KUO; Chin-Chia
Patent Applications and Registrations
Patent applications and USPTO patent grants for KUO; Chin-Chia.The latest application filed is for "backside diode design".
- KUO; Chin-Chia - Tainan City TW
- Kuo; Chin-Chia - Tainan TW
- Kuo; Chin-Chia - Austin TX
| Patent | Date |
|---|---|
| Backside Diode Design App 20220278161 - HUANG; Kuo-Chin ; et al. | 2022-09-01 |
| Device Crack-stop Structure To Prevent Damage Due To Dicing Crack App 20220246549 - Wu; Tung-Ting ; et al. | 2022-08-04 |
| Trench Isolation Structure For Image Sensors App 20220231066 - Huang; Cheng Yu ; et al. | 2022-07-21 |
| Device crack-stop structure to prevent damage due to dicing crack Grant 11,348,881 - Wu , et al. May 31, 2 | 2022-05-31 |
| Method Of Forming Semiconductor Device App 20210366843 - Chang; Wei-Hsuan ; et al. | 2021-11-25 |
| Semiconductor Devices For Image Sensing App 20210351218 - Kuo; Chin-Chia ; et al. | 2021-11-11 |
| Semiconductor device and forming method thereof Grant 11,114,390 - Chang , et al. September 7, 2 | 2021-09-07 |
| Semiconductor devices for image sensing Grant 11,075,242 - Kuo , et al. July 27, 2 | 2021-07-27 |
| Semiconductor Device And Forming Method Thereof App 20210217705 - Chang; Wei-Hsuan ; et al. | 2021-07-15 |
| Device Crack-stop Structure To Prevent Damage Due To Dicing Crack App 20210098392 - Wu; Tung-Ting ; et al. | 2021-04-01 |
| High-voltage device and method for fabricating the same Grant 10,468,494 - Lin , et al. No | 2019-11-05 |
| High-voltage Device And Method For Fabricating The Same App 20190252513 - Lin; Chih-Mou ; et al. | 2019-08-15 |
| Semiconductor Devices For Image Sensing App 20190165026 - Kuo; Chin-Chia ; et al. | 2019-05-30 |
| High voltage MOS structure and its manufacturing method Grant 10,141,398 - Tsai , et al. Nov | 2018-11-27 |
| Semiconductor structure for preventing generation of void and method for manufacturing the same Grant 10,068,793 - Kuo , et al. September 4, 2 | 2018-09-04 |
| Macroblock cache Grant 7,965,773 - Schlanger , et al. June 21, 2 | 2011-06-21 |
| Method to improve post wafer etch cleaning process Grant 6,928,748 - Chen , et al. August 16, 2 | 2005-08-16 |
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