Kuo; Chin-Te

Patent Applications and Registrations

Patent applications and USPTO patent grants for Kuo; Chin-Te.The latest application filed is for "method for preparing semiconductor device structure with conductive plugs of different aspect ratios and manganese-containing linling layer".

Company Profile

2.12.17

Kuo; Chin-Te - New Taipei TW
KUO; CHIN-TE - NEW TAIPEI CITY TW
Kuo, Chin-Te - Taipei TW

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Semiconductor device with EMI protection structure and method for fabricating the same Grant 11,417,608 - Kuo August 16, 2	2022-08-16
Semiconductor structure having air gap dielectric Grant 11,417,726 - Kuo August 16, 2	2022-08-16
Method For Preparing Semiconductor Device Structure With Conductive Plugs Of Different Aspect Ratios And Manganese-containing Linling Layer App 20220238452 - KUO; CHIN-TE	2022-07-28
Semiconductor Device Structure With Conductive Plugs Of Different Aspect Ratios And Manganese-containing Linling Layer And Method For Preparing The Same App 20220157734 - KUO; Chin-Te	2022-05-19
Method For Fabricating Semiconductor Device With Emi Protection Structure App 20220084956 - KUO; CHIN-TE	2022-03-17
Method For Preparing Semiconductor Device Structure With Air Gap App 20220037331 - KUO; CHIN-TE	2022-02-03
Semiconductor device structure with air gap and method for preparing the same Grant 11,217,591 - Kuo January 4, 2	2022-01-04
Semiconductor Device With Emi Protection Structure And Method For Fabricating The Same App 20210327821 - KUO; Chin-Te	2021-10-21
Method for manufacturing a semiconductor structure Grant 11,049,715 - Kuo June 29, 2	2021-06-29
Semiconductor Structure Having Air Gap Dielectric App 20210134946 - KUO; Chin-Te	2021-05-06
Semiconductor Device Structure With Air Gap And Method For Preparing The Same App 20210118887 - KUO; Chin-Te	2021-04-22
Semiconductor structure having air gap dielectric and method of preparing the same Grant 10,957,760 - Kuo March 23, 2	2021-03-23
Semiconductor Structure Having Air Gap Dielectric And Method Of Preparing The Same App 20210050413 - KUO; Chin-Te	2021-02-18
Method For Manufacturing A Semiconductor Structure App 20200365390 - KUO; Chin-Te	2020-11-19
Method for forming trench MOS structure Grant 9,093,471 - Kuo , et al. July 28, 2	2015-07-28
Method For Forming Trench Mos Structure App 20150064893 - Kuo; Chin-Te ; et al.	2015-03-05
Trench MOS structure and method for forming the same Grant 8,912,595 - Kuo , et al. December 16, 2	2014-12-16
MOS test structure, method for forming MOS test structure and method for performing wafer acceptance test Grant 8,816,715 - Kuo , et al. August 26, 2	2014-08-26
Trench MOS structure and method for making the same Grant 8,692,318 - Kuo , et al. April 8, 2	2014-04-08
Test Layout Structure App 20120298992 - Kuo; Chin-Te ; et al.	2012-11-29
Trench Mos Structure And Method For Making The Same App 20120286352 - Kuo; Chin-Te ; et al.	2012-11-15
Mos Test Structure, Method For Forming Mos Test Structure And Method For Performing Wafer Acceptance Test App 20120286819 - Kuo; Chin-Te ; et al.	2012-11-15
Trench Mos Structure And Method For Forming The Same App 20120286353 - Kuo; Chin-Te ; et al.	2012-11-15
Protuberant Structure And Method For Making The Same App 20120288683 - Kuo; Chin-Te ; et al.	2012-11-15
Protuberant Structure And Method For Making The Same App 20120286402 - Kuo; Chin-Te ; et al.	2012-11-15
Method of forming single sided conductor and semiconductor device having the same App 20050130066 - Kuo, Chin-Te ; et al.	2005-06-16

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