Kuo; Han-Hsin
Patent Applications and Registrations
Patent applications and USPTO patent grants for Kuo; Han-Hsin.The latest application filed is for "interconnect structure for semiconductor devices".
- Kuo; Han-Hsin - Tainan TW
- Kuo; Han-Hsin - Tainan City TW
| Patent | Date |
|---|---|
| Interconnect structure for semiconductor devices Grant 10,062,645 - Kuo , et al. August 28, 2 | 2018-08-28 |
| Interconnect Structure for Semiconductor Devices App 20170278785 - Kuo; Han-Hsin ; et al. | 2017-09-28 |
| Brush cleaning method Grant 9,723,915 - Huang , et al. August 8, 2 | 2017-08-08 |
| Interconnect structure for semiconductor devices Grant 9,679,848 - Kuo , et al. June 13, 2 | 2017-06-13 |
| Mechanisms for removing debris from polishing pad Grant 9,630,295 - Peng , et al. April 25, 2 | 2017-04-25 |
| Interconnect Structure for Semiconductor Devices App 20170018496 - Kuo; Han-Hsin ; et al. | 2017-01-19 |
| Interconnect structure for semiconductor devices Grant 9,460,997 - Kuo , et al. October 4, 2 | 2016-10-04 |
| Method of fabricating a semiconductor device, and chemical mechanical polish tool Grant 9,370,854 - Kuo , et al. June 21, 2 | 2016-06-21 |
| Metal conductor chemical mechanical polish Grant 9,368,452 - Huang , et al. June 14, 2 | 2016-06-14 |
| Interconnects for semiconductor devices Grant 9,305,880 - Huang , et al. April 5, 2 | 2016-04-05 |
| Reduction of OCD measurement noise by way of metal via slots Grant 9,252,060 - Tsai , et al. February 2, 2 | 2016-02-02 |
| Brush Cleaning Method App 20150335146 - HUANG; Fu-Ming ; et al. | 2015-11-26 |
| Brush cleaning system Grant 9,119,464 - Huang , et al. September 1, 2 | 2015-09-01 |
| Interconnect Structure for Semiconductor Devices App 20150187697 - Kuo; Han-Hsin ; et al. | 2015-07-02 |
| Method Of Fabricating A Semiconductor Device, And Chemical Mechanical Polish Tool App 20150132948 - Kuo; Han-Hsin ; et al. | 2015-05-14 |
| Interconnects For Semiconductor Devices App 20150115447 - HUANG; Fu-Ming ; et al. | 2015-04-30 |
| Apparatus And Method For Manufacturing A Semiconductor Wafer App 20150087208 - TSAI; CHI-MING ; et al. | 2015-03-26 |
| Mechanisms For Removing Debris From Polishing Pad App 20150024661 - PENG; He-Hui ; et al. | 2015-01-22 |
| Metal Conductor Chemical Mechanical Polish App 20140159243 - Huang; Soon-Kang ; et al. | 2014-06-12 |
| Metal conductor chemical mechanical polish Grant 8,673,783 - Kang , et al. March 18, 2 | 2014-03-18 |
| Reduction Of Ocd Measurement Noise By Way Of Metal Via Slots App 20130256659 - Tsai; Chi-Ming ; et al. | 2013-10-03 |
| Brush Cleaning System App 20130192634 - HUANG; Fu-Ming ; et al. | 2013-08-01 |
| Barrier layer for copper interconnect Grant 8,361,900 - Pan , et al. January 29, 2 | 2013-01-29 |
| Metal Conductor Chemical Mechanical Polish App 20120001262 - Kang; Huang Soon ; et al. | 2012-01-05 |
| Barrier Layer For Copper Interconnect App 20110256715 - PAN; Shing-Chyang ; et al. | 2011-10-20 |
| Method for copper surface smoothing Grant 7,091,126 - Kuo , et al. August 15, 2 | 2006-08-15 |
| Method of eliminating galvanic corrosion in copper CMP App 20060112971 - Kuo; Han-Hsin ; et al. | 2006-06-01 |
| ER cleaning composition and method App 20050170980 - Lu, Hsin-Hsien ; et al. | 2005-08-04 |
| Method for copper surface smoothing App 20040214441 - Kuo, Han-Hsin ; et al. | 2004-10-28 |
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