Kuo; Che-Hung
Patent Applications and Registrations
Patent applications and USPTO patent grants for Kuo; Che-Hung.The latest application filed is for "ball pad design for semiconductor packages".
- Kuo; Che-Hung - Hsinchu City TW
- Kuo; Che-Hung - Tainan City TW
- Kuo; Che-Hung - Tainan TW
| Patent | Date |
|---|---|
| Ball Pad Design For Semiconductor Packages App 20220246508 - Yen; Chiang-Lin ; et al. | 2022-08-04 |
| Semiconductor Package Structure App 20220223512 - KUO; Che-Hung ; et al. | 2022-07-14 |
| Semiconductor Package Structure App 20220223491 - KUO; Che-Hung ; et al. | 2022-07-14 |
| Land-side Silicon Capacitor Design And Semiconductor Package Using The Same App 20220130814 - Kuo; Che-Hung ; et al. | 2022-04-28 |
| Semiconductor Package Structure App 20220013441 - LIU; Hsing-Chih ; et al. | 2022-01-13 |
| Via Array Design For Multi-layer Redistribution Circuit Structure App 20210351124 - Kuo; Che-Hung ; et al. | 2021-11-11 |
| Semiconductor Device App 20210193540 - Chen; Nan-Cheng ; et al. | 2021-06-24 |
| Semiconductor Package Having Discrete Antenna Device App 20210036405 - Han; Fu-Yi ; et al. | 2021-02-04 |
| Semiconductor package having discrete antenna device Grant 10,847,869 - Han , et al. November 24, 2 | 2020-11-24 |
| Semiconductor package structure and method for forming the same Grant 10,636,773 - Kuo , et al. | 2020-04-28 |
| Semiconductor package assembly with passive device Grant 10,497,678 - Kuo , et al. De | 2019-12-03 |
| Semiconductor package assembly Grant 10,468,341 - Liu , et al. No | 2019-11-05 |
| Semiconductor Package Assembly App 20190131233 - LIU; Nai-Wei ; et al. | 2019-05-02 |
| Semiconductor package assembly Grant 10,199,318 - Liu , et al. Fe | 2019-02-05 |
| Semiconductor Package Having Discrete Antenna Device App 20180358685 - Han; Fu-Yi ; et al. | 2018-12-13 |
| Semiconductor Device App 20180102298 - Chen; Nan-Cheng ; et al. | 2018-04-12 |
| Pre-bumped Redistribution Layer Structure And Semiconductor Package Incorporating Such Pre-bumped Redistribution Layer Structure App 20180053665 - Kuo; Che-Hung ; et al. | 2018-02-22 |
| Semiconductor Package Assembly With Passive Device App 20180033774 - KUO; Che-Hung ; et al. | 2018-02-01 |
| Semiconductor Package Assembly App 20170338175 - LIU; Nai-Wei ; et al. | 2017-11-23 |
| Semiconductor package assembly with passive device Grant 9,818,727 - Kuo , et al. November 14, 2 | 2017-11-14 |
| Semiconductor Package Structure And Method For Forming The Same App 20170084589 - KUO; Che-Hung ; et al. | 2017-03-23 |
| Semiconductor Package Assembly With Passive Device App 20160268233 - KUO; Che-Hung ; et al. | 2016-09-15 |
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