with through substrate vias Grant 9,530,759 - Yu , et al. December 27, 2 | 2016-12-27 |
| Calibration Kits for RF Passive Devices App 20160358867 - Chen; Jie ; et al. | 2016-12-08 |
| Inductor System and Method App 20160343794 - Tsai; Hao-Yi ; et al. | 2016-11-24 |
| Wafer level photonic devices dies structure and method of making the same Grant 9,502,627 - Yu , et al. November 22, 2 | 2016-11-22 |
| Capacitor in post-passivation structures and methods of forming the same Grant 9,490,203 - Tsai , et al. November 8, 2 | 2016-11-08 |
| Semiconductor device and manufacturing method thereof Grant 9,437,490 - Yu , et al. September 6, 2 | 2016-09-06 |
| Capacitor in Post-Passivation Structures and Methods of Forming the Same App 20160247757 - Tsai; Hao-Yi ; et al. | 2016-08-25 |
| Calibration kits for RF passive devices Grant 9,425,112 - Chen , et al. August 23, 2 | 2016-08-23 |
| Inductor system and method Grant 9,406,739 - Tsai , et al. August 2, 2 | 2016-08-02 |
| 3D Package With Through Substrate Vias App 20160218090 - Yu; Chen-Hua ; et al. | 2016-07-28 |
| Semiconductor devices and methods of manufacture thereof having guard ring structure Grant 9,379,067 - Chen , et al. June 28, 2 | 2016-06-28 |
| LED device with improved thermal performance Grant 9,379,299 - Hsia , et al. June 28, 2 | 2016-06-28 |
| Capacitor in post-passivation structures and methods of forming the same Grant 9,355,954 - Tsai , et al. May 31, 2 | 2016-05-31 |
| Semiconductor Devices And Methods Of Manufacture Thereof Having Guard Ring Structure App 20160133583 - Chen; Hsien-Wei ; et al. | 2016-05-12 |
| Semiconductor Structure And Manufacturing Method Thereof App 20160126324 - YU; CHEN-HUA ; et al. | 2016-05-05 |
| Wafer Level Photonic Device Dies Structure And Method Of Making The Same App 20160118562 - YU; Chih-Kuang ; et al. | 2016-04-28 |
| 3D package with through substrate vias Grant 9,305,877 - Yu , et al. April 5, 2 | 2016-04-05 |
| Method and apparatus for accurate die-to-wafer bonding Grant 9,287,478 - Chern , et al. March 15, 2 | 2016-03-15 |
| Semiconductor devices having guard ring structure and methods of manufacture thereof Grant 9,245,842 - Chen , et al. January 26, 2 | 2016-01-26 |
| Video wall Grant 9,240,163 - Kuo , et al. January 19, 2 | 2016-01-19 |
| Capacitor in Post-Passivation Structures and Methods of Forming the Same App 20150380351 - Tsai; Hao-Yi ; et al. | 2015-12-31 |
| Methods of forming through silicon via openings Grant 9,224,636 - Chern , et al. December 29, 2 | 2015-12-29 |
| Wafer level photonic device die structure and method of making the same Grant 9,224,932 - Yu , et al. December 29, 2 | 2015-12-29 |
| Semiconductor Device And Manufacturing Method Thereof App 20150364376 - YU; TSUNG-YUAN ; et al. | 2015-12-17 |
| LED structure Grant 9,184,334 - Hsia , et al. November 10, 2 | 2015-11-10 |
| Capacitor in post-passivation structures and methods of forming the same Grant 9,136,318 - Tsai , et al. September 15, 2 | 2015-09-15 |
| Single Mask Package Apparatus App 20150255435 - Yu; Chen-Hua ; et al. | 2015-09-10 |
| Light emitting diode emitter substrate with highly reflective metal bonding Grant 9,099,632 - Chern , et al. August 4, 2 | 2015-08-04 |
| Inductor for Post Passivation Interconnect and A Method of Forming App 20150214148 - Tsai; Hao-Yi ; et al. | 2015-07-30 |
| De-noise circuit and de-noise method for differential signals and chip for receiving differential signals Grant 9,041,490 - Su , et al. May 26, 2 | 2015-05-26 |
| Single mask package apparatus and method Grant 9,041,215 - Yu , et al. May 26, 2 | 2015-05-26 |
| Semiconductor Device And Manufacturing Method Thereof App 20150137355 - YU; TSUNG-YUAN ; et al. | 2015-05-21 |
| Packaged Semiconductor Device App 20150123267 - LII; MIRNG-JI ; et al. | 2015-05-07 |
| Inductor for post passivation interconnect Grant 9,000,876 - Tsai , et al. April 7, 2 | 2015-04-07 |
