Kuo; Chester

Patent Applications and Registrations

Patent applications and USPTO patent grants for Kuo; Chester.The latest application filed is for "hot spot identification, inspection, and review".

Company Profile

0.8.8

Kuo; Chester - Taipei TW
KUO; Chester - Hsinchu TW
KUO; Chester - Hukou TW
Kuo; Chester - Hsinchu County TW
Kuo; Chester - Taipei Hsien TW
KUO; CHESTER - Taipei City TW
KUO; CHESTER - Tu-Cheng TW

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Hot spot identification, inspection, and review Grant 9,330,987 - Lin , et al. May 3, 2	2016-05-03
Hot Spot Identification, Inspection, and Review App 20150069232 - Lin; Steve ; et al.	2015-03-12
Flip-chip Semiconductor Optoelectronic Device And Method For Fabricating The Same App 20130248922 - KUO; Chester ; et al.	2013-09-26
Method for fabricating a flip-chip semiconductor optoelectronic device Grant 8,470,621 - Kuo , et al. June 25, 2	2013-06-25
Photoelectric device Grant 8,384,113 - Kuo , et al. February 26, 2	2013-02-26
Photoelectric Device, Method Of Fabricating The Same And Packaging Apparatus For The Same App 20120068216 - KUO; Chester ; et al.	2012-03-22
Photoelectric device, method of fabricating the same and packaging apparatus for the same Grant 8,093,078 - Kuo , et al. January 10, 2	2012-01-10
Side-emitting LED package and manufacturing method of the same Grant 8,089,089 - Kuo , et al. January 3, 2	2012-01-03
Photoelectric Device, Method Of Fabricating The Same And Packaging Apparatus For The Same App 20110068358 - Kuo; Chester ; et al.	2011-03-24
Flip-chip Semiconductor Optoelectronic Device And Method For Fabricating The Same App 20100230711 - KUO; CHESTER ; et al.	2010-09-16
Side-emitting Led Package And Manufacturing Method Of The Same App 20100213487 - KUO; CHESTER ; et al.	2010-08-26
Package Module Structure Of Compound Semiconductor Devices And Fabricating Method Thereof App 20100096746 - TSENG; WEN LIANG ; et al.	2010-04-22
Single chip with multi-LED Grant 7,586,129 - Hsu , et al. September 8, 2	2009-09-08
Single chip with multi-LED App 20070131958 - Hsu; Chih Peng ; et al.	2007-06-14

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