Kuo; Hsi-Shan
Patent Applications and Registrations
Patent applications and USPTO patent grants for Kuo; Hsi-Shan.The latest application filed is for "method for fabricating circuit component".
- Kuo; Hsi-Shan - Taipei N/A TW
- Kuo; Hsi-Shan - Neihu Chu N/A TW
| Patent | Date |
|---|---|
| Cylindrical bonding structure and method of manufacture Grant 8,890,336 - Lee , et al. November 18, 2 | 2014-11-18 |
| Method for fabricating circuit component Grant 8,461,679 - Lee , et al. June 11, 2 | 2013-06-11 |
| Method For Fabricating Circuit Component App 20110215476 - Lee; Jin-Yuan ; et al. | 2011-09-08 |
| Method for fabricating circuit component Grant 7,960,270 - Lee , et al. June 14, 2 | 2011-06-14 |
| Cylindrical Bonding Structure and method of manufacture App 20080296761 - Lee; Jin-Yuan ; et al. | 2008-12-04 |
| Method For Fabricating Circuit Component App 20070166993 - Lee; Jin-Yuan ; et al. | 2007-07-19 |
| Bonding structure with pillar and cap Grant 7,208,834 - Lee , et al. April 24, 2 | 2007-04-24 |
| Method of fabricating cylindrical bonding structure App 20050026413 - Lee, Jin-Yuan ; et al. | 2005-02-03 |
| Method of fabricating cylindrical bonding structure Grant 6,784,087 - Lee , et al. August 31, 2 | 2004-08-31 |
| Oxidative annealing method for forming etched spin-on-glass (SOG) planarizing layer with uniform etch profile App 20030148631 - Kuo, Hsi-Shan ; et al. | 2003-08-07 |
| Cylindrical bonding structure and method of manufacture App 20030127734 - Lee, Jin-Yuan ; et al. | 2003-07-10 |
| Cylindrical bonding structure and method of manufacture App 20030129822 - Lee, Jin-Yuan ; et al. | 2003-07-10 |
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