| LED device with improved thermal performance Grant 8,993,447 - Hsia , et al. March 31, 2 | 2015-03-31 |
| Guard ring design for maintaining signal integrity Grant 8,970,001 - Lii , et al. March 3, 2 | 2015-03-03 |
| Capacitor in Post-Passivation Structures and Methods of Forming the Same App 20150017778 - Tsai; Hao-Yi ; et al. | 2015-01-15 |
| State machine circuit and state adjusting method Grant 8,933,725 - Kuo January 13, 2 | 2015-01-13 |
| LED Structure App 20140339579 - Hsia; Shouli Steve ; et al. | 2014-11-20 |
| Capacitor in Post-Passivation structures and methods of forming the same Grant 8,884,400 - Tsai , et al. November 11, 2 | 2014-11-11 |
| Video Wall App 20140306966 - KUO; Hung-Yi ; et al. | 2014-10-16 |
| State Machine Circuit And State Adjusting Method App 20140306736 - KUO; Hung-Yi | 2014-10-16 |
| Inductor System and Method App 20140264735 - Tsai; Hao-Yi ; et al. | 2014-09-18 |
| Single Mask Package Apparatus and Method App 20140264927 - Yu; Chen-Hua ; et al. | 2014-09-18 |
| Programmable Inductor App 20140266542 - Yu; Chen-Hua ; et al. | 2014-09-18 |
| Method and Apparatus for Accurate Die-to-Wafer Bonding App 20140239323 - Chern; Chyi Shyuan ; et al. | 2014-08-28 |
| Methods of Forming Through Silicon Via Openings App 20140235053 - Chern; Chyi Shyuan ; et al. | 2014-08-21 |
| LED structure Grant 8,809,899 - Hsia , et al. August 19, 2 | 2014-08-19 |
| Capacitor in Post-Passivation Structures and Methods of Forming the Same App 20140183693 - Tsai; Hao-Yi ; et al. | 2014-07-03 |
| Guard Ring Design for Maintaining Signal Integrity App 20140183690 - Lii; Mirng-Ji ; et al. | 2014-07-03 |
| Semiconductor Devices and Methods of Manufacture Thereof App 20140145346 - Chen; Hsien-Wei ; et al. | 2014-05-29 |
| Method and apparatus for accurate die-to-wafer bonding Grant 8,722,436 - Chern , et al. May 13, 2 | 2014-05-13 |
| Methods of forming through silicon via openings Grant 8,716,128 - Chern , et al. May 6, 2 | 2014-05-06 |
| Wafer Level Photonic Device Die Structure and Method of Making the Same App 20140084244 - Yu; Chih-Kuang ; et al. | 2014-03-27 |
| Method and Apparatus for Accurate Die-to-Wafer Bonding App 20140065741 - Chern; Chyi Shyuan ; et al. | 2014-03-06 |
| LED Structure App 20140061688 - Hsia; Shouli Steve ; et al. | 2014-03-06 |
| De-noise Circuit And De-noise Method For Differential Signals And Chip For Receiving Differential Signals App 20130335167 - Su; Chia-Hung ; et al. | 2013-12-19 |
| Method and apparatus for accurate die-to-wafer bonding Grant 8,609,446 - Chern , et al. December 17, 2 | 2013-12-17 |
| Calibration Kits for RF Passive Devices App 20130332092 - Chen; Jie ; et al. | 2013-12-12 |
| Wafer level photonic device die structure and method of making the same Grant 8,604,491 - Yu , et al. December 10, 2 | 2013-12-10 |
| Methods of fabricating light emitting diode packages Grant 8,598,617 - Yu , et al. December 3, 2 | 2013-12-03 |
| LED structure having embedded zener diode Grant 8,587,018 - Hsia , et al. November 19, 2 | 2013-11-19 |
| Operation System And Control Method Thereof App 20130297951 - LEE; Liang Min ; et al. | 2013-11-07 |
| Inductor for Post Passivation Interconnect App 20130241683 - Tsai; Hao-Yi ; et al. | 2013-09-19 |
| Method And Apparatus For Accurate Die-to-wafer Bonding App 20130089937 - Chern; Chyi Shyuan ; et al. | 2013-04-11 |
| Wafer level conformal coating for LED devices Grant 8,415,183 - Hsia , et al. April 9, 2 | 2013-04-09 |
| Wafer Level Photonic Device Die Structure And Method Of Making The Same App 20130020589 - Yu; Chih-Kuang ; et al. | 2013-01-24 |
| Led Structure App 20120326198 - HSIA; Shouli Steve ; et al. | 2012-12-27 |
| Methods of Fabricating Light Emitting Diode Packages App 20120286240 - Yu; Chih-Kuang ; et al. | 2012-11-15 |
| Methods Of Forming Through Silicon Via Openings App 20120264296 - CHERN; Chyi Shyuan ; et al. | 2012-10-18 |
| Light Emitting Diode Emitter Substrate with Highly Reflective Metal Bonding App 20120228650 - Chern; Chyi Shyuan ; et al. | 2012-09-13 |
