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name:-0.0040349960327148
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Kuo; Ching-Chi Patent Filings

Kuo; Ching-Chi

Patent Applications and Registrations

Patent applications and USPTO patent grants for Kuo; Ching-Chi.The latest application filed is for "printed circuit board assembly and assembling method thereof".

Company Profile
5.4.4
  • Kuo; Ching-Chi - Taoyuan TW
  • Kuo; Ching-Chi - Taoyuan City TW
  • Kuo; Ching-Chi - Taoyuan Hsien TW
  • Kuo; Ching-Chi - Danville CA
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Printed circuit board assembly and assembling method thereof
Grant 10,568,207 - Kuo , et al. Feb
2020-02-18
Printed circuit board assembly and assembling method thereof
Grant 10,568,206 - Kuo , et al. Feb
2020-02-18
Printed circuit board assembly and assembling method thereof
Grant 10,321,565 - Kuo , et al.
2019-06-11
Printed Circuit Board Assembly And Assembling Method Thereof
App 20190166692 - Kuo; Ching-Chi ;   et al.
2019-05-30
Printed Circuit Board Assembly And Assembling Method Thereof
App 20190150281 - Kuo; Ching-Chi ;   et al.
2019-05-16
Printed Circuit Board Assembly And Assembling Method Thereof
App 20180352655 - Kuo; Ching-Chi ;   et al.
2018-12-06
Circuit Module And Manufacturing Process Thereof
App 20080032523 - Kuo; Ching-Chi
2008-02-07
Foam filled honeycomb and methods for their production
Grant 5,338,594 - Wang , et al. August 16, 1
1994-08-16

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