KUO; Darryl

Patent Applications and Registrations

Patent applications and USPTO patent grants for KUO; Darryl.The latest application filed is for "semiconductor component having through-silicon vias".

Company Profile

3.6.6

KUO; Darryl - Hsinchu City TW
Kuo; Darryl - Hsinchu TW

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Semiconductor Component Having Through-silicon Vias App 20210005515 - YU; Chen-Hua ; et al.	2021-01-07
Method of making a semiconductor component having through-silicon vias Grant 10,784,162 - Yu , et al. Sept	2020-09-22
Method Of Making A Semiconductor Component Having Through-silicon Vias App 20190067107 - YU; Chen-Hua ; et al.	2019-02-28
Semiconductor component having through-silicon vias and method of manufacture Grant 10,115,634 - Yu , et al. October 30, 2	2018-10-30
Semiconductor Component Having Through-silicon Vias And Method Of Manufacture App 20160329245 - YU; Chen-Hua ; et al.	2016-11-10
Semiconductor component having through-silicon vias and method of manufacture Grant 9,418,923 - Yu , et al. August 16, 2	2016-08-16
Semiconductor Component Having Through-silicon Vias And Method Of Manufacture App 20140015146 - YU; Chen-Hua ; et al.	2014-01-16
Through-silicon vias for semicondcutor substrate and method of manufacture Grant 8,575,725 - Yu , et al. November 5, 2	2013-11-05
Through-silicon Vias For Semicondcutor Substrate And Method Of Manufacture App 20130193578 - YU; Chen-Hua ; et al.	2013-08-01
Through-silicon vias for semicondcutor substrate and method of manufacture Grant 8,487,410 - Yu , et al. July 16, 2	2013-07-16
Through-silicon Vias For Semicondcutor Substrate And Method Of Manufacture App 20120261827 - YU; Chen-Hua ; et al.	2012-10-18

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