| Method Of Forming A Light Emitting Diode Emitter Substrate With Highly Reflective Metal Bonding App 20120205694 - Chern; Chyi Shyuan ; et al. | 2012-08-16 |
| Methods of fabricating light emitting diode packages Grant 8,241,932 - Yu , et al. August 14, 2 | 2012-08-14 |
| Method of forming a light emitting diode emitter substrate with highly reflective metal bonding Grant 8,236,584 - Chem , et al. August 7, 2 | 2012-08-07 |
| Wafer Level Conformal Coating For Led Devices App 20120129282 - Hsia; Hsing-Kuo ; et al. | 2012-05-24 |
| Led Device With Improved Thermal Performance App 20120119228 - Hsia; Hsing-Kuo ; et al. | 2012-05-17 |
| Chipsets and clock generation methods thereof Grant 7,671,645 - Su , et al. March 2, 2 | 2010-03-02 |
| Power management method of north bridge Grant 7,624,286 - Lin , et al. November 24, 2 | 2009-11-24 |
| Power management system with a bridge logic having analyzers for monitoring data quantity to modify operating clock and voltage of the processor and main memory Grant 7,610,497 - Lin , et al. October 27, 2 | 2009-10-27 |
| Method and related apparatus for calibrating signal driving parameters between chips Grant 7,587,651 - Kuo , et al. September 8, 2 | 2009-09-08 |
| Switching circuit and method thereof for dynamically switching host clock signals Grant 7,565,564 - Kuo , et al. July 21, 2 | 2009-07-21 |
| Digital temperature detecting system and method Grant 7,563,023 - Kuo , et al. July 21, 2 | 2009-07-21 |
| Dynamic adjusting circuit for basic clock signal of front-side bus and method thereof Grant 7,549,073 - Kuo , et al. June 16, 2 | 2009-06-16 |
| Chipsets And Clock Generation Methods Thereof App 20090121758 - Su; Chia-Hung ; et al. | 2009-05-14 |
| Clock signal detector Grant 7,532,039 - Kuo , et al. May 12, 2 | 2009-05-12 |
| Mainboard, electronic component, and controlling method of logic operation Grant 7,508,237 - Kuo , et al. March 24, 2 | 2009-03-24 |
| Digital Temperature Detecting System And Method App 20080136453 - Kuo; Hung-Yi ; et al. | 2008-06-12 |
| Timing adjustment circuit and method thereof Grant 7,375,561 - Kuo , et al. May 20, 2 | 2008-05-20 |
| Voltage monitoring circuit Grant 7,271,578 - Kuo , et al. September 18, 2 | 2007-09-18 |
| Switching circuit and method thereof for dynamically switching host clock signals App 20070174649 - Kuo; Hung-Yi ; et al. | 2007-07-26 |
| Clock signal detector App 20070152716 - Kuo; Hung Yi ; et al. | 2007-07-05 |
| Dynamic adjusting circuit for basic clock signal of front-side bus and method thereof App 20070074060 - Kuo; Hung-Yi ; et al. | 2007-03-29 |
| Timing adjustment circuit and method thereof App 20070057710 - Kuo; Hung-Yi ; et al. | 2007-03-15 |
| Signal adjustment circuit with reference circuit App 20060283231 - Kuo; Hung-Yi ; et al. | 2006-12-21 |
| Chip With Embedded Electromagnetic Compatibility Capacitors And Related Method App 20060267412 - Kuo; Hung-Yi | 2006-11-30 |
| Method And Related Apparatus For Calibrating Signal Driving Parameters Between Chips App 20060237705 - Kuo; Hung-Yi ; et al. | 2006-10-26 |
| Voltage monitoring circuit App 20060232290 - Kuo; Hung Yi ; et al. | 2006-10-19 |
| Traffic analyzer and power state management thereof App 20060174151 - Lin; Ruei-Ling ; et al. | 2006-08-03 |
| Power management method of north bridge App 20060174142 - Lin; Ruei-Ling ; et al. | 2006-08-03 |
| Mainboard, electronic component, and controlling method of logic operation App 20060126402 - Kuo; Hung Yi ; et al. | 2006-06-15 |
| Bus interface timing adjustment device, method and application chip Grant 6,877,103 - Kuo , et al. April 5, 2 | 2005-04-05 |
| Control chip, circuit and method thereof for inhibiting bus cycle App 20040215867 - Kuo, Hung-Yi | 2004-10-28 |
| Bus interface timing adjustment device, method and application chip App 20040078706 - Kuo, Hung-Yi ; et al. | 2004-04-22 |
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